Semiconductor News & Analysis Feed
11160 articles
2026-06-15
digitimes.com
2026-06-15
Walsin Technology expects the tight supply of passive components could last into 2028, as demand from AI infrastructure, automotive electronics, and future device upgrades lifts orders while memory shortages weigh on shipments across the broader electronics supply chain.
2026-06-15
digitimes.com
2026-06-15
Equipment maker Manz recently announced the successful delivery of the world's first 310mm x 310mm panel-level packaging (PLP) electrochemical deposition (ECD) mass-production tool, further expanding its footprint in advanced packaging process equipment and demonstrating integrated capabilities spanning in-house R&D, process and system integration, and mass-production deployment.
2026-06-15
digitimes.com
2026-06-15
Samsung Electronics' foundry division chief told employees on June 12 that a return to profitability in the contract chipmaking business looks difficult next year, with 2028 emerging as a more likely timeline, Yonhap, ZDNet Korea,and Chosunreported.
2026-06-15
digitimes.com
2026-06-15
SK Hynix is bringing additional back-end equipment into its Cheongju P&T6 facility as it steps up mass-production preparations for HBM4, a move that underscores mounting pressure on advanced memory suppliers to keep pace with demand from AI infrastructure.
2026-06-15
digitimes.com
2026-06-15
Wus Printed Circuit is pressing ahead with an AI-driven transformation, with its chairman and president outlining plans to move toward profitability as demand builds across high-performance computing and emerging technology markets.
2026-06-15
digitimes.com
2026-06-15
As global semiconductor supply chains are rebuilt, Southeast Asia is evolving from a back-end test-and-pack region into a resilient, multi-center advanced packaging and equipment ecosystem, according to industry participants. Migration drivers include pushes for local production and service, faster ramps for AI chip capacity, and customer demands for supply chain resilience amid de-Americanization
2026-06-15
digitimes.com
2026-06-15
South Korea's semiconductor equipment supply chain saw a material pickup in orders in the first half of 2026 as Samsung Electronics and SK Hynix accelerated investment in advanced DRAM and high-bandwidth memory (HBM4), generating demand across front-end tools, advanced packaging, and inspection equipment. The shift toward high-end process and packaging capabilities for AI memory has driven new con
2026-06-15
semiengineering.com
2026-06-15
Ed Sperling
Chip and system designers scramble to leverage existing and future standards as edge AI...
2026-06-15
digitimes.com
2026-06-15
Google's push to diversify its Tensor Processing Units (TPUs) supply chain is increasingly reaching into the foundry side, adding pressure on ASIC makers such as MediaTek. Recent reports indicate that Google is not only set to adopt Intel's embedded multi-die interconnect bridge (EMIB) packaging for its next-generation product, but is also planning to bring in Samsung Electronics for front-end waf
2026-06-15
digitimes.com
2026-06-15
Taiwan-based UBright Optronics is accelerating its transformation from an LCD optical film specialist into a diversified technology supplier, expanding into semiconductor materials, passive components and smart acoustics. The new businesses are expected to begin generating revenue in 2026 as product certifications advance, but the company has not yet offered guidance on their revenue impact.
2026-06-15
digitimes.com
2026-06-15
China has allowed the release of a fresh supply of indium phosphide (InP) substrates, which are under export controls. A first 2026 batch shipped at the end of May following an earlier release in 2025, easing a capacity bottleneck in the optical communications market. Taiwanese compound semiconductor suppliers including Visual Photonics Epitaxy (VPEC) and Global Communication Semiconductors (GCS)
2026-06-15
digitimes.com
2026-06-15
Taiwan's fabless semiconductor design sector posted its strongest year-over-year growth figures in years as of May 2026, with a cluster of memory-adjacent and storage chip makers leading a recovery that is both remarkable in scale and strikingly uneven in distribution. Of the 105 companies tracked, 69 reported positive accumulated year-over-year growth through May, but the top performers are lappi
2026-06-15
digitimes.com
2026-06-15
India sees rising global tech investment as Meta, Reliance and Anthropic deepen AI ties, while EV firms expand, Starlink faces delays, and semiconductor and tablet markets show steady structural growth.
2026-06-15
digitimes.com
2026-06-15
Taiwan's listed semiconductor and electronics companies posted robust revenue growth in May 2026, with the latest monthly data revealing a widening split between AI infrastructure beneficiaries and legacy consumer electronics players. The five-month cumulative picture through May underscores a structural reordering of the sector's top earners, led by server and AI hardware demand.
2026-06-15
digitimes.com
2026-06-15
LG Innotek plans to invest more than KRW1 trillion in a new semiconductor substrate plant in Haiphong, Vietnam, reflecting rising demand for substrates used in AI servers, 5G smartphones, and on-device AI chips. The expansion targets RF-SiP, FC-CSP, and FC-BGA substrates, as substrate suppliers adjust capacity plans to stronger demand from advanced mobile devices and AI infrastructure.
2026-06-15
digitimes.com
2026-06-15
Tata Electronics' planned US$11 billion semiconductor fab in Dholera, Gujarat, has become the anchor of India's front-end chip manufacturing ambitions. The project, supported by technology from Taiwan's PSMC, has also drawn a strategic partnership with Dutch lithography equipment supplier ASML.
2026-06-15
www.tradingview.com
2026-06-15
TradingView
News
/
Reuters
/
Sunrise Energy Metals Agrees To Strategic Investment In Advanced Alscn Memory Semiconductor Developer Agni Semiconductor
Sunrise Energy Metals Agrees To Strategic Investment In Advanced Alscn Memory Semiconductor Developer Agni Semiconductor
RefinitivLess than 1 min read
SRL
−3.82%
© Copyright Thomson Reuters 2026. Click For Restrictions - https://agency.reuters.com/en/copyright.h
2026-06-15
www.thelec.net
2026-06-15
thelec.net
Samsung Electronics' Onyang NanoCity. (Photo: Samsung Electronics)
Samsung Electronics and SK hynix are in discussions to build their first semiconductor back-end packaging plants in Korea's Honam region, according to industry sources, with multiple candidate locations under consideration.
According to industry sources on June 14, Samsung Electronics is reviewing Gwangju and Saemangeum as potent
2026-06-15
www.digitaltrends.com
2026-06-15
Digital Trends
Making chips smaller has dominated the semiconductor conversation for years, but TSMC’s next big leap may come from how those chips are packaged instead. According to analyst Ming-Chi Kuo, the company is developing a new Chip-on-Panel-on-Substrate, or CoPoS, technology that promises lower manufacturing costs while delivering better performance for future AI processors.
TSMC’s CoPoS packaging coul
2026-06-15
ts2.tech
2026-06-15
TechStock²
14 JUNE 2026
ARTIFICIAL INTELLIGENCE·BREAKING·EARNINGS·NASDAQ:MU·TECHNOLOGY
2 MINS READ
MICRON SHARES DROP UNDER $1,000 ON AI MEMORY SURGE AND EARNINGS CONCERNS
BY SHAN AHMED KHAN
New York, June 14, 2026, 16:03 EDT.
Micron Technology ended the session at $981.61, off 1.43%. The Nasdaq Composite added 0.31%. S&P 500 was up 0.50%.
Goldman Sachs kept its cautious stance going into Micron’s June 2