www.thelec.net
2026-06-16
South Korean semiconductor equipment manufacturer Genesem has secured a contract worth approximately 737 billion KRW (roughly 13% of its revenue last year) with SK Hynix's Chongqing subsidiary for backend semiconductor equipment, primarily including wafer singulation systems. The agreement, signed o
www.thelec.net
2026-06-03
Genesem has completed development of next-generation equipment for advanced HBM (high-bandwidth memory) packaging, including vacuum mounters and flip mounters. As the HBM market expands, demand for high-precision packaging equipment is rising. The vacuum mounting technology prevents particle contami