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NVIDIA52 TSMC28 AMD18 Intel15 SK Hynix11 Microsoft11 Micron Technology10 Samsung10 Micron10 Samsung Electronics9 Meta Platforms8 Applied Materials8 Apple8 Synopsys7 ASML6
Trending Technologies
EUV53 3nm45 AI15 GPU14 HBM10 DRAM9 AI chips7 2nm7 DDR56 EPYC6 AI chip5 semiconductor5 Zen 65 HBM44 AI accelerators4
2026-05-16
Micron's AI Memory Coup Meets a Wall of Profit-Taking: HBM Sold Out Through 2026, But Stock Tumbles - AD HOC NEWS
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www.ad-hoc-news.de 2026-05-16 AD HOC NEWS
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2026-05-16
SK Hynix’s Packaging Pivot: Why EMIB Could Reshape the HBM Supply Chain - AD HOC NEWS
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www.ad-hoc-news.de 2026-05-16 AD HOC NEWS
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2026-05-16
"China Eyes HBM Too"... How Samsung and SK Can Maintain Their Lead Amid Chinese Pursuit [Chip Talk] - 아시아경제
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www.asiae.co.kr 2026-05-16 아시아경제
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2026-05-16
SK Hynix Outruns Samsung as $14 Billion US Listing Looms to Cement HBM Dominance - AD HOC NEWS
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www.ad-hoc-news.de 2026-05-16 AD HOC NEWS
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2026-05-15
SK Hynix's HBM Output Is Spoken For Years in Advance as Clients Turn Co-Investors - AD HOC NEWS
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www.ad-hoc-news.de 2026-05-15 AD HOC NEWS
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2026-05-15
High Bandwidth Memory (HBM) Market Expected to Reach USD 29.65 - openPR.com
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www.openpr.com 2026-05-15 openPR.com
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2026-05-15
SK Hynix vs Samsung 2026: AI HBM Leader Edges Samsung in Best Stock Buy - International Business Times Australia
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www.ibtimes.com.au 2026-05-15 International Business Times Australia
INTERNATIONAL BUSINESS TIMESauNEWSLETTERSIGNUPMy accountLog OutMay 19, 12:56 PM AESTBusinessNewsSportsTechnologyEntertainmentNEWSLETTERMy accountLog OutAustralia editionBusinessNewsSportsTechnologyEntertainmentEditionsAustraliaIndiaInternationalSingaporeUnited KingdomUnited StatesNEWSLETTERFollow UsEditionsAustraliaIndiaInternationalSingaporeUnited KingdomUnited States
Semiconductor IndustryMemory ChipsAI ComputingHBM TechnologyStorage MarketChip ManufacturingTechnology InvestmentSemiconductor Supply Chain
2026-05-15
Micron’s HBM Allocation Is Spoken for Through 2026, but a CEO Stock Sale and a Beijing Summit Add - AD HOC NEWS
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www.ad-hoc-news.de 2026-05-15 AD HOC NEWS
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2026-05-15
Hanmi Semiconductor Sets Up U.S. Outpost for HBM Equipment Push - Seoul Economic Daily
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en.sedaily.com 2026-05-15 Seoul Economic Daily
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2026-05-15
"It's Not Enough to Make HBM Well in the AI Era": Why a Brighter Semiconductor Outlook Drew Criticism - 매일경제
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www.mk.co.kr 2026-05-15 매일경제
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2026-05-15
KIM ETF tops 1 trillion won as HBM-fueled rally accelerates in Korea - CHOSUNBIZ - Chosunbiz
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biz.chosun.com 2026-05-15 Chosunbiz
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2026-05-15
SK Hynix Locks In Microsoft’s In-House AI Push as HBM Capacity Stays Booked Through 2027 - AD HOC NEWS
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www.ad-hoc-news.de 2026-05-15 AD HOC NEWS
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2026-05-15
SK Hynix Pushes Past Packaging Logjam as HBM Capacity Is Spoken For Through 2026 - AD HOC NEWS
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www.ad-hoc-news.de 2026-05-15 AD HOC NEWS
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2026-05-15
SMIC leverages process flexibility to capture orders amid global foundry capacity squeeze
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digitimes.com 2026-05-15
In its first-quarter 2026 earnings Q&A session on May 15, Semiconductor Manufacturing International Corporation (SMIC) outlined a strategic response to shifting global market dynamics. As leading international foundries and integrated device manufacturers (IDMs) pivot capacity toward high-margin AI processors and High Bandwidth Memory (HBM), SMIC has seen a significant influx of orders for standar
2026-05-15
A Look At Micron Technology (MU) Valuation As AI Memory Demand Drives Record Results And Long Term HBM Contracts - Yahoo Finance
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finance.yahoo.com 2026-05-15 Yahoo Finance
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2026-05-15
SK Hynix’s $942 Billion Milestone: How a Samsung Strike and HBM Shortage Inverted the Chip Hierarc - AD HOC NEWS
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www.ad-hoc-news.de 2026-05-15 AD HOC NEWS
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2026-05-14
[News] TSMC Sees AI Wafer Demand Rising 11x From 2022–2026, Targets CoWoS With 24 HBM Stacks in 2029 - TrendForce
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www.trendforce.com 2026-05-14 TrendForce
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TSMCAI chipsWafer manufacturingAI compute demandSemiconductor supply chainAdvanced process nodesCoWoS technologyHBM stacking
2026-05-14
Intel unveils next-generation memory to challenge HBM in AI market - 디지털투데이
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www.digitaltoday.co.kr 2026-05-14 디지털투데이
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2026-05-14
Samsung reportedly speeds up 3D NAND, packaging, and substrate plans
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digitimes.com 2026-05-14
Samsung Electronics is reportedly reviving delayed semiconductor initiatives across next-generation NAND flash, compound semiconductors, advanced packaging, and substrates — areas it set aside after more than a year of prioritizing DRAM design and high-bandwidth memory (HBM) competitiveness. The move signals a shift from catch-up mode back toward longer-term technology investment.
2026-05-14
SK Hynix’s High-Wire Act: Balancing HBM Dominance with Diversification as Rivals Ramp Up - AD HOC NEWS
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www.ad-hoc-news.de 2026-05-14 AD HOC NEWS
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