Semiconductor News & Analysis Feed

© Imec General | June 18, 2026 Imec unlocks system-level III-V chiplet integration on Si-CMOS Evertiq By combining high-density embedded capacitors, a scalable modeling framework for passive components, and laser-assisted bonding for III-V chiplet assembly, the platform lays the foundation for next-generation wireless (mmWave and sub-THz) systems. Imec, a Belgium-based research and innovation cen

Belgian research hub Imec has taken another step toward high-frequency chiplet-based systems, extending its 300mm RF silicon interposer platform to support system-level integration of III-V chiplets with Si-CMOS technology. The development targets emerging mmWave and sub-THz wireless applications, as well as high-speed signal handling for next-generation data centers.

www.newelectronics.co.uk Performing security verification This website uses a security service to protect against malicious bots. This page is displayed while the website verifies you are not a bot. Ray ID: a0a75b1198c9b506 Performance and Security by Cloudflare Privacy