Semiconductor News & Analysis Feed
685 articles
2026-06-04
www.mk.co.kr
2026-06-04
매일경제
"The very question facing the AI semiconductor industry is changing... From the perspective of faster HBM and larger GPUs, attention is shifting toward inference and Agentic AI stages" "The challenge is no longer who can make the better GPU, but how AI systems should operate"
사진 확대
Jungim Park, CEO of K-Freedom Asset Management. [K-Freedom Asset Management]
As resolving bottlenecks in memory semi
2026-06-04
www.aastocks.com
2026-06-04
AASTOCKS.com
SK Group Chairman Chey Tae-won met with Taiwan Semiconductor Manufacturing Company Ltd. (TSM.US) Chairman C.C. Wei. The two sides exchanged views on the development of next-generation AI technologies and agreed to further strengthen comprehensive cooperation, including joint research and development of next-generation high bandwidth memory (HBM) and advanced packaging technologies, in order t
2026-06-04
www.aastocks.com
2026-06-04
AASTOCKS.com
SK Group Chairman Chey Tae-won met with Taiwan Semiconductor Manufacturing Company Ltd. (TSM.US) -10.000 (-2.239%)
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Chairman C.C. Wei. The two sides exchanged views on the development of next-generation AI technologies and agreed to further strengthen comprehensive cooperation, including joint research and development of next-generation high bandwidth memory (HBM) and advanced p
2026-06-04
www.aastocks.com
2026-06-04
AASTOCKS.com
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SK Group, TSMC Agree to Strengthen Ties in HBM, Advanced Packaging
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SK Group Chairman Chey Tae-won met with Taiwan Semiconductor Manufac
2026-06-04
www.aastocks.com
2026-06-04
AASTOCKS.com
SK Group Chairman Chey Tae-won met with Taiwan Semiconductor Manufacturing Company Ltd. (TSM.US) Chairman C.C. Wei. The two sides exchanged views on the development of next-generation AI technologies and agreed to further strengthen comprehensive cooperation, including joint research and development of next-generation high bandwidth memory (HBM) and advanced packaging technologies, in order t
2026-06-04
www.ad-hoc-news.de
2026-06-04
AD HOC NEWS
Microns, Trillion-Dollar
Micron's Trillion-Dollar Moment: HBM Sold Out, Analysts Aggressive, but Auto Market Share Slips
04.06.2026 - 03:13:17 | boerse-global.de
Micron Technology crosses $1 trillion market cap as AI memory demand soars, but insider selling and Samsung's automotive memory lead raise caution.
Micron's Trillion-Dollar Moment: HBM Sold Out, Analysts Aggressive, but Auto Market Shar
2026-06-04
biz.chosun.com
2026-06-04
Chosunbiz
By
Lee Ho-jun
Published 2026.06.04. 09:59
HANMI Semiconductor sets up a booth at the 2026 Computex exhibition. /Courtesy of HANMI Semiconductor
HANMI Semiconductor took part in Taiwan's Computex for the first time and showcased High Bandwidth Memory (HBM) production equipment and next-generation packaging equipment.
HANMI Semiconductor said on the 4th that it participated in "Computex 2026," he
2026-06-04
tynmagazine.com
2026-06-04
TyN Magazine
tynmagazine.com
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2026-06-04
wccftech.com
2026-06-04
Wccftech
While China develops workarounds to US sanctions of high-end extreme ultraviolet (EUV) machines, the shortage in the memory industry due to high demand from AI chips has created an opportunity for Chinese firms to gain market share, suggests a report from the Korean media. The aggressive approach, led by the Chinese government, has narrowed down the gap between China and Korea for HBM memory to th
2026-06-04
www.techtimes.com
2026-06-04
Tech Times
By Kyle Belmonte
Published: Jun 03 2026, 12:57 PM EDT
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A visitor takes a picture of a model of SK hynix's high-bandwidth memory (HBM) technology during the 2025 World IT Show in Seoul on April 24, 2025. South Korean chip giant SK hynix reported record quarterly profits on April 24, thanks to soa
2026-06-04
www.msn.com
2026-06-04
MSN
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2026-06-03
tomshardware.com
2026-06-03
Luke James
Samsung displayed its first physical mockup of HBM5 memory at Computex 2026 in Taipei, pairing the eighth-generation AI memory with a new in-package cooling structure.
2026-06-03
www.thelec.net
2026-06-03
thelec.net
Genesem says orders for HBM and advanced packaging equipment are becoming increasingly visible as the market expands. (Photo: THE ELEC)
Genesem said on Monday that orders for advanced packaging equipment are becoming increasingly visible as demand rises in the high-bandwidth memory (HBM) and advanced semiconductor packaging markets.
The company recently completed development of next-generation p
2026-06-03
www.ideal-investisseur.fr
2026-06-03
Idéal Investisseur
Air Liquide Signs Major Contract with SK hynix to Support HBM Chip Production in Korea
On Wednesday, the French group announced the construction of a dedicated nitrogen production unit for SK hynix's HBM memory chip packaging plant in Cheongju. This long-term major contract represents the first major integration project following the acquisition of DIG Airgas earlier this year.
PUBLISHED ON JUN
2026-06-03
www.upi.com
2026-06-03
upi.com
June 2 (Asia Today) -- Nvidia CEO Jensen Huang visited the SK hynix booth at Computex 2026 in Taipei on Tuesday, meeting SK Group Chairman Chey Tae-won for a second straight day as the companies deepen their artificial intelligence partnership.
Huang, who met privately with Chey on Monday, examined SK hynix's major memory products and wrote "Please Make More" on an HBM4E wafer displayed at the bo
2026-06-03
en.sedaily.com
2026-06-03
Seoul Economic Daily
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2026-06-03
en.sedaily.com
2026-06-03
Seoul Economic Daily
Jensen Huang to SK hynix: "Please Make More HBM"
Day 1 of Computex 2026 in Taipei, Taiwan
Jensen Huang Visits SK hynix Booth
SK hynix Unveils HBM4E Wafer Sample for First Time
CEO Huang Signs HBM4E Wafer
Leaves Special Request: "Please Make More HBM"
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Published 2026.06.03. 07:00:05
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By Lee Suk-jin in Taipei
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Nvidia CEO Jensen Huang shakes hands with SK Group Chair
2026-06-03
en.sedaily.com
2026-06-03
Seoul Economic Daily
Jensen Huang to SK hynix: "Please Make More HBM"
Day 1 of Computex 2026 in Taipei, Taiwan
Jensen Huang Visits SK hynix Booth
SK hynix Unveils HBM4E Wafer Sample for First Time
CEO Huang Signs HBM4E Wafer
Leaves Special Request: "Please Make More HBM"
Property
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Published 2026.06.03. 07:00:05
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By Lee Suk-jin in Taipei
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Nvidia CEO Jensen Huang shakes hands with SK Group Chai
2026-06-03
www.ad-hoc-news.de
2026-06-03
AD HOC NEWS
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2026-06-03
etfdb.com
2026-06-03
ETF Database
etfdb.com
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