Semiconductor News & Analysis Feed
3302 articles
2026-05-29
cryptobriefing.com
2026-05-29
Crypto Briefing
Huawei plans to narrow semiconductor gap with TSMC using novel chip architecture
The Chinese tech giant unveiled a new scaling framework and LogicFolding technology aimed at matching 1.4-nanometer chi
2026-05-29
www.reuters.com
2026-05-29
Reuters
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2026-05-29
www.devdiscourse.com
2026-05-29
Devdiscourse
Huawei's LogicFolding Revolution: Breaking Through Chip Design Barriers
Huawei's innovative chip design principle, focusing on signal speed rather than shrinking semiconductors, introduces a new path for China amidst U.S. sanctions. Their approach, known as the Tau Scaling Law, seeks to enhance chip efficiency via tightly connected structures, although its true impact remains debated within the in
2026-05-29
kfgo.com
2026-05-29
KFGO
By Heekyong Yang
SEOUL, May 29 (Reuters) – Samsung Electronics on Friday said it started shipping samples of its latest high-bandwidth memory (HBM) chip to customers, pulling ahead of rivals in distributing a new version of the product critical to AI data centers and sending its shares higher.
The South Korean tech company said the new chip, the 12-layer HBM4E, is more than 20% faster than its
2026-05-29
wtvbam.com
2026-05-29
WTVB
By Heekyong Yang
SEOUL, May 29 (Reuters) – Samsung Electronics on Friday said it started shipping samples of its latest high-bandwidth memory (HBM) chip to customers, pulling ahead of rivals in distributing a new version of the product critical to AI data centers and sending its shares higher.
The South Korean tech company said the new chip, the 12-layer HBM4E, is more than 20% faster than its
2026-05-29
whtc.com
2026-05-29
WHTC
By Heekyong Yang
SEOUL, May 29 (Reuters) – Samsung Electronics on Friday said it started shipping samples of its latest high-bandwidth memory (HBM) chip to customers, pulling ahead of rivals in distributing a new version of the product critical to AI data centers and sending its shares higher.
The South Korean tech company said the new chip, the 12-layer HBM4E, is more than 20% faster than its
2026-05-29
telecom.economictimes.indiatimes.com
2026-05-29
ET Telecom
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2026-05-29
simplywall.st
2026-05-29
simplywall.st
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2026-05-29
telecom.economictimes.indiatimes.com
2026-05-29
ET Telecom
Read and get insights from specially curated unique stories from editorial
Explore and discuss challenges & trends in India's leading B2B events
Recognise work that not only stood out but was also purposeful
Join leaders & experts for roundtables, conferences, panels and discussions
By continuing you agree to our Privacy Policy & Terms & Conditions
We have various options to advertise with us
2026-05-29
www.asiae.co.kr
2026-05-29
아시아경제
Mandatory Priority Supply of Key Products During Semiconductor Shortages
Fines of Up to 300,000 Euros for Refusing to Provide Supply Chain Information
120 Billion Euros in Investment Needed by 2035
The European Union (EU) is pushing ahead with its own version of the Chips Act and is considering granting the legislation significant emergency powers. One of the measures under review would allow the
2026-05-29
www.asiae.co.kr
2026-05-29
아시아경제
Mandatory Priority Supply of Key Products During Semiconductor Shortages
Fines of Up to 300,000 Euros for Refusing to Provide Supply Chain Information
120 Billion Euros in Investment Needed by 2035
The European Union (EU) is pushing ahead with its own version of the Chips Act and is considering granting the legislation significant emergency powers. One of the measures under review would allow the
2026-05-29
digitimes.com
2026-05-29
Chinese CMOS image sensor supplier SmartSens Technology announced on May 26 that it has entered into a strategic partnership with Chinese IC design company Unisoc to jointly develop Micro LED-based high-speed optical interconnect technology, targeting applications in AI computing clusters, smart vehicles, and industrial vision.
2026-05-29
digitimes.com
2026-05-29
Oppstar Bhd has restructured the delivery framework of an artificial intelligence chip development project with a Yokohama-based client, replacing an earlier tripartite arrangement with separate design services agreements and formalizing a US$2.9 million contract for its engineering scope, according to The Edge Malaysia.
2026-05-29
digitimes.com
2026-05-29
South Korean fabless chip-design company DeepX is using Computex 2026 to broaden partnerships around its neural processing units, or NPUs, as it pushes low-power AI chips for industrial and edge applications.
2026-05-29
digitimes.com
2026-05-29
Cloud service providers' demand for application-specific integrated circuits, or ASICs, is increasingly locked in as advanced process nodes, advanced packaging, and component supply tighten worldwide. For readers across global tech markets, the shift means access to manufacturing capacity, not just chip design, is becoming the main determinant of who can supply the next wave of AI hardware.
2026-05-29
digitimes.com
2026-05-29
The European Commission wants governments to buy chips from EU startups as Brussels seeks to reduce the bloc's reliance on US and East Asian suppliers, Reutersreported, citing a document it has seen.
2026-05-29
digitimes.com
2026-05-29
Samsung Electronics has started shipping samples of its latest high-bandwidth memory (HBM) chip, the 12-layer HBM4E, marking the industry's first delivery of the next-generation AI memory product, according to the company. The move underscores intensifying competition among memory suppliers as demand accelerates for higher-performance components used in AI computing systems.
2026-05-29
digitimes.com
2026-05-29
C2i Semiconductors has advanced its power management technology with the tape-out of a chip designed for AI infrastructure, while also securing fresh venture backing to expand development and scale production. The developments underscore growing investor interest in addressing power delivery bottlenecks in data centers, driven by accelerating AI workloads.
2026-05-29
digitimes.com
2026-05-29
AI demand for high-performance chips is driving up orders for semiconductor silicon capacitors, or Si-Caps, with Samsung Electro-Mechanics and several Taiwanese memory makers emerging as key names to watch. Supply-chain sources say the shift could reshape who captures future demand for advanced packaging.
2026-05-29
digitimes.com
2026-05-29
As AI moves from cloud environments into factories and physical systems, semiconductor design is being reshaped by new demands in speed, energy efficiency, and on-site learning. At a recent system-semiconductor seminar in South Korea, Seong-jun Jang, a research center director at the Korea Electronics Technology Institute (KETI), outlined four key architectural directions for future AI chips aimed