Semiconductor News & Analysis Feed

Intel's strategic collaboration with Lens Technology to explore glass substrate semiconductor packaging represents a significant advancement in advanced packaging technologies. Glass substrates offer superior electrical and thermal performance, enabling enhanced chip integration and performance. Thi

Intel (INTC) stock ended its fifth consecutive week in decline despite a strong quarterly earnings report, amid investor concerns over the chipmaker's foundry customer base. In a strategic move, Intel partnered with Lens Technology to advance next-generation semiconductor packaging technologies tail

Intel's collaboration with Lens Technology represents a significant advancement in semiconductor packaging for the AI era. This partnership combines Intel's chip design expertise with Lens Technology's advanced packaging capabilities to develop next-generation solutions for AI computing demands. The

Lens Technology and Intel have announced a strategic partnership to jointly explore the application of Through-Glass Via (TGV) technology in next-generation advanced packaging. This collaboration marks Lens Technology's strategic expansion from consumer electronics precision manufacturing into the s