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A Houston federal judge reversed himself late Monday in a Nvidia chip smuggling case by deciding the Justice Department has satisfied discovery obligations without producing nonpublic White House communications on China policy.
In one paragraph at the end of an order delaying the trial, Senior Judge Kenneth Hoyt of the Southern District of Texas granted prosecutors’ request for reconsideration. T
2026-06-16
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2026-06-16
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NVIDIA (NASDAQ:NVDA | NVDA Price Prediction) is back through the $5 trillion mark. CEO Jensen Huang called “the buildout of AI factories, the largest infrastructure expansion in human history” on the most recent earnings call, and the numbers back him up.
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Data Center revenue hit $75.246 billion in Q1 FY27, up 92% year over year, with Networking alone growing 199%. The stock is up 14.
2026-06-16
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2026-06-16
Yahoo Finance
Nvidia Is Back Above $5 Trillion. Here’s What Comes Next
Vandita Jadeja
Tue, June 16, 2026 at 6:16 AM PDT 4 min read
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NVDA recrossed $5 trillion as Q1 FY27 Data Center revenue surged 92% to $75 billion, with Q2 guided to $91 billion.
China delivered zero Data Center compute revenue versus $4.6 billion a year ago, representing the
2026-06-16
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2026-06-16
tomshardware.com
2026-06-16
Anton Shilov
Qualcomm is in talks to buy RISC-V-based AI accelerator and CPU developer Tenstorrent for $8 billion - $10 billion.
2026-06-16
www.tomshardware.com
2026-06-16
Tom's Hardware
Tech Industry Artificial Intelligence
Qualcomm mulls taking over Jim Keller's Tenstorrent, report claims — deal for AI chipmaker would value the company at between $8 billion and $10 billion
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By Anton Shilov published 15 hours ago
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(Image credit: Tenstorrent)
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2026-06-16
MSN
Nvidia (NVDA) provided additional details on its bond offering, telling investors it intends to raise $25B.
The company, which made the disclosure in a filing with the Securities and Exchange Commission, will offer the debt in seven tranches, with maturities ranging from 2028 to 2056. The yields range from 4.25% for the 2028 note to 5.625% for the 2056 note. The tranches are between $3.5B and $4B
2026-06-16
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2026-06-16
GLOBSEC
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2026-06-16
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2026-06-16
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INFRASTRUCTURE
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chip packaging
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TSMC highlights CoWoS strength over panel packaging for largest AI chips
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June 16, 2026
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At TSMC's European Technology Symposium, Kevin Zhang, TSMC's senior vice president of business development and global sales and deputy co-COO, said that panel-l
2026-06-16
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2026-06-16
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2026-06-16
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2026-06-16
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2026-06-16
PR Newswire
Valens Semiconductor's HDBaseT Chipsets Power Barco's ClickShare USB-C Extension Over CAT Kit
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Valens Semiconductor
16 Jun, 2026, 13:30 IDT
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HOD HASHARON, Israel, June 16, 2026 /PRNewswire/ -- Valens Semiconductor (NYSE: VLN) today announced that its HDBaseT chipsets will form the connectivity infrastructure inside of Barco's ClickShare USB-C Extension ov