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Trending Companies
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Trending Technologies
EUV571 3nm519 AI226 AI chips182 GPU150 DRAM101 HBM96 AI infrastructure78 semiconductor74 memory chips52 data center51 AI accelerators51 GaN49 CPU41 advanced packaging41
2026-06-19
SK hynix Ships 12-Stack HBM4E Samples to Major AI Customers - HPCwire
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www.hpcwire.com 2026-06-19 HPCwire
2026-06-18
Synopsys Launches Multiphysics Fusion Portfolio for AI and HPC Chip Design - HPCwire
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www.hpcwire.com 2026-06-18 HPCwire
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Semiconductor Design ToolsAI ChipsHigh Performance ComputingMultiphysics SimulationChip DesignSynopsysArtificial IntelligenceComputational Chips
2026-06-18
NVIDIA Blackwell Delivers Fastest Results Across All MLPerf Training 6.0 Tests - HPCwire
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www.hpcwire.com 2026-06-18 HPCwire
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Artificial IntelligenceSemiconductorNVIDIAChip PerformanceMachine LearningComputing ArchitectureData CenterGPU
2026-06-17
HPE Adds Nvidia Vera CPUs to Private Cloud AI Offering - HPCwire
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www.hpcwire.com 2026-06-17 HPCwire
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HPENVIDIAVera CPUPrivate CloudArtificial IntelligenceData CenterSemiconductorServer
2026-06-17
SEEQC Selected for CHIPS Act–Backed NORDTECH Quantum R&D Initiative - HPCwire
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www.hpcwire.com 2026-06-17 HPCwire
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SemiconductorQuantum ComputingCHIPS ActR&D InvestmentTechnology InnovationSecurity VerificationHPCwireNORDTECH
2026-06-10
NextSilicon to Productize Arbel RISC-V Core into 64-Core Enterprise Processor for AI and HPC - HPCwire
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www.hpcwire.com 2026-06-10 HPCwire
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RISC-VAI ProcessorSemiconductorHPCEnterprise ChipChip DesignArtificial IntelligenceData Center
2026-06-09
SK Telecom and NVIDIA Build AI Infrastructure to Power Korea’s AI Innovation - HPCwire
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www.hpcwire.com 2026-06-09 HPCwire
Korea’s Leading Telco to Add NVIDIA-Powered AI Cloud Capacity Built on NVIDIA DSX AI Factory Architecture to Accelerate AI Startups, Robotics and Industrial Physical AI SEOUL, South Korea, June 8, 2026 — NVIDIA and SK Telecom have announced that SK Telecom plans to build a gigawatt-scale AI Cloud in Korea using the NVIDIA DSX platform, with the first AI factory coming online in 2027. An AI Cloud
Semiconductor IndustryArtificial IntelligenceCloud Computing5G NetworkData CenterAI ChipsSouth Korean TechnologyNVIDIA
2026-06-09
NVIDIA and SK hynix Announce Partnership to Advance Memory for AI Factories - HPCwire
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www.hpcwire.com 2026-06-09 HPCwire
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AI chipsMemory technologySemiconductor partnershipArtificial intelligenceStorage memoryChip manufacturingTechnology collaborationSemiconductor industry
2026-06-03
InspireSemi and E4 Showcase Thunderbird RISC-V Accelerator for HPC and AI at RISC-V Europe - HPCwire
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www.hpcwire.com 2026-06-03 HPCwire
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2026-06-03
GlobalFoundries Completes Acquisition of Synopsys’ Processor IP Solutions Business - HPCwire
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www.hpcwire.com 2026-06-03 HPCwire
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2026-06-02
NVIDIA and TSMC Bring AI into Fabs to Advance Semiconductor Design and Manufacturing - HPCwire
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www.hpcwire.com 2026-06-02 HPCwire
TAIPEI, Taiwan, June 1, 2026 — NVIDIA today announced that TSMC is using NVIDIA accelerated computing and AI to advance semiconductor design and manufacturing. As chips move to more advanced nodes, bringing them from design to high-volume production has become one of the world’s most complex computing challenges. Computational lithography, transistor simulation, process control and wafer inspecti
Artificial IntelligenceSemiconductor ManufacturingFabTSMCNVIDIAComputational LithographyChip DesignProcess Control
2026-06-02
Cadence Unveils Industry’s 1st Fully Autonomous Virtual Engineer for Chip Design, Powered by NVIDIA - HPCwire
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www.hpcwire.com 2026-06-02 HPCwire
Level-5 ChipStack AI Super Agent framework and NVIDIA OpenShell runtime advance secure, agentic AI across semiconductor development SAN JOSE, Calif., June 1, 2026 — At Computex 2026, Cadence announced the industry’s first fully autonomous virtual agentic AI design engineer, extending the ChipStack AI Super Agent to Level-5 autonomy. Built on Cadence’s AI-driven electronic design automation (EDA)
Chip DesignArtificial IntelligenceEDA ToolsVirtual EngineerNVIDIAAI AutomationSemiconductor VerificationAI Security
2026-05-30
Cadence and Samsung Foundry Deepen 2nm and 3D‑IC Collaboration - HPCwire
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www.hpcwire.com 2026-05-30 HPCwire
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Semiconductor ManufacturingChip DesignAdvanced ProcessFoundry Collaboration3D Integration2nm ProcessEDA ToolsChip Packaging
2026-05-29
Huawei Bets on a New Semiconductor Playbook to Overcome Chip Restrictions - HPCwire
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www.hpcwire.com 2026-05-29 HPCwire
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HuaweiSemiconductorChip RestrictionsTechnology BreakthroughSupply ChainArtificial Intelligence5GCloud Computing
2026-05-23
Micron Advances Made-in-America Memory with Manufacturing Expansion in Virginia - HPCwire
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www.hpcwire.com 2026-05-23 HPCwire
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2026-05-21
D-Wave Signs LOI for $100M CHIPS Act Funding to Advance Quantum Systems - HPCwire
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news.google.com 2026-05-21 HPCwire
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2026-05-20
Quantinuum and Synopsys Partner to Bring Quantum Computing to Industrial Design - HPCwire
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www.hpcwire.com 2026-05-20 HPCwire
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2026-05-20
Imec Debuts 1st Quantum Dot Qubit Device Built with High NA EUV - HPCwire
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www.hpcwire.com 2026-05-20 HPCwire
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2026-05-12
Applied Materials and TSMC Partner at the EPIC Center to Accelerate AI Scaling - HPCwire
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www.hpcwire.com 2026-05-12 HPCwire
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2026-05-07
TotalEnergies Selects Dell and NVIDIA for Pangea 5 Supercomputer in France - HPCwire
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news.google.com 2026-05-07 HPCwire