Semiconductor News & Analysis Feed
110 articles
2026-06-15
www.ad-hoc-news.de
2026-06-15
AD HOC NEWS
2026-06-14
www.ad-hoc-news.de
2026-06-14
AD HOC NEWS
Infineon, DE0006231004
Infineon CoolMOS CFD7A: automotive MOSFET platform for 800 V powertrains
14.06.2026 - 17:31:32 | ad-hoc-news.de
Infineon’s CoolMOS CFD7A automotive-qualified superjunction MOSFET family targets 400 V and 800 V electric powertrains, combining low switching losses with robust short-circuit capability for on-board chargers and DC-DC converters.
Infineon - Stiller Moment vor d
2026-06-14
tomshardware.com
2026-06-14
Etiido Uko
State attorneys general have opened a broad investigation into OpenAI, subpoenaing documents on ads, user retention, data handling, minors, health data, model behavior, and safety policies.
2026-06-13
www.ad-hoc-news.de
2026-06-13
AD HOC NEWS
Infineon, DE0006231004
Infineon OptiMOS 8 100 V MOSFETs: Efficient power chips for motor drives and battery systems
12.06.2026 - 22:42:16 | ad-hoc-news.de
Infineon’s OptiMOS 8 100 V power MOSFET family targets brushless DC motor drives and battery protection with lower losses, compact packaging, and automotive-ready reliability for designers of e-mobility, power tools, and industrial equipment.
2026-06-12
www.ad-hoc-news.de
2026-06-12
AD HOC NEWS
Rohm, JP3982800009
Rohm SCT4013DLL 750 V SiC MOSFET: AI-ready power device for modern data centers
12.06.2026 - 15:54:08 | ad-hoc-news.de
Rohm's SCT4013DLL 750 V SiC MOSFET targets high-efficiency, high-voltage power stages in AI server battery backup units and industrial systems, combining low loss, compact packaging and robust reliability for demanding data center and power applications.
Rohm
2026-06-12
www.techinsights.com
2026-06-12
TechInsights
FinFET Transistors: Tracing the Path of Evolution
Discover how FinFET transistors have revolutionized semiconductor manufacturing with improved performance and efficiency, driving advancements in modern electronic devices.
FinFET transistors, or Fin Field Effect Transistors, have revolutionized advanced semiconductor manufacturing by replacing planar FET transistors, starting with Intel's 22nm t
2026-06-12
www.bisinfotech.com
2026-06-12
Bisinfotech
www.bisinfotech.com
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2026-06-12
www.eenewseurope.com
2026-06-12
eeNews Europe
ROHM has developed the TSC3PAK, a top-side cooling package for SiC MOSFETs aimed at high-voltage power conversion in electric vehicles and industrial systems. The 14.00 × 18.58 × 3.50 mm surface-mount package is designed to combine automated mounting with heat dissipation closer to conventional through-hole packages such as TO-247-4L.
2026-06-12
digitimes.com
2026-06-12
SK Hynix's latest fire at its Cheongju, South Korea, campus has again disrupted operations at a key memory-chip site and prompted evacuations of thousands of workers. The incident adds to a series of recent accidents, raising fresh safety concerns for semiconductor plants worldwide that depend on hazardous gases and chemicals.
2026-06-11
www.automotivepowertraintechnologyinternational.com
2026-06-11
Automotive Powertrain Technology International
ROHM has unveiled the TSC3PAK (14.00 x 18.58 x 3.50mm) cooling package for SiC MOSFETs, which adopts a top-side heat dissipation structure that places the heat dissipation surface on the top of the package, enabling automated mounting while achieving heat dissipation performance comparable to that of conventional through-hole packages (TO-247-4L). This contributes to greater efficiency and reliabi
2026-06-11
www.newelectronics.co.uk
2026-06-11
New Electronics
www.newelectronics.co.uk
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2026-06-11
blogs.nvidia.com
2026-06-11
NVIDIA Blog
For Robotaxis, Safety Must Be Built In, Not Bolted On
June 10, 2026 by Riccardo Mariani
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A car pulls up to the curb. The app says, “Your ride is here.” No one’s in the driver’s seat. For people who live in one of the dozens of cities now hosting robotaxi services, this is already a reality.
The robotaxi industry has moved from prototype milestones to commercial operations, with an expan
2026-06-11
blogs.nvidia.com
2026-06-11
NVIDIA Blog
For Robotaxis, Safety Must Be Built In, Not Bolted On
June 10, 2026 by Riccardo Mariani
0
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A car pulls up to the curb. The app says, “Your ride is here.” No one’s in the driver’s seat. For people who live in one of the dozens of cities now hosting robotaxi services, this is already a reality.
The robotaxi industry has moved from prototype milestones to commercial operations, with an expan
2026-06-10
www.semiconductor-today.com
2026-06-10
Semiconductor Today
Nexperia expands 650V industrial-grade high-power GaN FET portfolio
Discrete device designer and manufacturer Nexperia B.V. of Nijmegen, the Netherlands (which operates wafer fabs in Hamburg, Germany, and Hazel Grove Manchester, UK) has expanded its portfolio of 650V industrial-grade high-power gallium nitride (GaN) FETs for demanding power conversion applications. The portfolio includes devices
2026-06-10
www.semiconductor-today.com
2026-06-10
Semiconductor Today
ROHM has developed the TSC3PAK (14.00mm x 18.58mm x 3.50mm) package for silicon carbide (SiC) MOSFETs. Mass production began in June.
Picture: ROHM’s new top-side-cooling package for SiC MOSFETs.
By adopting a top-side heat dissipation structure that places the heat dissipation surface on the top of the package, the new product enables automated mounting while achieving heat dissipation performa
2026-06-10
www.manilatimes.net
2026-06-10
The Manila Times
KYOTO, Japan, June 10, 2026 /PRNewswire/ -- ROHM Co., Ltd. has developed the TSC3PAK (14.00 x 18.58 x 3.50 mm) package for SiC MOSFETs. By adopting a top-side heat dissipation structure that places the heat dissipation surface on the top of the package, the new product enables automated mounting while achieving heat dissipation performance comparable to that of conventional through-hole packages (
2026-06-10
www.thelec.net
2026-06-10
thelec.net
A sample interface of Elite Pairing Studio. (Source: onsemi website)
onsemi on June 8 unveiled an online design tool called Elite Pairing Studio that recommends combinations of silicon carbide (SiC) MOSFETs and gate drivers.
MOSFETs are power switches that control electrical current. Gate drivers are components that send switching signals to turn those power switches on and off. The two componen
2026-06-10
www.marketscreener.com
2026-06-10
marketscreener.com
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2026-06-09
investor.wolfspeed.com
2026-06-09
Wolfspeed
DURHAM, N.C.--(BUSINESS WIRE)-- Wolfspeed, an industry leader in silicon carbide, has introduced its fifth technology generation, demonstrating a substantial performance leap in efficiency for next-generation 1200 V and 750 V automotive and industrial applications.
“With Gen 4, Wolfspeed delivered the switching breakthrough our customers needed, and less than two years later we’re introducing Gen
2026-06-09
www.bisinfotech.com
2026-06-09
Bisinfotech
www.bisinfotech.com
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