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2026-06-04
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2026-06-04
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2026-06-04
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2026-06-04
New Electronics
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Neil Tyler
04 Jun 2026
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Reshaping the technology landscape in Europe
FAMES pilot line aims to strengthen Europe’s semiconductor capabilities
Siemens signs agreement to support European chip design initiative
European Chips Act 2.0 embraces a long-term industrial
2026-06-04
www.eenewseurope.com
2026-06-04
eeNews Europe
JEDEC has released two new guideline documents aimed at supporting the growing use of silicon carbide (SiC) power semiconductors in applications ranging from electric vehicles to industrial power systems. The publications, JEP203 and JEP204, were developed by the JC-70.2 Silicon Carbide Subcommittee and are available as free downloads from the JEDEC website.
2026-06-04
news.google.com
2026-06-04
New Electronics
2026-06-04
www.newelectronics.co.uk
2026-06-04
New Electronics
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Neil Tyler
04 Jun 2026
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LMT IoT and Infineon partner to support development of connected edge AI devices
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LMT IoT and Infineon Technologies have announced a new partnership aimed at helping startups and product companies accelerate the development and deployment of connected edge arti
2026-06-04
www.electronicsweekly.com
2026-06-04
Electronics Weekly
Chips Act II proposed – much like Chips Act 1
The EU has proposed a Chips Act II which will give the Commission power to invest directly in new EU-based fabs instead of requiring companies to apply for subsidies.
The EU has now acknowledged that Chips Act I will not double Europe’s world market share by 2030 as intended.
Chips Act II is looking at a spend of $139 billion in public-private inves
2026-06-04
samueli.ucla.edu
2026-06-04
UCLA Samueli School of Engineering
UCLA Joins New Southwest Semiconductor Workforce Consortium to Expand Hands-On Microelectronics Training
Claudia Valdivieso-Defaz/CNSI
The new regional initiative will build on UCLA’s existing workforce development efforts to strengthen the semiconductor and microelectronics talent pipeline across the Southwest.
Jun 3, 2026
Originally posted on CNSI Newsroom
UCLA is joining a major new regio
2026-06-04
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2026-06-04
01net
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2026-06-04
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2026-06-04
Quiver Quantitative
Sector Reaction: Social media participants observed a notable pullback in Applied Optoelectronics shares after NVIDIA leadership suggested extended use of copper in data centers. Analysts on the platform clarified that the remarks addressed supply sequencing rather than a shift away from optics. They pointed to NVIDIA's own investments in related firms as evidence of ongoing commitment to the opti
2026-06-03
www.standard-journal.com
2026-06-03
standard-journal.com
AP
JEDEC® Releases New SiC Guidelines to Improve Reliability and Evaluation in Power Electronics
Business Wire 9 hrs ago 0
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ARLINGTON, Va.--(BUSINESS WIRE)--Jun 3, 2026--
JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, announced the publication of JEP
2026-06-03
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2026-06-03
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2026-06-03
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2026-06-03
Yahoo Finance
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2026-06-03
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2026-06-03
Yahoo Finance UK
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2026-06-03
bioengineer.org
2026-06-03
Bioengineer.org
The Fraunhofer Institute for Applied Solid State Physics (IAF) has unveiled a groundbreaking advancement in electric vehicle (EV) power electronics with the development of a gallium nitride (GaN)-based power electronics module tailored for 800 V bidirectional direct current (DC) charging systems. This innovative module, realized within the GaN4EmoBiL project—an initiative funded by the German Fede
2026-06-03
www.eurekalert.org
2026-06-03
EurekAlert!
NEWS RELEASE 3-JUN-2026
GaN power electronics for bidirectional, single-phase DC electric vehicle charging
Fraunhofer IAF presents innovations at PCIM 2026
Reports and Proceedings
FRAUNHOFER INSTITUTE FOR APPLIED SOLID STATE PHYSICS
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IMAGE:
DEMONSTRATOR OF A BIDIRECTIONAL SINGLE-PHASE 3-KW DC CHARGER WITH GAN POWER ELECTRONICS. RESE
2026-06-03
www.bisinfotech.com
2026-06-03
Bisinfotech
Home/ Semiconductor Component/ Power Electronics/ AC-DC / DC-DC / Converters/TDK presents DC-link capacitors with ultra-low inductance for SiC-based power electronics
TDK presents DC-link capacitors with ultra-low inductance for SiC-based power electronics
Vaishali Chauhan June 3, 2026
2 minutes read
TDK Corporation presents the B25696H series of MKP DC high-frequency (HF) film capacitors, a
2026-06-03
www.electronicsforyou.biz
2026-06-03
Electronics For You BUSINESS
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Texas Instruments Names Julie Knecht as Next CFO
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Nikita Kumari
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Julie Knecht
June 3, 2026
With more than two decades at the company, Knecht is set to lead financial operations during a key growth period.
Texas Instruments has appointed Julie Knecht as its new Chief Financial Officer, succeeding Rafael Lizardi, who will retire after 25 years with the analog
2026-06-03
www.electronicsforyou.biz
2026-06-03
Electronics For You BUSINESS
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2026-06-03
www.newelectronics.co.uk
2026-06-03
New Electronics
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Neil Tyler
03 Jun 2026
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Cadence introduces autonomous AI engineer for chip design workflows
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2 mins read
Cadence Design Systems has announced a new autonomous artificial intelligence (AI) system for semiconductor design, describing it as the industr
2026-06-02
www.electronicsforyou.biz
2026-06-02
Electronics For You BUSINESS
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