Semiconductor News & Analysis Feed
196 articles
2026-05-27
fortune.com
2026-05-27
Fortune
The CFO job in Big Tech used to be defined largely by margins, operating leverage, and investor discipline. In the age of AI, it is increasingly defined by a more difficult question: how much should a company spend now on compute capacity it may not fully monetize for years to come?
For Susan Li at Meta, Amy Hood at Microsoft, Anat Ashkenazi and Ruth Porat at Alphabet, Hilary Maxson at Oracle, Sa
2026-05-27
www.trendforce.com
2026-05-27
TrendForce
[News] Infineon Announces Second 2026 Price Hike Effective July 1 Amid Rising Supply Chain Costs, Strong Demand
2026-05-27 Semiconductors editor
News
Please note that this article cites information from TechNews and Commercial Times.
Infineon has announced another price increase. According to TechNews, the company informed customers and partners on the 26th that it will adjust prices for
2026-05-27
www.msn.com
2026-05-27
MSN
・TSMC shares gained 1.6% in Wednesday’s premarket session, inching closer to their all-time high.
・NVDA will invest up to $150 billion towards chipmaking capacity expansion and partnerships in Taiwan, CEO Jensen Huang said.
・Stocktwits sentiment for TSMC remained ‘bearish.’
U.S-listed shares of Taiwan Semiconductor Manufacturing Co. gained 1.6% in premarket trading on Wednesday, after Nvidia CE
2026-05-27
finance.yahoo.com
2026-05-27
Yahoo Finance
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2026-05-27
stocktwits.com
2026-05-27
Stocktwits
stocktwits.com
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2026-05-27
finance.yahoo.com
2026-05-27
Yahoo Finance
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2026-05-27
digitimes.com
2026-05-27
SK Hynix has unveiled a new high-bandwidth memory technology designed to reduce heat buildup in next-generation AI systems, as rising computing density turns thermal management into a more critical front for HBM suppliers.
2026-05-26
www.insidermonkey.com
2026-05-26
Insider Monkey
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2026-05-26
au.finance.yahoo.com
2026-05-26
Yahoo Finance Australia
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2026-05-26
news.google.com
2026-05-26
Yahoo Finance
2026-05-26
www.digitimes.com
2026-05-26
digitimes
Heat management has become a critical challenge as HBM technology advances, with higher stacking and faster speeds to meet surging global demand for AI data processing. Efficient control of power density in the die-to-die physical layer between HBM and GPUs...
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2026-05-26
digitimes.com
2026-05-26
South Korea and the Netherlands are looking to broaden their semiconductor partnership beyond ASML's EUV lithography machines, as silicon photonics (SiPh) emerges as a potential next field of cooperation amid rising power and bandwidth demands from AI data centers.
2026-05-26
digitimes.com
2026-05-26
Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices as part of an end-to-end offering for AI chips, addressing rising demand for GenAI and high-performance computing for memory capacity, bandwidth, and energy efficiency. The firm said it is leveraging its combined lo
2026-05-26
digitimes.com
2026-05-26
Heat management has become a critical challenge as HBM technology advances, with higher stacking and faster speeds to meet surging global demand for AI data processing. Efficient control of power density in the die-to-die physical layer between HBM and GPUs is now central to next-generation HBM competitiveness and data center reliability.
2026-05-26
digitimes.com
2026-05-26
Grace Wang, vice president and general manager of ASML in Taiwan, said that ASML plans to deploy extreme ultraviolet (EUV) and next-generation high numerical aperture (high-NA) EUV technologies to reduce energy consumption per wafer at the process level, while continuing to deepen its presence in Taiwan. The company also plans to hire around 1,000 new employees in Taiwan in 2026 to support custome
2026-05-25
digitimes.com
2026-05-25
At its earnings conference, Weltrend Semiconductor described the first quarter of 2026 as an exceptional one. Despite the period being historically slow, the company posted year-over-year and sequential growth. Nearly all major product lines demonstrated strong growth momentum, with server-related products standing out in particular. Order visibility is now expected to remain strong throughout the
2026-05-25
digitimes.com
2026-05-25
The shift toward 800V high-voltage direct current (HVDC) power architectures in AI data centers is driving a surge in demand for power semiconductors, boosting shipments for Taiwanese lead frame suppliers SDI Corporation and Jih Lin Technology and raising expectations for double-digit revenue growth in 2026.
2026-05-25
digitimes.com
2026-05-25
Ample Electronic said rising demand from artificial intelligence end customers has driven a stronger market for multilayer ceramic capacitors and related passive components, lifting orders, driving inventory builds, and prompting a shift toward longer-term material lock-in agreements. The conductive paste supplier reported a positive outlook for the second half of 2026 and said customers who initi
2026-05-25
digitimes.com
2026-05-25
Cyient Semiconductors has secured a total of about US$30 million in financing from Edelweiss-managed funds and co-investors, comprising a US$10 million equity investment at a valuation of roughly US$500 million alongside structured debt. The deal bolsters its capital base to scale its power semiconductor and custom silicon offerings for global AI markets.
2026-05-24
www.msn.com
2026-05-24
MSN
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