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2026-05-26
Powerchip unveils 3D AI Foundry with 3D WoW DRAM stacking at COMPUTEX 2026
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digitimes.com 2026-05-26
Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices as part of an end-to-end offering for AI chips, addressing rising demand for GenAI and high-performance computing for memory capacity, bandwidth, and energy efficiency. The firm said it is leveraging its combined lo
2026-05-25
Huawei claims sanctions-busting breakthrough with 1.4nm-class chips by 2031, claims 55% higher transistor density
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tomshardware.com 2026-05-25 Etiido Uko
Flagship Huawei Mate 90 series will be the first commercial processors to feature the LogicFolding architecture
HuaweiSemiconductorChip DesignSanctions Busting1.4nmTransistor DensityTau Scaling LawLogicFolding Architecture
2026-05-25
Huawei claims sanctions-busting breakthrough with 1.4nm-class chips by 2031, claims 55% higher transistor density — firm claims new LogicFolding chip architecture can bypass EUV restrictions, introduces 'Tau Scaling Law' to replace Moore's Law - Tom's Hardware
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www.tomshardware.com 2026-05-25 Tom's Hardware
Tech Industry Manufacturing Semiconductors Huawei claims sanctions-busting breakthrough with 1.4nm-class chips by 2031, claims 55% higher transistor density — firm claims new LogicFolding chip architecture can bypass EUV restrictions, introduces 'Tau Scaling Law' to replace Moore's Law News By Etiido Uko published 11 hours ago Flagship Huawei Mate 90 series will be the first commercial processo
HuaweiSemiconductorChip DesignEUV RestrictionsLogicFolding ArchitectureMoore's LawTau Scaling LawTransistor Density
2026-05-24
Navitas Semiconductor Juggles Share Dilution and Technological Edge as AI Data Center Push Intensifi - AD HOC NEWS
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www.ad-hoc-news.de 2026-05-24 AD HOC NEWS
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2026-05-20
SEALSQ Strengthens Chip Design Capabilities Through the Successful Integration of IC’Alps, Reinforcing Europe’s Technological Sovereignty - The Manila Times
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www.manilatimes.net 2026-05-20 The Manila Times
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2026-05-20
SEALSQ Strengthens Chip Design Capabilities Through the Successful Integration of IC’Alps, Reinforcing Europe’s Technological Sovereignty - Yahoo Finance
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finance.yahoo.com 2026-05-20 Yahoo Finance
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2026-05-17
Nvidia Overtakes Silver To Become World's Second-Largest Asset At $5.52 Trillion, Market Commentator Calls It 'Historic Technological Revolution' - Yahoo Finance
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finance.yahoo.com 2026-05-17 Yahoo Finance
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2026-05-14
Nvidia Overtakes Silver To Become World's Second-Largest Asset At $5.52 Trillion, Market Commentator Calls It 'Historic Technological Revolution' - Yahoo Finance UK
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uk.finance.yahoo.com 2026-05-14 Yahoo Finance UK
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2026-05-11
SK Hynix and Intel team up on 2.5D packaging to connect HBM with logic chips - Crypto Briefing
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cryptobriefing.com 2026-05-11 Crypto Briefing
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2026-05-07
Selling off Nvidia shares and buying fuel cells: The "physics arbitrage" logic of a 24-year-old genius investor. - PANews
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www.panewslab.com 2026-05-07 PANews
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2026-05-03
Sub-1nm Process Technology Won’t Arrive Till 2034, Logic Roadmap Highlights 2D FETs For 0.2nm & Sub 0.2nm Nodes By 2043-2046 - Wccftech
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wccftech.com 2026-05-03 Wccftech