Semiconductor News & Analysis Feed
660 articles
2026-07-02
biz.chosun.com
2026-07-02
Chosunbiz
By
Hwang Min-gyu
Published 2026.07.02. 11:12
Lee Jae-yong, chair of Samsung Electronics, delivers a welcome address at the national briefing on the Chungcheong advanced industry development vision presided over by President Lee Jae-myung in Asan, South Chungcheong, on the 2nd. /Courtesy of Yonhap News
Samsung said on the 2nd at the Chungcheong Advanced Industry Development Vision national briefi
2026-07-02
en.yna.co.kr
2026-07-02
Yonhap News Agency
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SEOUL, July 2 (Yonhap) -- An industrywide 392 trillion-won (US$252.5 billion) investment will be injected into the central Chungcheong area, including high bandwidth memory (HBM) fabs and packaging facilities by Samsung Electronics Co. and SK hynix, as part of the government's drive to spread artificial intell
2026-07-02
letsdatascience.com
2026-07-02
Let's Data Science
INFRASTRUCTURE
hbm packaging
semiconductor investment
south korea
semiconductors
Samsung and SK hynix Build HBM Packaging Fabs
15 sources
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July 2, 2026
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By LDS Team
7.4
Relevance Score
Photo: newsimg.koreatimes.co.kr · rights & takedowns
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Samsung Electronics and SK hynix will build new high-bandwidth memory (HBM) packaging fabs in South Korea's Chungcheong region as part of a
2026-07-02
www.koreaherald.com
2026-07-02
The Korea Herald
This undated file photo shows SK hynix Inc.'s factory in Cheongju, 113 kilometers south of Seoul. (SK hynix Inc.)
An industrywide 392 trillion-won ($252.5 billion) investment will be injected into the central Chungcheong area, including high bandwidth memory fabs and packaging facilities by Samsung Electronics Co. and SK hynix, as part of the government's drive to spread artificial intelligence-l
2026-07-02
www.koreatimes.co.kr
2026-07-02
The Korea Times
An artist's rendering of SK hynix's P&T7 packaging fab in Cheongju, North Chungcheong Province / Courtesy of SK hynix
An industrywide 392 trillion-won ($252.5 bil.) investment will be injected into the central Chungcheong area, including high bandwidth memory (HBM) fabs and packaging facilities by Samsung Electronics and SK hynix, as part of the government's drive to spread artificial intelligenc
2026-07-02
www.digitaltoday.co.kr
2026-07-02
디지털투데이
AI & Enterprise
Qualcomm unveils 'High Bandwidth Compute' as HBM alternative, enters AI chip race
AI Summary
Qualcomm is stepping up its return to the data centre AI chip market with a new memory architecture using LPDDR instead of high-bandwidth memory (HBM). It unveiled High Bandwidth Compute and plans to launch its AI250 inference accelerator in mid-2027. Qualcomm says the near-memory design c
2026-07-02
en.yna.co.kr
2026-07-02
Yonhap News Agency
This will let Google show Yonhap news articles that match or are related to your search
SEOUL, July 2 (Yonhap) -- An industrywide 392 trillion-won (US$252.5 billion) investment will be injected into the central Chungcheong area, including high bandwidth memory (HBM) fabs and packaging facilities by Samsung Electronics Co. and SK hynix, as part of the government's drive to spread artificial intell
2026-07-02
www.trendforce.com
2026-07-02
TrendForce
2026-07-02
www.techtimes.com
2026-07-02
Tech Times
By Allen Lee
Published: Jul 01 2026, 4:08 PM EDT
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Samsung Electronics Chairman Lee Jae-yong attends the briefing announcement of public-private collaboration projects at the presidential Blue House in Seoul on June 29, 2026. South Korea will invest nearly $1.2 trillion -- equivalent to more than
2026-07-02
247wallst.com
2026-07-02
24/7 Wall St.
The AI memory shortage that began squeezing hyperscaler supply chains in 2025 has now entered its second calendar year, with Micron Technology guiding fiscal Q4 2026 revenue to roughly $50 billion and HBM4 qualification samples still rationed among lead customers. For investors trying to translate that supply tightness into portfolio exposure, three exchange-traded funds capture different slices o
2026-07-01
www.chosun.com
2026-07-01
조선일보
By Park Ji-min
Published 2026.07.02. 00:37
Updated 2026.07.02. 09:39
What will be the next-generation advanced memory to follow ‘High Bandwidth Memory (HBM)’? The global semiconductor industry is focusing on developing a ‘second HBM’ product. HBM, a product that maximizes data processing speed by vertically stacking DRAM, has become a key asset in the artificial intelligence (AI) era and the key
2026-07-01
finance.biggo.com
2026-07-01
BigGo Finance
The AI computing arms race is spreading from chip design into foundational manufacturing and interconnect architectures. South Korea's government and its two memory titans recently unveiled an unprecedented semiconductor investment plan, while parallel industry discussions about "optical HBM" breaking the memory wall are setting the stage for a shakeup in the global memory and AI hardware supply c
2026-07-01
tspasemiconductor.substack.com
2026-07-01
semivision
ECTC 2026: The Three HBM Battlegrounds Defining the Next AI Hardware Race
Original Article By SemiVision Research [Reading time: 19 mins]
SEMIVISION
JUL 01, 2026
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The Open Compute Project (OCP) is bringing together APAC communities for a very special two-day, in-person Summit to explore the many challenges and opportunities facing data center infrastructure, today and tomorrow.
2026-07-01
asia.nikkei.com
2026-07-01
Nikkei Asia
TSMC, SK Hynix and Samsung stand to gain from US company's data center play
Qualcomm's Dragonfly line of AI data center products is up against chip giant Nvidia's offerings. (Source photos by Ken Kobayashi)
NEW YORK -- On a table in a midtown Manhattan conference room last Thursday, Durga Malladi, Qualcomm's vice president of data center, stacked his phones to illustrate what appeared to be a s
2026-07-01
www.digitimes.com
2026-07-01
digitimes
SK Hynix's latest senior hiring drive has reignited debate in South Korea's semiconductor industry, with the move seen as more than routine R&D reinforcement and as a sign that competition in the high-bandwidth memory (HBM) market has entered a new stage. As...
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2026-07-01
digitimes.com
2026-07-01
SK Hynix's latest senior hiring drive has reignited debate in South Korea's semiconductor industry, with the move seen as more than routine R&D reinforcement and as a sign that competition in the high-bandwidth memory (HBM) market has entered a new stage. As AI chips demand more from memory, logic design, advanced process nodes, and packaging integration, talent with system semiconductor and found
2026-07-01
wccftech.com
2026-07-01
Wccftech
AMD is releasing its first-ever SoCs with an on-package memory solution, the Versal Gen 2, which offers 10x compute uplift.
[Editor's Note] The release of Versal Gen 2 marks the first SoC from AMD to feature an on-package memory solution. Compared to Versal Gen 1, the move to LPDDR5X memory comes at a time when the entire tech industry is facing DRAM shortages, and with the prices of HBM products
2026-07-01
www.techtimes.com
2026-07-01
Tech Times
By Allen Lee
Published: Jun 30 2026, 4:16 PM EDT
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SEMICONDUCTOR.SAMSUNG.COM
Samsung Electronics has filed a patent aimed at the reliability problems that crop up as high-bandwidth memory (HBM) stacks grow taller — reworking the "dummy die" that caps the stack to improve yield and stability ahea
2026-07-01
www.servethehome.com
2026-07-01
ServeTheHome
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2026-07-01
news.futunn.com
2026-07-01
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