Semiconductor News & Analysis Feed

Qualcomm is copying Samsung's Exynos 2600's innovative Heat Path Block (HPB) thermal technology for its upcoming Snapdragon 8 Elite Gen 6 Pro, though with subpar implementation. This move highlights the intense competition in semiconductor thermal management, where Samsung's recent breakthrough has

At Computex 2026 in Taipei, Samsung unveiled its first physical mockup of High-Bandwidth Memory 5 (HBM5), featuring a novel in-package cooling structure called the Heat Path Block (HPB). This design addresses the thermal bottleneck at the die-to-die interface, a critical issue as memory stacks grow