Semiconductor News & Analysis Feed
20 articles
2026-08-27
www.digitimes.com
2026-08-27
The high-bandwidth memory (HBM) technology is rapidly advancing, with increasing stack counts driving industry expectations for hybrid bonding (HB) technology to be officially introduced with HBM5. However, according to Digitimes, this technology faces significant challenges primarily due to issues
2026-08-27
tspasemiconductor.substack.com
2026-08-27
2026-08-27
tspasemiconductor.substack.com
2026-08-27
2026-08-25
news.skhynix.com
2026-08-25
2026-08-25
www.tomshardware.com
2026-08-25
2026-08-24
en.sedaily.com
2026-08-24
2026-08-24
finance.biggo.com
2026-08-24
2026-08-24
2026-07-23
2026-07-21
2026-07-20
2026-07-17
2026-07-16
semiengineering.com
2026-07-16
Hybrid bonding has transitioned from research to production, yet achieving high-volume manufacturing remains a significant challenge. While wafer-to-wafer bonding has demonstrated reliable large-scale integration, fine-pitch die-to-wafer bonding introduces new complexities due to increased sensitivi
2026-07-16
semiengineering.com
2026-07-16
Hybrid bonding is emerging as a critical technology for achieving the high interconnect density required by high-bandwidth workloads. As semiconductor processes advance toward smaller nodes, traditional copper-silicon dioxide bonding is becoming inadequate for meeting increasing density demands. Ind
2026-07-13
2026-07-13
news.google.com
2026-07-13
2026-07-09
www.digitimes.com
2026-07-09
Samsung Electronics and SK Hynix may delay their adoption of hybrid bonding technology for next-generation high-bandwidth memory (HBM), according to reports from Digitimes. This adjustment reflects weakened near-term commercial viability for hybrid bonding despite its long-term strategic importance.
2026-07-09
2026-07-07
news.google.com
2026-07-07
2026-07-06
news.futunn.com
2026-07-06