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2026-05-29
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2026-05-29
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2026-05-29
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2026-05-29
Reuters
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2026-05-29
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2026-05-29
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2026-05-28
www.mymalonetelegram.com
2026-05-28
The Malone Telegram
Future Electronics Features Infineon CoolGaN™ Transistors & GaN-Based Solutions for Humanoid Robotics
59 mins ago
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Future Electronics, a global leader in electronic components distribution, is highlighting Infineon Technologies AG CoolGaN™ transistors and GaN-based solutions engineered to support the growing demands of huma
2026-05-28
digitimes.com
2026-05-28
Samsung Electronics is preparing to expand its foundry push into physical AI semiconductors through a chiplet platform developed with Cadence, targeting chips for robotics, automotive systems, drones, and industrial automation, ETNewsreported, citing industry sources.
2026-05-28
www.newelectronics.co.uk
2026-05-28
New Electronics
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Neil Tyler
28 May 2026
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2026-05-27
www.newelectronics.co.uk
2026-05-27
New Electronics
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Neil Tyler
27 May 2026
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STMicroelectronics introduces 700V GaN devices to improve power efficiency
Product Launches
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STMicroelectronics has launched a new range of gallium nitride (GaN)-based power semiconductors aimed at improving energy efficiency and power dens
2026-05-27
www.newelectronics.co.uk
2026-05-27
New Electronics
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Neil Tyler
27 May 2026
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ROHM unveils 5th-generation SiC MOSFETs with improved high-temperature efficiency
Microchip increases hydrogen maser production with new Alabama facility
Microchip compact crystal oscillator intended for high-stability timing applications
Microchip unveils 3.3 kV SiC power modules for high-voltag
2026-05-27
digitimes.com
2026-05-27
Samsung Electronics' 2026 tentative labor-management agreement is expected to pass after already surpassing an 86% voting participation rate within just three days. While the agreement has temporarily eased concerns over potential strikes, South Korea's semiconductor industry is increasingly worried that the newly expanded performance bonus structure, which guarantees employees a fixed percentage
2026-05-27
digitimes.com
2026-05-27
Printed circuit board (PCB) drill bit manufacturer Topoint Technology approved a private placement of unsecured convertible corporate bonds with a maximum issuance amount of NT$600 million (approx. US$19.10 million) at its shareholders' meeting on May 26. The company also welcomed Unimicron Technology, Gold Circuit Electronics (GCE), and Zhen Ding Technology Group (ZDT) as strategic investors.
2026-05-27
digitimes.com
2026-05-27
Kinpo Electronics outlined its 2026 core strategy at a shareholders' meeting on May 25, centering on "bearing fruit" as it builds on years of product-mix adjustments, expands into AI-related products, and accelerates its shift toward an ODM model.
2026-05-27
digitimes.com
2026-05-27
Samsung Electronics' tentative 2026 wage agreement has cleared a union vote with 73.7% approval, moving a months-long labor dispute closer to settlement while exposing a deeper divide between workers in the company's chip and consumer electronics businesses, according to Korean media reports.
2026-05-27
digitimes.com
2026-05-27
Samsung Electronics plans to invest VND39 trillion (approx. US$1.5 billion) in a new semiconductor testing facility in northern Vietnam, according to documents reviewed by Reuters,marking the company's first chip testing plant in the country as global memory demand surges amid the AI boom.
2026-05-26
newsroom.st.com
2026-05-26
STMicroelectronics
700V PowerGaN devices improve energy efficiency and enable more compact power designs for AI servers, robotics, industrial systems and advanced consumer applications including home appliances
Alexander Jurman
Technical Media Relations
Tel. +420602748611
alexander.jurman@st.com
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New gallium nitride (GaN)-based power semicondu
2026-05-26
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2026-05-26
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2026-05-26
www.electronicsweekly.com
2026-05-26
Electronics Weekly
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2026-05-26
www.electronicsweekly.com
2026-05-26
Electronics Weekly
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2026-05-26
www.electronicsweekly.com
2026-05-26
Electronics Weekly
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2026-05-26
digitimes.com
2026-05-26
Kioxia is targeting 2027 production of its 10th-generation BiCS 10 NAND, a move that could help the Japanese memory maker narrow its technology gap with Samsung Electronics and SK Hynix as the South Korean rivals delay investment in their own next-generation NAND technologies, according to ZDNet Korea.