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2026-06-03
Samsung shows first HBM5 mockup with Heat Path Block cooling
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tomshardware.com 2026-06-03 Luke James
Samsung displayed its first physical mockup of HBM5 memory at Computex 2026 in Taipei, pairing the eighth-generation AI memory with a new in-package cooling structure.
High-Bandwidth MemoryHBM5Thermal ManagementMemory TechnologySemiconductor ManufacturingSamsungSK HynixAI Memory