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2026-05-26
www.prnewswire.com
2026-05-26
PR Newswire
SK hynix unveils 'iHBM' thermal solution to boost AI performance
NEWS PROVIDED BY
SK hynix Inc.
May 25, 2026, 19:39 ET
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Enhances heat dissipation by integrating ICEs into the HBM package
Reduces thermal resistance by 30%, ensuring stable chip operation in demanding high-temperature and high-pressure environments
Lowers barriers to adoption by leveraging market-proven MR–
2026-05-26
markets.ft.com
2026-05-26
Financial Times
SEOUL, South Korea , May 25, 2026 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today the launch of the iHBM solution that embeds integrated cooling elements(ICEs)[1] within the high-bandwidth memory(HBM) package for next-generation HBM products.
[1] ICE(Integrated Cooling Elements): A cooling element made of electrically non-conductive, thermally conductive silicon-
2026-05-26
sg.finance.yahoo.com
2026-05-26
Yahoo Finance Singapore
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2026-05-25
news.futunn.com
2026-05-25
富途牛牛
As artificial intelligence workloads continue to expand, demand for memory capacity and bandwidth is growing rapidly, pushing existing GPU-HBM architectures toward their limits. According to ZDNet, researchers at a major South Korean memory manufacturer stated that memory and packaging companies are exploring a new approach that places the GPU and HBM in separate packages. Unlike traditional desig
2026-05-25
www.thelec.net
2026-05-25
thelec.net
Micron's sixth-generation high bandwidth memory (HBM4) production ramp-up is progressing smoothly. (Photo: Micron)
Micron Technology's ramp-up of sixth-generation high bandwidth memory (HBM4) production capacity is progressing smoothly. The company also plans to begin mass production of next-generation HBM4E standard products next year.
Manish Bhatia, executive vice president of global operation
2026-05-25
wccftech.com
2026-05-25
Wccftech
US memory giant Micron believes that the shortage in the memory market when it comes to HBM, NAND and DRAM products will last well beyond calendar year 2026. Micron's thoughts were shared by JPMorgan in an investment note where the bank shared insights that the firm's management shared at the 54th J.P. Morgan Annual Global Technology, Media and Communications (TMC) Conference held in Boston, Massa
2026-05-25
www.digitimes.com
2026-05-25
digitimes
Micron Technology said persistent supply constraints and accelerating AI demand are shaping its long-term technology roadmap, with 1-gamma DRAM, G9 NAND, and next-generation HBM products driving growth through 2027. The company is expanding EUV adoption,...
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2026-05-25
digitimes.com
2026-05-25
Micron Technology said persistent supply constraints and accelerating AI demand are shaping its long-term technology roadmap, with 1-gamma DRAM, G9 NAND, and next-generation HBM products driving growth through 2027. The company is expanding EUV adoption, deepening collaboration with customers and foundry partners, and using multi-year supply agreements to support future capacity investments.
2026-05-24
en.sedaily.com
2026-05-24
Seoul Economic Daily
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2026-05-24
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2026-05-24
Seoul Economic Daily
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2026-05-24
en.sedaily.com
2026-05-24
Seoul Economic Daily
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2026-05-23
wccftech.com
2026-05-23
Wccftech
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2026-05-22
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2026-05-22
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General Investing
Micron HBM4 Is Ramping Twice as Fast as Expected. Here’s What That Means for Investors
Wiltone Asuncion
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8 minute read
Reviewed by:
David Hanson
Last updated May 22, 2026
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2026-05-22
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2026-05-22
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2026-05-22
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2026-05-22
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2026-05-22
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2026-05-22
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