Semiconductor News & Analysis Feed
690 articles
2026-05-27
en.sedaily.com
2026-05-27
Seoul Economic Daily
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2026-05-27
semiengineering.com
2026-05-27
Semiconductor Engineering
Combining manufacturing-resolution geometry with deterministic, solver-accurate computation changes the economics of thermal analysis for advanced 2.5D packages.
Thermal management has become the defining bottleneck in high-performance computing (HPC) and AI accelerator packaging.
Modern packages integrate high-power ASICs with multiple High Bandwidth Memory (HBM) stacks on a silicon interposer,
2026-05-27
www.investing.com
2026-05-27
Investing.com
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2026-05-27
www.igorslab.de
2026-05-27
igor´sLAB
LATEST NEWS
SK hynix iHBM: Cooling moves directly into the HBM package
27. May 2026 06:00Samir Bashir
📖 Reading time: approx. 4 minutes · 797 words · 5,114 characters
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SK hynix has introduced iHBM, a new thermal solution for future High Bandwidth Memory generations. At first glance, the approach sounds like classic packaging refinement, but it targets a point that is increasingly becoming
2026-05-27
www.igorslab.de
2026-05-27
igor´sLAB
LATEST NEWS
SK hynix iHBM: Cooling moves directly into the HBM package
27. May 2026 06:00Samir Bashir
📖 Reading time: approx. 4 minutes · 797 words · 5,114 characters
🔊
Listen
SK hynix has introduced iHBM, a new thermal solution for future High Bandwidth Memory generations. At first glance, the approach sounds like classic packaging refinement, but it targets a point that is increasingly becoming
2026-05-27
www.tradingkey.com
2026-05-27
TradingKey
Micron's stock surged 19.29% on Tuesday, closing above $1 trillion market capitalization, with a 184% year-to-date gain. UBS raised its price target to $1,625, citing a shift in valuation logic driven by long-term agreements (LTAs). These LTAs, spanning 3-5 years with fixed pricing and prepayment, secure supply for buyers and provide revenue visibility for sellers. UBS expects LTAs to reshape Micr
2026-05-27
digitimes.com
2026-05-27
SK Hynix has unveiled a new high-bandwidth memory technology designed to reduce heat buildup in next-generation AI systems, as rising computing density turns thermal management into a more critical front for HBM suppliers.
2026-05-27
www.digitimes.com
2026-05-27
digitimes
SK Hynix has unveiled a new high-bandwidth memory technology designed to reduce heat buildup in next-generation AI systems, as rising computing density turns thermal management into a more critical front for HBM suppliers.
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2026-05-27
www.donga.com
2026-05-27
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2026-05-27
www.techspot.com
2026-05-27
TechSpot
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2026-05-27
www.thelec.net
2026-05-27
thelec.net
SK hynix unveils its iHBM technology with enhanced thermal dissipation performance on May 26. (Source: SK hynix)
SK hynix on May 26 unveiled a new thermal management technology called "iHBM," designed to address heat generation issues in high-bandwidth memory (HBM) products operating at increasingly higher speeds.
The key feature of iHBM is an integrated thermal control component called ICE, emb
2026-05-27
www.upi.com
2026-05-27
upi.com
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2026-05-27
www.mk.co.kr
2026-05-27
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SK hynix has unveiled a new iHBM technology that dramatically reduces heat by embedding Integrated Cooling Elements (ICE) in High Bandwidth Memory (HBM) packages.
HBM is a core component of AI semiconductors, but as each new generation stacks more layers and demands for speed continue to rise, heat generation has emerged as the biggest challenge. ICE is a co
2026-05-26
www.chosun.com
2026-05-26
조선일보
By Seongmin K
Published 2026.05.27. 00:34
Concept diagram of SK Hynix's iHBM technology. ICE, a thermal control element, serves as a passage for heat dissipation. /SK Hynix
SK Hynix unveiled on the 26th its "iHBM" technology, which significantly reduces heat generation in high-bandwidth memory (HBM) used in AI accelerators.
As demand for AI computations rises, the workload of HBM mounted on AI
2026-05-26
www.tradingkey.com
2026-05-26
TradingKey
Optical communication stocks surged on May 26 due to advancements in GPU-HBM integration using fiber optic interconnects. This innovative solution overcomes physical limitations of traditional 2.5D packaging by decoupling compute and memory units, allowing greater HBM capacity and improved thermal management. If successful, it will expand optical interconnects beyond data centers and benefit silic
2026-05-26
www.tomshardware.com
2026-05-26
Tom's Hardware
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2026-05-26
en.bloomingbit.io
2026-05-26
bloomingbit
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2026-05-26
overclock3d.net
2026-05-26
OC3D
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2026-05-26
en.sedaily.com
2026-05-26
Seoul Economic Daily
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2026-05-26
cryptobriefing.com
2026-05-26
Crypto Briefing
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