Semiconductor News & Analysis Feed
1135 articles
2026-05-26
www.marketbeat.com
2026-05-26
MarketBeat
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2026-05-26
news.google.com
2026-05-26
MarketBeat
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2026-05-26
www.marketbeat.com
2026-05-26
MarketBeat
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2026-05-26
www.ad-hoc-news.de
2026-05-26
AD HOC NEWS
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2026-05-26
www.koreaherald.com
2026-05-26
The Korea Herald
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2026-05-26
www.koreaherald.com
2026-05-26
The Korea Herald
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2026-05-26
www.koreaherald.com
2026-05-26
The Korea Herald
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2026-05-26
vir.com.vn
2026-05-26
Vietnam Investment Review - VIR
SEOUL, South Korea, May 26, 2026 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today the launch of the iHBM solution that embeds integrated cooling elements(ICEs)[1] within the high-bandwidth memory(HBM) package for next-generation HBM products.
[1] ICE(Integrated Cooling Elements): A cooling element made of electrically non-conductive, thermally conductive silicon-b
2026-05-26
www.digitimes.com
2026-05-26
digitimes
Grace Wang, vice president and general manager of ASML in Taiwan, said that ASML plans to deploy extreme ultraviolet (EUV) and next-generation high numerical aperture (high-NA) EUV technologies to reduce energy consumption per wafer at the process level,...
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2026-05-26
www.heygotrade.com
2026-05-26
Gotrade
AI Chip Rally Broadens: Nvidia, ASICs, ARM, Astera Surge
Rendy Andriyanto
Gotrade Team
26 Mei 2026
Reviewed by Gotrade Internal Analyst
Table of Contents
Key Takeaways
ASIC Demand Catches Up To GPUs
ARM And Astera Labs Extend The Rally
Risks To The Bull Case
Sources
Gotrade News - The AI chip rally broadened this week as Nvidia, Broadcom, ARM, and Astera Labs all logged sharp gains. Nvidia hit an
2026-05-26
www.tradingview.com
2026-05-26
TradingView
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2026-05-26
www.prnewswire.com
2026-05-26
PR Newswire
AIC to Showcase Next-Generation AI Infrastructure and Host Strategic Panel with NVIDIA and VAST Data at COMPUTEX 2026 Deutschland - English
VOM NACHRICHTENDIENST
AIC
26 Mai, 2026, 02:18 GMT
ARTIKEL TEILEN
TAIPEI, May 26, 2026 /PRNewswire/ -- AIC, a leading provider of AI storage and computing solutions, is proud to announce its participation in COMPUTEX 2026. From June 2 to June 5, AIC
2026-05-26
www.asiae.co.kr
2026-05-26
아시아경제
Equipped with Cooling Component (ICE) Inside HBM Package
Over 30% Reduction in Thermal Resistance
Proven MR-MUF Process Applied
Amid the artificial intelligence (AI) boom, a game-changer has emerged to tackle the biggest challenge in semiconductor high-density integration: the 'heat generation' issue.
On May 26, SK hynix unveiled its next-generation memory technology, 'iHBM,' which maximize
2026-05-26
www.asiae.co.kr
2026-05-26
아시아경제
Equipped with Cooling Component (ICE) Inside HBM Package
Over 30% Reduction in Thermal Resistance
Proven MR-MUF Process Applied
Amid the artificial intelligence (AI) boom, a game-changer has emerged to tackle the biggest challenge in semiconductor high-density integration: the 'heat generation' issue.
On May 26, SK hynix unveiled its next-generation memory technology, 'iHBM,' which maximize
2026-05-26
digitimes.com
2026-05-26
South Korea and the Netherlands are looking to broaden their semiconductor partnership beyond ASML's EUV lithography machines, as silicon photonics (SiPh) emerges as a potential next field of cooperation amid rising power and bandwidth demands from AI data centers.
2026-05-26
digitimes.com
2026-05-26
Nvidia CEO Jensen Huang is pushing the company deeper into the CPU market, betting that the rise of agentic AI will create a new growth engine beyond the GPUs that made Nvidia the dominant supplier of AI computing hardware.
2026-05-26
digitimes.com
2026-05-26
Kioxia is targeting 2027 production of its 10th-generation BiCS 10 NAND, a move that could help the Japanese memory maker narrow its technology gap with Samsung Electronics and SK Hynix as the South Korean rivals delay investment in their own next-generation NAND technologies, according to ZDNet Korea.
2026-05-26
digitimes.com
2026-05-26
Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices as part of an end-to-end offering for AI chips, addressing rising demand for GenAI and high-performance computing for memory capacity, bandwidth, and energy efficiency. The firm said it is leveraging its combined lo
2026-05-26
digitimes.com
2026-05-26
Holy Stone Enterprise warns that AI-driven power upgrades are creating global shortages and record demand for multilayer ceramic capacitors (MLCCs), with lead times beyond 20 weeks and tighter supply expected through 2027. The developments could reshape supply chains for servers, data centers, and high-power consumer electronics worldwide, and accelerate global investment in components.
2026-05-26
digitimes.com
2026-05-26
Heat management has become a critical challenge as HBM technology advances, with higher stacking and faster speeds to meet surging global demand for AI data processing. Efficient control of power density in the die-to-die physical layer between HBM and GPUs is now central to next-generation HBM competitiveness and data center reliability.