Semiconductor News & Analysis Feed
20 articles
2026-08-15
news.google.com
2026-08-15
2026-08-14
simplywall.st
2026-08-14
SK Hynix, in collaboration with SanDisk, has unveiled a new High Bandwidth Flash (HBF) specification through the Open Compute Project, aimed at supporting AI inference workloads. This standard targets high-bandwidth, high-capacity near-compute memory, guiding AI hardware designers and encouraging ea
2026-08-10
news.google.com
2026-08-10
2026-08-05
www.igorslab.de
2026-08-05
2026-08-05
www.chosun.com
2026-08-05
2026-08-05
www.thelec.net
2026-08-05
2026-08-05
2026-08-05
www.hpcwire.com
2026-08-05
2026-08-04
overclock3d.net
2026-08-04
2026-08-04
tomshardware.com
2026-08-04
SanDisk and SK Hynix have jointly introduced the High Bandwidth Flash (HBF) specification, a new storage technology combining the non-volatility of 3D NAND with the performance of High Bandwidth Memory (HBM), designed for AI inference systems. Released through the Open Compute Project (OCP), HBF is
2026-08-04
www.tomshardware.com
2026-08-04
2026-08-04
2026-08-04
www.digitimes.com
2026-08-04
2026-08-04
www.koreajoongangdaily.com
2026-08-04
2026-08-04
www.koreaherald.com
2026-08-04
2026-08-04
news.skhynix.com
2026-08-04
2026-08-04
www.trendforce.com
2026-08-04
2026-08-04
2026-08-04
2026-07-01
www.chosun.com
2026-07-01
As demand for AI inference grows, traditional High Bandwidth Memory (HBM) is facing challenges in power efficiency and data handling. The semiconductor industry is now developing next-generation memory technologies such as High Bandwidth Compute (HBC), High Bandwidth Flash (HBF), and Z-Angle Memory