Semiconductor News & Analysis Feed
988 articles
2026-06-16
digitimes.com
2026-06-16
Nvidia launched a sale of US$25 billion worth of high-grade bonds on June 15, ultimately garnering up to US$85 billion in orders, or more than triple the bond's original size. This is one of several debt offerings this year from tech giants, which are responding to investor excitement and a need for cash to capitalize on the AI boom.
2026-06-16
digitimes.com
2026-06-16
Global semiconductor manufacturing equipment sales reached a record US$36.55 billion in the first quarter of 2026, driven by AI-related investment in advanced logic, DRAM, and advanced packaging capacity, according to the latest Worldwide Semiconductor Equipment Market Statistics report from SEMI.
2026-06-16
digitimes.com
2026-06-16
ASML, TSMC, and imec have demonstrated a major advance in the effort to bring two-dimensional (2D) semiconductor materials from research laboratories into high-volume semiconductor manufacturing. At the 2026 IEEE/JSAP Symposium on VLSI Technology and Circuits, the partners unveiled a 300mm wafer integration flow that produced both n-type and p-type 2D-material transistors at a 50nm contacted poly
2026-06-16
www.barchart.com
2026-06-16
Barchart.com
Nvidia logo by Konstantin Savusia via Shutterstock
Nvidia (NVDA) stock is extending gains on Monday after the artificial intelligence (AI) behemoth revealed plans of raising at least $20 billion via a seven-tranche bond offering — its first since 2021.
Wall Street giants JPMorgan, Goldman Sachs, and Morgan Stanley are leading the sale, with bond maturities extending up to 30 years.
According
2026-06-16
tomshardware.com
2026-06-16
Anton Shilov
AMD acquires MEXT to get Predictive Memory Engine that offloads infrequently accessed data from DRAM to NAND storage.
2026-06-16
wccftech.com
2026-06-16
Wccftech
US-based AI company, Tensordyne, has announced the successful tape-out of its Napier chip, which it claims to demolish NVIDIA's Blackwell & Rubin chips with leading token throughput and efficiency.
The Napier chip will be the core component of the Tensordyne Napier TDN system, which is designed in collaboration with Broadcom and HPE Juniper Networks. The Napier platform has one goal: to unify AI
2026-06-16
wccftech.com
2026-06-16
Wccftech
The compact space inside smartphones makes it difficult to adopt High Bandwidth Memory (HBM), not to mention the thermal problem, but a rumor claims that Chinese smartphone brands have a custom-made Low Latency Wide DRAM (LLW) that adopts a similar integrated design as the aforementioned technology. While the design isn’t “true HBM,” it aims to resolve the performance bottleneck issue that LPDDR R
2026-06-15
www.moomoo.com
2026-06-15
Moomoo
__fail__
2026-06-15
tomshardware.com
2026-06-15
Luke James
China's Supreme People's Court on Friday upheld an injunction prohibiting Infineon from selling disputed GaN products in mainland China.
2026-06-15
www.tomshardware.com
2026-06-15
Tom's Hardware
Tech Industry
China's supreme court bans Infineon from selling GaN power chips in China — market-leader Innoscience secures major victory in multi-region patent war
News
By Luke James published 37 minutes ago
Two suppliers building Nvidia's 800V AI-rack power chips now block each other from key markets.
(Image credit: Getty / Pla2na)
Share this article
0
Join the conversation
Follow us
Add us as
2026-06-15
www.msn.com
2026-06-15
MSN
Nvidia (NVDA) is looking to raise at least $20B from a bond offering that could see maturities range from two to 30 years, Bloomberg reported.
The offering is being marketed in seven tranches, the news outlet added, citing people familiar with the matter. It would be Nvidia's first bond offering since 2021.
J.P. Morgan (JPM), Morgan Stanley (MS) and Goldman Sachs (GS) are working on the offering.
2026-06-15
cryptobriefing.com
2026-06-15
Crypto Briefing
Nvidia plans to raise at least $20B from bond sale as AI chip demand surges
The GPU giant is reportedly tapping high-grade debt markets in what would be its largest bond offering ever
2026-06-15
tomshardware.com
2026-06-15
Mark Tyson
Today marks 15 years since the first Chromebooks hit the market.
2026-06-15
www.moomoo.com
2026-06-15
Moomoo
__fail__
2026-06-15
www.trendforce.com
2026-06-15
TrendForce
[News] TSMC CoWoS Supply-Demand Gap Reportedly Seen Narrowing from 20% to 10% by End-2026
2026-06-15 Semiconductors editor
News
Please note that this article cites information from Economic Daily News, Reuters. and Commercial Times.
TSMC continues to accelerate its advanced packaging capacity expansion, helping move the industry closer to supply-demand balance. According to Economic Dail
2026-06-15
www.marketscreener.com
2026-06-15
marketscreener.com
Access Denied
You don't have permission to access "http://www.marketscreener.com/news/citigroup-adjusts-price-target-on-texas-instruments-to-345-from-280-maintains-buy-rating-ce7f5cdedb8af324" on this server.
Reference #18.d3432417.1781518796.237db17e
https://errors.edgesuite.net/18.d3432417.1781518796.237db17e
2026-06-15
www.benzinga.com
2026-06-15
Benzinga
Unfortunately your device has been prevented from accessing our system because of security concerns.
If you believe you are reaching this message in error please contact Benzinga Support at 1-877-440-9464 or email support@benzinga.com and please provide the ID number 47.253.216.184 to support.
2026-06-15
www.trendforce.com
2026-06-15
TrendForce
[News] Infineon Found to Infringe Innoscience GaN Patent, Barred from Selling Certain Products in China
2026-06-15 Semiconductors editor
News
Please note that this article cites information from Innoscience.
Innoscience announced that China’s Supreme People’s Court has upheld a sales injunction against certain gallium nitride (GaN) products manufactured by Infineon Technologies AG, bring
2026-06-15
www.digitimes.com
2026-06-15
digitimes
As global semiconductor supply chains are rebuilt, Southeast Asia is evolving from a back-end test-and-pack region into a resilient, multi-center advanced packaging and equipment ecosystem, according to industry participants. Migration drivers include pushes...
Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time
2026-06-15
www.insidermonkey.com
2026-06-15
Insider Monkey
NEWS
Applied Materials (AMAT) Gets Higher Price Targets from Barclays and Cantor Fitzgerald
Published on June 15, 2026 at 1:16 am by VARDAH GILL in News
SHARE
Applied Materials, Inc. (NASDAQ:AMAT) is included among Billionaire Larry Robbins’ 10 Dividend Stock Picks.
On June 11, Barclays raised the firm’s price recommendation on Applied Materials, Inc. (NASDAQ:AMAT) to $590 from $500. It reiterat