Semiconductor News & Analysis Feed
6835 articles
2026-05-29
digitimes.com
2026-05-29
Cloud service providers' demand for application-specific integrated circuits, or ASICs, is increasingly locked in as advanced process nodes, advanced packaging, and component supply tighten worldwide. For readers across global tech markets, the shift means access to manufacturing capacity, not just chip design, is becoming the main determinant of who can supply the next wave of AI hardware.
2026-05-29
digitimes.com
2026-05-29
Samsung Electronics has started shipping samples of its latest high-bandwidth memory (HBM) chip, the 12-layer HBM4E, marking the industry's first delivery of the next-generation AI memory product, according to the company. The move underscores intensifying competition among memory suppliers as demand accelerates for higher-performance components used in AI computing systems.
2026-05-29
digitimes.com
2026-05-29
As AI moves from cloud environments into factories and physical systems, semiconductor design is being reshaped by new demands in speed, energy efficiency, and on-site learning. At a recent system-semiconductor seminar in South Korea, Seong-jun Jang, a research center director at the Korea Electronics Technology Institute (KETI), outlined four key architectural directions for future AI chips aimed
2026-05-29
digitimes.com
2026-05-29
Generative AI, HPC, and large data centers are raising demand for chips with higher power efficiency, stronger thermal control, and denser packaging, making advanced packaging a more strategic part of the semiconductor supply chain. In China, panel-level packaging (PLP) is gaining traction for its larger format, higher output, and lower-cost potential.
2026-05-29
digitimes.com
2026-05-29
Arm EVP and Chief Commercial Officer Will Abbey visited QBit Semiconductor's Taiwan headquarters on May 27, signaling deeper cooperation that could shape future chip design for edge AI, physical AI, and quantum-computing cybersecurity. The visit highlights how platform alliances are increasingly influencing next-generation computing architectures for global technology markets.
2026-05-29
digitimes.com
2026-05-29
MediaTek held its shareholders' meeting on May 29. Addressing the company's future outlook, Chairman Ming-Kai Tsai said that while the mobile phone market in 2026 has performed below expectations due to a sharp rise in memory prices, MediaTek's market share in various connectivity chips has increased significantly. He also noted that the company began generating revenue from AI data centers in 202
2026-05-29
finance.yahoo.com
2026-05-29
Yahoo Finance
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2026-05-29
finance.yahoo.com
2026-05-29
Yahoo Finance
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2026-05-29
finance.yahoo.com
2026-05-29
Yahoo Finance
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2026-05-29
news.samsung.com
2026-05-29
samsung.com
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2026-05-29
www.tweaktown.com
2026-05-29
TweakTown
Qualcomm's Snapdragon C wants to bring the MacBook Neo fight to the $300 Windows laptop market
Whether OEMs can hit $300 while delivering something worth buying remains the real question, with Intel and Googlebook also eyeing the same market.
VIEW GALLERY - 3
Hassam Nasir
Tech Reporter
Published May 28, 2026 5:52 PM CDT
2 minutes & 15 seconds read time
TL;DR: Qualcomm's Snapdragon C platform targe
2026-05-29
www.prnewswire.com
2026-05-29
PR Newswire
SEMIFIVE Showcases Advanced 3D-IC and Big Die Solutions for AI Semiconductor Innovation at SAFE™ Forum 2026
NEWS PROVIDED BY
SEMIFIVE
May 28, 2026, 18:03 ET
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SAN JOSE, Calif., May 28, 2026 /PRNewswire/ -- SEMIFIVE, a leading global provider of custom AI semiconductor (ASIC) solutions, today announced its participation in the Samsung Advanced Foundry Ecosystem (SAFE™) Fo
2026-05-29
finance.yahoo.com
2026-05-29
Yahoo Finance
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2026-05-29
markets.financialcontent.com
2026-05-29
FinancialContent
Singapore Semiconductor Testing Equipment Market Set to Nearly Double, Reaching USD 310 Million by 2033 at 7.8% CAGR
By:
AB Newswire
May 28, 2026 at 17:08 PM EDT
ⓘ This article is third-party content and does not represent the views of this site. We make no guarantees regarding its accuracy or completeness.
Singapore semiconductor testing equipment market
AI accelerators, automotive chips, and adv
2026-05-29
finance.yahoo.com
2026-05-29
Yahoo Finance
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2026-05-29
finance.yahoo.com
2026-05-29
Yahoo Finance
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2026-05-29
finance.yahoo.com
2026-05-29
Yahoo Finance
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2026-05-29
www.ad-hoc-news.de
2026-05-29
AD HOC NEWS
Infineon’s, Moore4Power
Infineon’s €91M Moore4Power Project Aims to Slash Chip Development Time as Stock Flirts with Overbought Levels
28.05.2026 - 22:01:16 | boerse-global.de
Infineon launches Moore4Power consortium to cut fab-to-datasheet time to one week, restructures into three segments, as stock hits records but overbought signals warn of consolidation.
Infineon’s €91M Moore4Power Project A
2026-05-29
finance.yahoo.com
2026-05-29
Yahoo Finance
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2026-05-29
www.proactiveinvestors.com
2026-05-29
Proactive financial news
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