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Trending Technologies
EUV85 3nm66 DRAM31 AI27 HBM27 GPU23 AI chips15 memory chips15 AI infrastructure13 AI accelerators8 NAND flash8 advanced packaging6 CUDA6 semiconductor6 IoT5
2026-05-22
UCLA Samueli School of Engineering launches $125 million semiconductor hub with top industry leaders - Newsroom | UCLA
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newsroom.ucla.edu 2026-05-22 Newsroom | UCLA
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2026-05-22
UCLA Samueli School of Engineering Launches $125 Million Semiconductor Hub With Top Industry Leaders - UCLA Samueli School of Engineering
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samueli.ucla.edu 2026-05-22 UCLA Samueli School of Engineering
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2026-05-22
Intel's foundry reset: 14A, 10A and tougher engineering rules - digitimes
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www.digitimes.com 2026-05-22 digitimes
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2026-05-21
With Chiplets, What Role Does Economics Play? - Semiconductor Engineering
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semiengineering.com 2026-05-21 Semiconductor Engineering
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2026-05-21
Low-Temp Solders Are Suddenly Critical For Chiplets And Photonics - Semiconductor Engineering
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semiengineering.com 2026-05-21 Semiconductor Engineering
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2026-05-21
Enabling Production-Ready AI For Semiconductor Manufacturing - Semiconductor Engineering
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semiengineering.com 2026-05-21 Semiconductor Engineering
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2026-05-21
Four-Tier Memory Hierarchy for LLM Reasoning (USC, UW) - Semiconductor Engineering
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semiengineering.com 2026-05-21 Semiconductor Engineering
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2026-05-20
Quantinuum and Synopsys Partner to Integrate Quantum Algorithms into Engineering Simulation Workflows - Quantum Computing Report
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news.google.com 2026-05-20 Quantum Computing Report
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2026-05-19
NoMIS joins ARPA-E project on high-voltage SiC HVDC - Engineering.com
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www.engineering.com 2026-05-19 Engineering.com
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2026-05-19
Evaluating and Calibrating Performance On RISC-V Vector Processors (KTH, LLNL, BSC) - Semiconductor Engineering
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semiengineering.com 2026-05-19 Semiconductor Engineering
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2026-05-14
Chiplets Need A New Workflow - Semiconductor Engineering
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semiengineering.com 2026-05-14 Semiconductor Engineering
Key Takeaways:Chiplet design turns semiconductor development into a system-level problem, requiring coordinated workflows across design, packaging, verification, test, and reliability.Successful chiplet workflows must handle multi-physics challenges — especially thermal, mechanical, power, and signal integrity — early enough to reduce costly failures before assembly and tape-out.AI is beginning to
ChipletsSystem-level designAdvanced packagingMulti-physics simulationAI in semiconductor designThermal managementSignal integrityMechanical integrity
2026-05-14
Chiplets Need A New Workflow
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semiengineering.com 2026-05-14 Ann Mutschler
Multi-die assemblies are facing full system-level challenges, but engineering teams nee...
ChipletsSystem-level designAdvanced packagingMulti-physics simulationAI in chip designReliability engineeringDesign flow2.5D/3D architecture
2026-05-14
From USC to Big Tech: Apple, Amazon, Nvidia Among Top Employers of USC Engineering Alumni, New Data Shows - USC Viterbi School of Engineering
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viterbischool.usc.edu 2026-05-14 USC Viterbi School of Engineering
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2026-05-12
HW-Based Image Generation Using FTJs (SNU, Sungkyunkwan U., SK hynix et al.) - Semiconductor Engineering
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semiengineering.com 2026-05-12 Semiconductor Engineering
A new technical paper, “CMOS-compatible ferroelectric tunnel junctions integrate stochastic sampling and deterministic computing for image generation,” was published by researchers at Seoul National University, Sungkyunkwan University, Hanyang University, Sogang University, and SK Hynix.Abstract“Recent progress in generative modeling has intensified the need for compact, energy-efficient hardware
Image GenerationFerroelectric Tunnel JunctionsCMOS CompatibleGenerative AIHardware AccelerationStochastic SamplingDeterministic ComputingStorage Computing
2026-05-12
PULSE technology Archives - Semiconductor Engineering
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news.google.com 2026-05-12 Semiconductor Engineering
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2026-05-12
HBM Shifts Testing Left To Preserve AI Chip Yield - Semiconductor Engineering
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semiengineering.com 2026-05-12 Semiconductor Engineering
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2026-05-11
Chip Industry Technical Paper Roundup: May 11 - Semiconductor Engineering
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semiengineering.com 2026-05-11 Semiconductor Engineering
New technical papers recently added to Semiconductor Engineering’s library:Technical PaperResearch OrganizationsSource-position-dependent transmission cross coefficient formula including polarization and mask three-dimensional effects in High NA EUV🔗Science TokyoPerformance and Energy Benefits of MRDIMMs🔗Barcelona Supercomputing Center,UPC,Micron,IntelEnergAIzer: Fast and Accurate GPU Power Estima
EUV LithographyHigh NAGPU Power EstimationAI WorkloadsRISC-VChip Design ValidationMulti-Chip Interconnect3D Packaging
2026-05-09
NVIDIA Co-Founders Donate IEEE Prize Money For Engineering Education - Forbes
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www.forbes.com 2026-05-09 Forbes
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2026-05-08
NVIDIA and Corning expand U.S. optical manufacturing - Engineering.com
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www.engineering.com 2026-05-08 Engineering.com
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2026-05-07
Securing Chiplet-Based Platforms: Distributed Trust With Centralized Authority - Semiconductor Engineering
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semiengineering.com 2026-05-07 Semiconductor Engineering
Submit SUBSCRIBE Chinese (Simplified) English HOME SYSTEMS & DESIGN LOW POWER - HIGH PERFORMANCE MANUFACTURING, PACKAGING & MATERIALS TEST, MEASUREMENT & ANALYTICS AUTO, SECURITY & EDGE AI SPECIAL REPORTS BUSINESS & STARTUPS JOBS KNOWLEDGE CENTER TECHNICAL PAPERS EVENTS & WEBINARS VIDEOS & RESEARCH NEWSLETTERS & STORE AUTO, SECURITY & EDGE AI SPONSOR BLOG Securing Chiplet-Based Platforms: Dist
ChipletsSecurity ModelDistributed TrustCentralized AuthorityHardware SecuritySystem IntegrationTrusted ComputingSemiconductor Design