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278 articles
2026-06-17
www.newswise.com
2026-06-17
Newswise
Credit: Korea Institute of Machinery and Materials (KIMM)
Senior Researcher Hyeong-U Kim of the Semiconductor Manufacturing Research Center, Autonomous Manufacturing Research Division, Korea Institute of Machinery and Materials (KIMM)
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Newswise — A technology has been developed that enables artificial intelligence (AI) to autonomously analyze and control ultra-th
2026-06-17
marklapedus.substack.com
2026-06-17
Semiecosystem
Intel Foundry Describes New 18A-P Process
The 2nm-class process enables high-performance chips. It features a dual contact, low resistance transistor option
SEMIECOSYSTEM
JUN 17, 2026
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By Mark LaPedus
At this week’s VLSI Symposium, Intel Foundry provided an update on its process roadmap, including the status of its new 18A-P technology.
Targeted for the foundry market, Intel’s 18A-P p
2026-06-16
www.thefpsreview.com
2026-06-16
The FPS Review
NVIDIA/Intel Partnership Could See an x86 Processor Paired with RTX Graphics Released by 2028
NEWS
TECH
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Peter Brosdahl
June 16, 2026
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The FPS Review may receive a commission if you purchase something after clicking a link in this article.
Image: NVIDIA
A new rumor states that NVIDIA and Intel could be working together to develop a new type of x86 CPU with integrated RTX graphics. At on
2026-06-16
tomshardware.com
2026-06-16
Anton Shilov
Next-generation data center processors from AMD and Intel with 16 DDR5 memory channels are even bigger than today’s designs.
2026-06-16
tomshardware.com
2026-06-16
Anton Shilov
CoPoS may enable larger chips, but CoWoS is still better.
2026-06-16
www.tomshardware.com
2026-06-16
Tom's Hardware
Tech Industry Manufacturing Semiconductors
TSMC says panel packaging won't replace CoWoS anytime soon for the largest future AI processors — wafer-level tech can scale to 58 massive dies in one package
News
By Anton Shilov published 16 hours ago
CoPoS may enable larger chips, but CoWoS is still better.
(Image credit: Intel)
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2026-06-16
news.google.com
2026-06-16
EE Times Asia
2026-06-16
digitimes.com
2026-06-16
Global expansion in AI chips, advanced logic processes, and multilayer 3D NAND flash memory is driving demand for tungsten hexafluoride (WF6), a critical electronic specialty gas used in semiconductor manufacturing. Limited short-term supply additions and low industry inventories are widening the supply-demand gap, triggering a rapid price increase.
2026-06-16
digitimes.com
2026-06-16
ASML, TSMC, and imec have demonstrated a major advance in the effort to bring two-dimensional (2D) semiconductor materials from research laboratories into high-volume semiconductor manufacturing. At the 2026 IEEE/JSAP Symposium on VLSI Technology and Circuits, the partners unveiled a 300mm wafer integration flow that produced both n-type and p-type 2D-material transistors at a 50nm contacted poly
2026-06-16
markets.businessinsider.com
2026-06-16
markets.businessinsider.com
Shenzhen, China, June 15, 2026 (GLOBE NEWSWIRE) -- Shenzhen Jewellok Technology Co., Ltd., a leading manufacturer of ultra-high purity fluid control and gas delivery solutions, today announced the continued expansion of its advanced product portfolio, including the VMB Gas Cabinet, Gas Changeover Manifold, and bulk chemical delivery system (CDS) technologies designed for semiconductor, photovoltai
2026-06-15
www.techpowerup.com
2026-06-15
TechPowerUp
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2026-06-15
www.gadgets360.com
2026-06-15
Gadgets 360
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2026-06-15
www.gadgets360.com
2026-06-15
Gadgets 360
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2026-06-15
www.tweaktown.com
2026-06-15
TweakTown
Google is in talks with Samsung to build next-gen 'Icefish' TPU on 1.4nm and 2nm process split
Google's Icefish TPU may be split between Samsung and TSMC, with 1.4nm compute dies and 2nm memory I/O targeting a 2028 production timeline.
VIEW GALLERY - 3
Hassam Nasir
Tech Reporter
Published Jun 14, 2026 8:30 PM CDT
2-minute read time
TL;DR: Google is reportedly planning a multi-foundry strategy fo
2026-06-15
digitimes.com
2026-06-15
South Korea's semiconductor equipment supply chain saw a material pickup in orders in the first half of 2026 as Samsung Electronics and SK Hynix accelerated investment in advanced DRAM and high-bandwidth memory (HBM4), generating demand across front-end tools, advanced packaging, and inspection equipment. The shift toward high-end process and packaging capabilities for AI memory has driven new con
2026-06-15
digitimes.com
2026-06-15
Samsung Electronics announced that its Exynos 2600 mobile application processor delivered more than double the on-device AI performance of the Exynos 2500, according to benchmark results released in June 2026. The company said the chip, manufactured on a 2nm foundry process and slated for Galaxy S26 standard and Plus models in early 2026, showed broad gains across natural language processing and i
2026-06-15
digitimes.com
2026-06-15
Equipment maker Manz recently announced the successful delivery of the world's first 310mm x 310mm panel-level packaging (PLP) electrochemical deposition (ECD) mass-production tool, further expanding its footprint in advanced packaging process equipment and demonstrating integrated capabilities spanning in-house R&D, process and system integration, and mass-production deployment.
2026-06-15
digitimes.com
2026-06-15
Google's push to diversify its Tensor Processing Units (TPUs) supply chain is increasingly reaching into the foundry side, adding pressure on ASIC makers such as MediaTek. Recent reports indicate that Google is not only set to adopt Intel's embedded multi-die interconnect bridge (EMIB) packaging for its next-generation product, but is also planning to bring in Samsung Electronics for front-end waf
2026-06-14
www.itpro.com
2026-06-14
IT Pro
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How InstaDeep improved its R&D and smoothed processes with Dell AI Factory with NVIDIA
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2026-06-14
digitimes.com
2026-06-14
Chunghwa Leading Photonics Tech, a subsidiary of Chunghwa Telecom, is set to list on the Taipei Emerging Stock Board. The company has recorded record-high revenue and gross margin in the first four months of 2026, boosted by rising demand in Industry 5.0 applications, advanced semiconductor process inspection, and AI data center optical communication. With short-wave infrared (SWIR) transmissive a