Semiconductor News & Analysis Feed
2353 articles
2026-05-25
www.techinasia.com
2026-05-25
Tech in Asia
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Tata Electronics plans to start chip packaging for global automotive and industrial clients at its new OSAT plant in Jagiroad, Assam, ahead of a wider ramp-up later this year, people familiar with the matter said.
OSAT, or outsourced semiconductor assembly and test, refers to packaging, testing, and inspection af
2026-05-25
simplywall.st
2026-05-25
simplywall.st
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2026-05-25
digitimes.com
2026-05-25
Lam Research CEO Tim Archer said artificial intelligence and robotics can help chipmakers improve fab productivity as the semiconductor industry faces memory capacity constraints, chip-scaling limits, and growing demand for faster equipment delivery.
2026-05-25
digitimes.com
2026-05-25
At its earnings conference, Weltrend Semiconductor described the first quarter of 2026 as an exceptional one. Despite the period being historically slow, the company posted year-over-year and sequential growth. Nearly all major product lines demonstrated strong growth momentum, with server-related products standing out in particular. Order visibility is now expected to remain strong throughout the
2026-05-25
digitimes.com
2026-05-25
Nan Pao Resins Chemical is accelerating its push into the high-end semiconductor materials market through a joint venture with Advanced Echem Materials Company and Trusval Technology, forming Advanced Pao Trusval Technology to target advanced packaging adhesive materials.
2026-05-25
digitimes.com
2026-05-25
The shift toward 800V high-voltage direct current (HVDC) power architectures in AI data centers is driving a surge in demand for power semiconductors, boosting shipments for Taiwanese lead frame suppliers SDI Corporation and Jih Lin Technology and raising expectations for double-digit revenue growth in 2026.
2026-05-25
digitimes.com
2026-05-25
Huawei is using self-developed packaging technology to build ultra-high-capacity enterprise SSDs, underscoring how Chinese technology companies are increasingly turning to advanced packaging and system-level engineering to navigate US semiconductor restrictions.
2026-05-25
digitimes.com
2026-05-25
As the global semiconductor industry confronts the limits of Moore's Law, Huawei has unveiled a new roadmap aimed at extending chip performance growth through architecture, interconnect, and system-level optimisation rather than pure transistor miniaturisation.
2026-05-25
digitimes.com
2026-05-25
Cyient Semiconductors has secured a total of about US$30 million in financing from Edelweiss-managed funds and co-investors, comprising a US$10 million equity investment at a valuation of roughly US$500 million alongside structured debt. The deal bolsters its capital base to scale its power semiconductor and custom silicon offerings for global AI markets.
2026-05-25
simplywall.st
2026-05-25
simplywall.st
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2026-05-25
finance.yahoo.com
2026-05-25
Yahoo Finance
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2026-05-24
www.investing.com
2026-05-24
Investing.com
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2026-05-24
koreajoongangdaily.joins.com
2026-05-24
Korea JoongAng Daily
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2026-05-24
www.ad-hoc-news.de
2026-05-24
AD HOC NEWS
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2026-05-24
www.quiverquant.com
2026-05-24
Quiver Quantitative
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2026-05-24
www.thelec.net
2026-05-24
thelec.net
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2026-05-24
www.marketbeat.com
2026-05-24
MarketBeat
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2026-05-24
www.marketbeat.com
2026-05-24
MarketBeat
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2026-05-24
www.marketbeat.com
2026-05-24
MarketBeat
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2026-05-24
www.marketbeat.com
2026-05-24
MarketBeat
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