Semiconductor News & Analysis Feed
249 articles
2026-05-28
news.siemens.com
2026-05-28
Siemens
Siemens today announced the latest continued collaboration with Samsung Foundry, reinforcing joint efforts to enable advanced semiconductor design and manufacturing workflows for the global fabless ecosystem.
Through close engineering alignment, Siemens continues to qualify and deploy its electronic design automation (EDA) software - including design, verification, simulation and silicon manufact
2026-05-28
digitimes.com
2026-05-28
Samsung Electronics is preparing to expand its foundry push into physical AI semiconductors through a chiplet platform developed with Cadence, targeting chips for robotics, automotive systems, drones, and industrial automation, ETNewsreported, citing industry sources.
2026-05-28
www.digitimes.com
2026-05-28
digitimes
Samsung Electronics is preparing to expand its foundry push into physical AI semiconductors through a chiplet platform developed with Cadence, targeting chips for robotics, automotive systems, drones, and industrial automation, ETNews reported,...
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2026-05-28
wccftech.com
2026-05-28
Wccftech
Apple is already considering the discontinuation of the MacBook Neo's $599 base variant, which would be equivalent to a stealth price hike of $100. Now, however, as TSMC appears all set to pursue an inflationary pricing regime for its advanced nodes, Apple might have to resort to a bigger price jump to prevent its razor-thin margins on the MacBook Neo from tumbling into the negative territory.
2026-05-27
www.techtimes.com
2026-05-27
Tech Times
By Allen Lee
Published: May 27 2026, 11:33 AM EDT
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SAMSUNG.COM
Samsung Foundry plans to tape out its Physical AI chiplet platform with design partner Cadence Design Systems in early 2027, with volume production of commercial chips targeted for the second half of that year — a move that signals
2026-05-27
www.techtimes.com
2026-05-27
Tech Times
By Allen Lee
Published: May 27 2026, 11:33 AM EDT
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SAMSUNG.COM
Samsung Foundry plans to tape out its Physical AI chiplet platform with design partner Cadence Design Systems in early 2027, with volume production of commercial chips targeted for the second half of that year — a move that signals
2026-05-27
news.google.com
2026-05-27
Digital Foundry
2026-05-26
www.forbes.com
2026-05-26
Forbes
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2026-05-26
digitimes.com
2026-05-26
Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices as part of an end-to-end offering for AI chips, addressing rising demand for GenAI and high-performance computing for memory capacity, bandwidth, and energy efficiency. The firm said it is leveraging its combined lo
2026-05-26
digitimes.com
2026-05-26
Intel is looking to broaden its foundry strategy beyond the race for advanced process nodes, placing greater emphasis on advanced packaging and glass substrate technologies as it positions Rio Rancho — its New Mexico site — as a global hub for next-generation packaging production.
2026-05-25
digitimes.com
2026-05-25
Micron Technology said persistent supply constraints and accelerating AI demand are shaping its long-term technology roadmap, with 1-gamma DRAM, G9 NAND, and next-generation HBM products driving growth through 2027. The company is expanding EUV adoption, deepening collaboration with customers and foundry partners, and using multi-year supply agreements to support future capacity investments.
2026-05-22
www.tradingkey.com
2026-05-22
TradingKey
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2026-05-22
www.digitimes.com
2026-05-22
digitimes
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2026-05-22
www.digitimes.com
2026-05-22
digitimes
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2026-05-22
www.bloomberg.com
2026-05-22
Bloomberg.com
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2026-05-22
www.digitimes.com
2026-05-22
digitimes
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2026-05-21
www.techtimes.com
2026-05-21
Tech Times
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2026-05-21
www.forbes.com
2026-05-21
Forbes
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2026-05-20
news.google.com
2026-05-20
Digital Foundry
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2026-05-20
www.thelec.net
2026-05-20
thelec.net
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