Semiconductor News & Analysis Feed
5456 articles
2026-06-16
www.mk.co.kr
2026-06-16
매일경제
Preemptive response to a 7-fold jump in memory values
Set-top box costs also doubled
Funding first-time carrier materials purchases
"Prevent supply chain disruptions and stabilize supply chains"
사진 확대
The manufacturing site of KT's set-top box partner. KT
As demand for high-bandwidth memory (HBM) for artificial intelligence (AI) servers has soared, the price of general-purpose memory in set-top b
2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
Infineon’s, Two-Pronged
Infineon’s Two-Pronged Growth Bet: Humanoid Robots and AI Power Grids Fuel Rally
16.06.2026 - 07:51:18 | boerse-global.de
Infineon rides humanoid robotics and AI power waves, shares up 111% YTD. GaN tech for robots, SiC modules for data centers. Guidance raised, market cap over €100B.
Infineon’s - Infineon’s Two-Pronged Growth Bet: Humanoid Robots and AI Power Grids Fuel
2026-06-16
news.google.com
2026-06-16
EE Times Asia
2026-06-16
seekingalpha.com
2026-06-16
Seeking Alpha
__fail__
2026-06-16
www.cnbc.com
2026-06-16
CNBC
Qualcomm
is working on over 40 designs of new AI devices, CEO Cristiano Amon told CNBC, as the chip designer prepares for a wave of “agents” across consumer electronics.
In a wide-ranging interview on CNBC’s “The Tech Download” podcast, Amon laid out his views on the changing role of smartphones and apps, why smart glasses could be the next major consumer device, new types of electronics that wi
2026-06-16
timestech.in
2026-06-16
TimesTech
BuzzIndustry News
Infineon Found to Infringe Innoscience Patents, Barred from Selling in China
By TimesTech -
June 16, 2026
0
52
Innoscience, announced that China’s Supreme People’s Court has upheld a sales injunction against certain gallium nitride (GaN) products manufactured by Infineon Technologies AG, bringing a patent infringement dispute between the two companies to a final conclusion in Ch
2026-06-16
drrobertcastellano.substack.com
2026-06-16
Dr. Robert Castellano's Semiconductor Deep Dive Newsletter
AI Is No Longer Limited by Transistors. It Is Becoming Limited by Package Area
DR. ROBERT CASTELLANO
JUN 16, 2026
∙ PAID
9
Share
What’s In This Article
The Next AI Bottleneck Has Arrived
Chart 1. CoWoS and CoPoS Cost Crossover
Why CoWoS Is Reaching Its Limits
Table 1. Evolution of TSMC Advanced Packaging Technologies
CoPoS Expands Package Area by More Than 5x
Table 2. CoWoS Versus CoPoS
Panel-Leve
2026-06-16
www.msn.com
2026-06-16
MSN
Elon Musk’s SpaceX went public on Friday, exploding onto the scene with a valuation that quickly eclipsed $2 trillion.
Things went swimmingly for a while, with shares steadily rising from a debut $150 — a premium of 11 percent over the original asking price — on Friday to well over $200 on Tuesday. But after peaking at $222 Tuesday morning, SpaceX started its first sustained decline of its nascen
2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
Suess Microtec, DE000A1K0235
New release push: Suess Microtec’s XBC300 Gen2 targets advanced packaging demand
16.06.2026 - 05:05:28 | ad-hoc-news.de
Suess Microtec has introduced the XBC300 Gen2 wafer bonder to address surging demand in advanced packaging and 3D integration, aiming squarely at high-volume semiconductor production rather than lab-scale tools.
Suess Microtec, DE000A1K0235
Edited
2026-06-16
news.google.com
2026-06-16
EE Times Asia
2026-06-16
autonews.gasgoo.com
2026-06-16
Gasgoo
Home
/
ICV
/
Li Auto launches new-gen cockpit platform powered by proprietary OS, Qualcomm's latest chip
Li Auto
Li Auto launches new-gen cockpit platform powered by proprietary OS, Qualcomm's latest chip
Monika From Gasgoo
|
June 16 , 2026 10:34 BJT
f
SHARE
TWEET
in
SHARE
SHARE
Gasgoo Munich- Li Auto used its Livis Day software and embodied intelligence event to introduce a new flagship cockpit
2026-06-16
www.barchart.com
2026-06-16
Barchart.com
NVIDIA Corp logo outside building-by BING-JHEN_HONG via iStock
Nvidia (NVDA) is back in the bond market for the first time in five years, and the size of the deal is getting attention. The chipmaker is seeking to raise at least $20 billion, with reports saying the final sale could reach $25 billion after strong demand pushed orders to about $85 billion. Nvidia says the proceeds will go toward gen
2026-06-16
www.moomoo.com
2026-06-16
Moomoo
__fail__
2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
Infineon, DE0006231004
New AI power push: Infineon’s XDP700 digital multiphase controllers target Nvidia MGX servers
16.06.2026 - 03:15:46 | ad-hoc-news.de
Infineon is sharpening its AI hardware focus with the XDP700 family of digital multiphase controllers, designed to deliver efficient, tightly regulated power to GPUs and accelerators in next-generation Nvidia MGX AI server platforms.
Infineon
2026-06-16
tomshardware.com
2026-06-16
Zhiye Liu
Our RAM benchmark hierarchy ranks DDR5 and DDR4 memory kits of all frequencies and capacities for any budget.
2026-06-16
www.msn.com
2026-06-16
MSN
Record price target: TD Cowen lifted Micron's target to $1,500, projecting strong AI-fueled growth and sustained pricing power.
Supply sold out: Micron's 2026 high-bandwidth memory output is fully booked, with 2027 orders already under negotiation.
Earnings in focus: Investors await June 24 results for signs of long-term contracts and profit margin strength.
Record-breaking rally: Micron stock
2026-06-16
digitimes.com
2026-06-16
Global expansion in AI chips, advanced logic processes, and multilayer 3D NAND flash memory is driving demand for tungsten hexafluoride (WF6), a critical electronic specialty gas used in semiconductor manufacturing. Limited short-term supply additions and low industry inventories are widening the supply-demand gap, triggering a rapid price increase.
2026-06-16
digitimes.com
2026-06-16
Nvidia's dominance in AI is extending beyond model training and deeper into inference—the fast-growing segment of the AI market responsible for running deployed models and generating revenue.
2026-06-16
digitimes.com
2026-06-16
SK Hynix moved closer to shipping seventh-generation high-bandwidth memory, HBM4E, to key customers as timing emerged as a critical competitive factor in the global memory market. According to Newsis, industry sources reported that SK Hynix had recently made positive progress in HBM4E development and was preparing to send samples soon, with shipments possibly beginning in June 2026 and no later th
2026-06-16
digitimes.com
2026-06-16
China has recently eased controls on some indium phosphide (InP) substrates, relieving a bottleneck in optical communications capacity for the second half of the year. But supply chain players say the long-term priority is still to expand substrate capacity from non-China sources, with supply security for the AI industry outweighing price.