Semiconductor News & Analysis Feed
60 articles
2026-06-12
digitimes.com
2026-06-12
SK Hynix is preparing to begin mass production of its next-generation 375-layer 3D NAND flash memory by year-end, while pushing ahead with a broader capacity buildout and moving toward a US listing as early as August.
2026-06-11
wccftech.com
2026-06-11
Wccftech
SK Hynix is expected to begin mass production of its 375-Layer NAND Flash solution by the end of 2026, offering higher storage capacities.
SK Hynix and Samsung are in the race to reach the highest number of layers in the NAND Flash segment. While Samsung is aiming beyond 400-layers with dual stacking solutions going up to 1000-layers, Hynix will soon be commencing mass production on its 375-Layer
2026-06-11
tomshardware.com
2026-06-11
Anton Shilov
Biwin signs a 24-months supply agreement with an unknown NAND maker to get memory worth $1.86 billion.
2026-06-11
www.trendforce.com
2026-06-11
TrendForce
[News] SK hynix Advances DRAM and NAND Roadmap, Targets 3x Wafer Output by 2034, 375-Layer NAND at Year-End
2026-06-11 Semiconductors editor
News
Please note that this article cites information from Nikkei, The Elec, Newsis, Hankyung, and Global Economic.
While SK hynix had only last week outlined plans to double capacity over the next five years, the memory giant is now signaling an eve
2026-06-09
digitimes.com
2026-06-09
AI is reshaping the global memory-chip market, according to Morgan Stanley, by pulling in more DRAM, HBM, and NAND, and turning once-cheap components into scarce resources. The shift is raising costs, tightening supply, and forcing priority allocation for cloud, server, and other high-value buyers worldwide across industries.
2026-06-05
www.trendforce.com
2026-06-05
TrendForce
[News] Laser Annealing Adoption May Broaden with Wolfspeed, Samsung SiC Push and 400-Layer NAND Expansion
2026-06-05 Semiconductors editor
News
Please note that this article cites information from ETNews and Korea Credit News.
Laser annealing adoption appears to be broadening. According to ETNews, the thermal treatment process is expanding beyond its traditional use in silicon (Si) wafer
2026-06-04
tomshardware.com
2026-06-04
Anton Shilov
Sales of Silicon Motion’s SSD controllers are record high, but supply of NAND for client applications may get worse in 2027, the company tells us.
2026-06-01
www.tradingkey.com
2026-06-01
TradingKey
Chinese semiconductor firms are increasing DRAM and NAND production, with CXMT's chips appearing in Corsair products, indicating a shift in global supply dynamics. Companies like HP, Qualcomm, Dell, ASUS, and Acer are also engaging with Chinese manufacturers, driven by higher prices and limited supply from Samsung, SK Hynix, and Micron. While Chinese firms leverage advanced processes for consumer
2026-05-30
digitimes.com
2026-05-30
Samsung Electronics and SK Hynix dominate the global memory chip market, but their weaker position in automotive memory is drawing new scrutiny as AI data centers absorb more DRAM and NAND supply.
2026-05-26
digitimes.com
2026-05-26
Kioxia is targeting 2027 production of its 10th-generation BiCS 10 NAND, a move that could help the Japanese memory maker narrow its technology gap with Samsung Electronics and SK Hynix as the South Korean rivals delay investment in their own next-generation NAND technologies, according to ZDNet Korea.
2026-05-26
digitimes.com
2026-05-26
The race to dominate next-generation NAND flash memory has long been measured in layers — and Samsung Electronics appears to be pulling ahead. The South Korean chipmaker has reportedly developed a 900-layer-class V-NAND prototype, a significant leap that brings the memory industry closer to the 1,000-layer threshold as chipmakers intensify efforts to pack more storage into smaller chips while cutt
2026-05-25
wccftech.com
2026-05-25
Wccftech
US memory giant Micron believes that the shortage in the memory market when it comes to HBM, NAND and DRAM products will last well beyond calendar year 2026. Micron's thoughts were shared by JPMorgan in an investment note where the bank shared insights that the firm's management shared at the 54th J.P. Morgan Annual Global Technology, Media and Communications (TMC) Conference held in Boston, Massa
2026-05-25
digitimes.com
2026-05-25
Micron Technology said persistent supply constraints and accelerating AI demand are shaping its long-term technology roadmap, with 1-gamma DRAM, G9 NAND, and next-generation HBM products driving growth through 2027. The company is expanding EUV adoption, deepening collaboration with customers and foundry partners, and using multi-year supply agreements to support future capacity investments.
2026-05-25
digitimes.com
2026-05-25
Huawei is using self-developed packaging technology to build ultra-high-capacity enterprise SSDs, underscoring how Chinese technology companies are increasingly turning to advanced packaging and system-level engineering to navigate US semiconductor restrictions.
2026-05-24
www.marketbeat.com
2026-05-24
MarketBeat
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2026-05-18
www.ad-hoc-news.de
2026-05-18
AD HOC NEWS
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2026-05-14
www.digitimes.com
2026-05-14
digitimes
Samsung Electronics is reportedly reviving delayed semiconductor initiatives across next-generation NAND flash, compound semiconductors, advanced packaging, and substrates — areas it set aside after more than a year of prioritizing DRAM design and...The article requires paid subscription.Subscribe Now
2026-05-12
wccftech.com
2026-05-12
Wccftech
__fail__
2026-05-08
news.futunn.com
2026-05-08
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2026-04-20
eetimes.com
2026-04-20
Majeed Ahmad
China’s memory underdog defies sanctions by building a fab that mostly sources equipment, materials, and tools locally.