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Trending Companies
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Trending Technologies
EUV495 3nm451 AI209 AI chips180 GPU162 DRAM83 HBM79 AI infrastructure76 semiconductor74 data center56 GaN47 memory chips46 AI accelerators42 CPU41 semiconductor manufacturing40
2026-06-17
Leaked Intel SoC Plan Pairs x86 CPUs With NVIDIA RTX Integrated GPUs In Early 2028 - HotHardware
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hothardware.com 2026-06-17 HotHardware
2026-06-17
SIA Applauds CHIPS Act Incentives for Coherent - Semiconductor Industry Association | SIA
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www.semiconductors.org 2026-06-17 Semiconductor Industry Association | SIA
2026-06-17
Qualcomm CEO plans to kill app store with AI - thestreet.com
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www.thestreet.com 2026-06-17 thestreet.com
2026-06-17
Qualcomm wants to be the chip inside whatever replaces your smartphone, and it just announced two products toward that end - TechCrunch
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techcrunch.com 2026-06-17 TechCrunch
2026-06-16
SpaceX, Western Digital, Qualcomm, Marvell, and More Stocks That Explain Today’s Market - Barron's
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www.barrons.com 2026-06-16 Barron's
2026-06-16
Micron: Playing The Expectations Game (NASDAQ:MU) - Seeking Alpha
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seekingalpha.com 2026-06-16 Seeking Alpha
2026-06-16
Qualcomm said to be circling AI chip biz Tenstorrent in $10B RISC-V power play - The Register
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www.theregister.com 2026-06-16 The Register
2026-06-16
TSMC says panel packaging won't replace CoWoS anytime soon for the largest future AI processors — wafer-level tech can scale to 58 massive dies in one package - Tom's Hardware
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www.tomshardware.com 2026-06-16 Tom's Hardware
2026-06-16
TSMC says panel packaging won't replace CoWoS anytime soon for the largest future AI processors — wafer-level tech can scale to 58 massive dies in one package
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tomshardware.com 2026-06-16 Anton Shilov
CoPoS may enable larger chips, but CoWoS is still better.
TSMCCoWoSPanel-level packagingAI chipsSemiconductor manufacturing3D integrationWafer-level packagingChip scaling
2026-06-16
Qualcomm Is a Rare AI Chip Value Play - WSJ
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www.wsj.com 2026-06-16 WSJ
2026-06-16
Lattice Semiconductor Corp. (NASDAQ:LSCC) Meets Minervini Trend Template and High Growth Momentum Screen - ChartMill
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www.chartmill.com 2026-06-16 ChartMill
2026-06-16
AI wafer demand lifts Lam Research’s Sense.i platform into the spotlight - AD HOC NEWS
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www.ad-hoc-news.de 2026-06-16 AD HOC NEWS
2026-06-16
AMD opens EFB front beyond CoWoS, putting Taiwan substrate trio in play - digitimes
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www.digitimes.com 2026-06-16 digitimes
2026-06-16
Qualcomm CEO says AI agents will replace apps — as chip giant works on 40 new AI-powered devices - CNBC
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www.cnbc.com 2026-06-16 CNBC
2026-06-16
Li Auto launches new-gen cockpit platform powered by proprietary OS, Qualcomm's latest chip - Gasgoo
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autonews.gasgoo.com 2026-06-16 Gasgoo
2026-06-16
Commentary: AI memory boom turns WF6 squeeze into an opening for CXMT
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digitimes.com 2026-06-16
The semiconductor supply chain is facing another raw material shock — this time from tungsten hexafluoride, or WF6, a specialty gas used in chip manufacturing. Planned production adjustments or exits by some Japanese suppliers in the second half of 2026 have intensified concerns over tighter global supply, sending prices sharply higher and raising the risk of disruption into 2027.
2026-06-16
Supply security over cost: Google leads CSP charge to diversify InP substrate sourcing
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digitimes.com 2026-06-16
China has recently eased controls on some indium phosphide (InP) substrates, relieving a bottleneck in optical communications capacity for the second half of the year. But supply chain players say the long-term priority is still to expand substrate capacity from non-China sources, with supply security for the AI industry outweighing price.
2026-06-16
AMD opens EFB front beyond CoWoS, putting Taiwan substrate trio in play
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digitimes.com 2026-06-16
The AI data center buildout is driving demand for high-performance computing (HPC) and networking chips, sending the global IC substrate industry into a new growth cycle. Order visibility now extends two to three years, prompting Taiwan's three leading IC substrate suppliers,Unimicron,Kinsus, andNanya PCB, to restart capacity expansion targeting GPU, CPU, and ASIC customers.
2026-06-16
AT&S to invest up to EUR2 billion in Malaysia to expand AI substrate capacity
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digitimes.com 2026-06-16
Austria's AT&S plans to invest up to EUR2 billion (approx. US$2.32 billion) to expand its Kulim plant and a previously unused building at the second site in Kulim, Malaysia, as part of a broader push to capitalize on AI demand. The company said the investments will be fully supported and financed by long-term customer commitments, and it expects to represent at least five leading US tech partners.
2026-06-16
South Korea launches ultra-innovation economy push with major investment in next-generation power semiconductors
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digitimes.com 2026-06-16
South Korea has begun planning a large-scale research and development program for next-generation power semiconductors as part of its broader "Ultra-Innovation Economy Project," according to a report by the Seoul Economic Daily.