Semiconductor News & Analysis Feed
547 articles
2026-07-07
digitimes.com
2026-07-07
Nvidia and other artificial intelligence chipmakers are still facing shortages as TSMC's advanced-node and CoWoS packaging capacity remains tight, pushing demand into foundries, back-end assembly, testing, and overseas fabs. The strain is creating spillover opportunities across the broader semiconductor supply chain, while also exposing how dependent the market has become on limited high-end capac
2026-07-07
digitimes.com
2026-07-07
AI server demand is lifting shipments of motor-related power devices at Cystech Electronics, helping the Taiwanese MOSFET and diode designer grow first-half 2026 revenue despite memory shortages weighing on networking products. Wafer foundry and packaging capacity remain tight, with rush orders pushing standard lead times from 180 days to 270 days, according to supply chain sources.
2026-07-07
digitimes.com
2026-07-07
Huawei's next-generation flagship Mate 90 smartphone series has reportedly entered the chip packaging and testing stage, according to sources within China's supply chain. The lineup is expected to launch in September 2026 and will be the first to feature Huawei's new Kirin 2026 flagship processor, which is based on the company's Tau Scaling (τ) concept. The device is expected to be one of Huawei's
2026-07-07
semiengineering.com
2026-07-07
Anne Meixner
Optical methods need to comply with increasing warpage, finer RDL pitch, and trace size.
2026-07-07
www.digitimes.com
2026-07-07
digitimes
2026-07-06
news.google.com
2026-07-06
Tom's Hardware
2026-07-06
news.google.com
2026-07-06
Let's Data Science
2026-07-06
news.futunn.com
2026-07-06
富途牛牛
2026-07-06
news.google.com
2026-07-06
digitimes
2026-07-06
news.google.com
2026-07-06
digitimes
2026-07-06
news.google.com
2026-07-06
Insider Monkey
2026-07-06
digitimes.com
2026-07-06
Asahi Kasei, one of the notable suppliers of Sunfort dry film photoresist in Japan, has initiated a fab expansion project in Taiwan. The newly established plant is expected to further elevate capacity performance in cutting and processing semiconductor packaging substrates.
2026-07-06
digitimes.com
2026-07-06
Greatek Electronics, a subsidiary of memory packaging and testing provider Powertech Technology (PTI), has approved the acquisition of On Semiconductor SSMP Philippines, a packaging and testing services company under the On Semiconductor (Onsemi) group, using internal funds. The acquisition aims to strengthen the group's overseas operational footprint and improve its global customer service capabi
2026-07-06
digitimes.com
2026-07-06
SJ Semiconductor has started construction of a CNY10 billion (approx. US$1.47 billion) 3DIC manufacturing project in Shanghai's Lingang New Area, expanding advanced packaging capacity for high-performance computing, AI and data center chips.
2026-07-06
digitimes.com
2026-07-06
LG Chem has begun supplying semiconductor strippers to Amkor Technology, a major US-based packaging and testing provider, in its first commercial move into the market. The deal highlights rising demand for advanced chip-making chemicals as artificial intelligence, high-bandwidth memory, and smaller device designs reshape global semiconductor manufacturing.
2026-07-05
news.google.com
2026-07-05
BusinessToday Malaysia
2026-07-05
news.google.com
2026-07-05
BusinessToday Malaysia
2026-07-05
www.digitimes.com
2026-07-05
digitimes
2026-07-05
digitimes.com
2026-07-05
Applied Materials announced a new equipment platform aimed at addressing the memory bandwidth and energy-efficiency bottleneck confronting AI computing, unveiling tools across DRAM, advanced packaging, and process control to help chipmakers boost yields and accelerate mass production. The company said the platform combines materials engineering with process integration to support high-bandwidth me
2026-07-05
news.google.com
2026-07-05
Interesting Engineering