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2026-07-02
TrendForce
[News] Samsung Files New HBM Dummy Die Patent to Enhance High-Stack Reliability; Seen as Aimed at 16-Layer HBM5
2026-07-02 Semiconductors editor
News
Please note that this article cites information from ETNews.
As the industry advances toward higher-layer HBM, Samsung is reportedly developing a new structural design to improve package reliability. According to ETNews, Samsung Electronic