Semiconductor News & Analysis Feed
481 articles
2026-05-30
seekingalpha.com
2026-05-30
Seeking Alpha
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2026-05-29
www.barchart.com
2026-05-29
Barchart.com
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2026-05-29
finance.yahoo.com
2026-05-29
Yahoo Finance
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2026-05-29
www.barchart.com
2026-05-29
Barchart.com
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2026-05-29
finance.yahoo.com
2026-05-29
Yahoo Finance
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2026-05-29
tomshardware.com
2026-05-29
Anton Shilov
Silicon Motion announces its SM2524XT mainstream SSD controller that promises 14 GB/s read speed, up to 2.5 million random IOPS, and sustained random performance.
2026-05-29
simplywall.st
2026-05-29
simplywall.st
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2026-05-29
tomshardware.com
2026-05-29
Jowi Morales
It also features a software stack that could potentially allow it to operate as a singular unit with drones operating in the air, on the land, and on the surface.
2026-05-29
seekingalpha.com
2026-05-29
Seeking Alpha
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2026-05-29
digitimes.com
2026-05-29
Samsung Electronics has started shipping samples of its latest high-bandwidth memory (HBM) chip, the 12-layer HBM4E, marking the industry's first delivery of the next-generation AI memory product, according to the company. The move underscores intensifying competition among memory suppliers as demand accelerates for higher-performance components used in AI computing systems.
2026-05-29
digitimes.com
2026-05-29
AI demand for high-performance chips is driving up orders for semiconductor silicon capacitors, or Si-Caps, with Samsung Electro-Mechanics and several Taiwanese memory makers emerging as key names to watch. Supply-chain sources say the shift could reshape who captures future demand for advanced packaging.
2026-05-29
digitimes.com
2026-05-29
Unimicron said it will push advanced substrate and AI system-board upgrades in 2026 to capture accelerating demand for AI-related ASICs and switches, aiming for record revenue that would exceed its 2022 peak. The IC substrate and printed circuit board maker announced the strategy at its annual shareholders' meeting at the end of May, citing a shift in demand away from GPUs and CPUs toward ASICs, s
2026-05-29
digitimes.com
2026-05-29
MediaTek held its shareholders' meeting on May 29. Addressing the company's future outlook, Chairman Ming-Kai Tsai said that while the mobile phone market in 2026 has performed below expectations due to a sharp rise in memory prices, MediaTek's market share in various connectivity chips has increased significantly. He also noted that the company began generating revenue from AI data centers in 202
2026-05-29
tomshardware.com
2026-05-29
Bruno Ferreira
Call of Duty Modern Warfare 4 drops older consoles and promises extensive optimization and PC-specific options
2026-05-29
news.synopsys.com
2026-05-29
Synopsys
SUNNYVALE, Calif., May 28, 2026 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) today announced at Samsung Advanced Foundry Ecosystem (SAFE) Forum 2026 its latest collaborations with Samsung Foundry on advanced nodes, including an expanded portfolio of production‑ready, AI-powered EDA tools, certified interface IP, and silicon-based test capabilities, enabling customers to bring differentiated AI an
2026-05-29
sg.finance.yahoo.com
2026-05-29
Yahoo Finance Singapore
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2026-05-29
www.morningstar.com
2026-05-29
Morningstar
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PR Newswire
Synopsys Advances Power and Performance for AI and Multi-Die Designs on Latest Samsung Foundry Processes at SAFE Forum 2026
Synopsys Advances Power and Performance for AI and Multi-Die Designs on Latest Samsung Foundry Processes at SAFE Forum 2026
Provided by PR Newswire May 29, 2026, 1:00:00 AM
Synopsys Advances Power and Performance for AI and Multi-Die Designs on Latest S
2026-05-28
news.google.com
2026-05-28
Business Wire
2026-05-28
www.eurekalert.org
2026-05-28
EurekAlert!
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2026-05-28
www.asiaresearchnews.com
2026-05-28
Asia Research News |
□ Professor Hyuk-Jun Kwon's research team at the Department of Electrical Engineering and Computer Science, DGIST (President Kunwoo Lee), has developed a new optical doping technology that precisely controls the electrical properties of two-dimensional (2D) semiconductors using light. This research is expected to contribute to the development of next-generation ultra-compact and high-density semic