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Watch SK Hynix, Micron Join $1 Trillion Market Cap Club | The Asia Trade 5/27/2026 - Bloomberg.com

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www.bloomberg.com 2026-05-27 Bloomberg.com

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From boom-bust to structural growth? Memory's US$1 trillion moment puts AI thesis to the test

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digitimes.com 2026-05-27

First Micron, then SK Hynix, join the trillion-dollar club, capping an extraordinary repricing of an industry once dismissed as a commodity play. The milestone is more than a valuation story: it crystallizes a structural debate about whether AI has permanently transformed memory's earnings profile, a bubble concern as Chinese rivals ramp capacity, and a sharpening geopolitical contest over who con

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SK Hynix seeks to embed cooling inside HBM to beat the heat - digitimes

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www.digitimes.com 2026-05-27 digitimes

SK Hynix has unveiled a new high-bandwidth memory technology designed to reduce heat buildup in next-generation AI systems, as rising computing density turns thermal management into a more critical front for HBM suppliers. Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activate this

Semiconductor Memory Chip HBM Thermal Management AI Computing Storage SK Hynix Chip Design

TSMC and Micron's fabs expanding; how do Samsung and SK Hynix's bonus systems come into play? - digitimes

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www.digitimes.com 2026-05-27 digitimes

Samsung Electronics' 2026 tentative labor-management agreement is expected to pass after already surpassing an 86% voting participation rate within just three days. While the agreement has temporarily eased concerns over potential strikes, South Korea's... Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they

Semiconductor Manufacturing Wafer Fab Expansion TSMC Micron Technology Samsung Electronics SK Hynix Labor Management Labor-Management Agreement

SK hynix unveils heat-reducing HBM technology - 동아일보

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www.donga.com 2026-05-27 동아일보

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Semiconductor Memory Chip HBM Heat Dissipation Technology SK Hynix Storage Device Chip Manufacturing Technology Breakthrough

SK Hynix is embedding cooling into HBM memory to stop AI chips from overheating - TechSpot

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www.techspot.com 2026-05-27 TechSpot

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SK hynix Unveils 'iHBM' Technology to Reduce HBM Heat - thelec.net

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www.thelec.net 2026-05-27 thelec.net

SK hynix unveils its iHBM technology with enhanced thermal dissipation performance on May 26. (Source: SK hynix) SK hynix on May 26 unveiled a new thermal management technology called "iHBM," designed to address heat generation issues in high-bandwidth memory (HBM) products operating at increasingly higher speeds. The key feature of iHBM is an integrated thermal control component called ICE, emb

SK hynix HBM thermal management memory technology AI chips GPU semiconductor packaging 3D packaging

SK hynix unveils cooling-integrated HBM for AI systems - upi.com

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www.upi.com 2026-05-27 upi.com

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SK hynix heads toward the next milestone, unveiling new iHBM technology that sharply reduces heat - 매일경제

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www.mk.co.kr 2026-05-27 매일경제

사진 확대 [Photo courtesy of Yonhap News] SK hynix has unveiled a new iHBM technology that dramatically reduces heat by embedding Integrated Cooling Elements (ICE) in High Bandwidth Memory (HBM) packages. HBM is a core component of AI semiconductors, but as each new generation stacks more layers and demands for speed continue to rise, heat generation has emerged as the biggest challenge. ICE is a co

SK hynix HBM technology heat dissipation AI semiconductors memory technology semiconductor materials packaging technology 3D stacking

KOSPI Surpasses 8,000 Led by Samsung, SK Hynix - 조선일보

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www.chosun.com 2026-05-26 조선일보

By Kwak Chang-yeol, Yoo Jane Published 2026.05.27. 00:51 SK Hynix, left, Samsung Electronics headquarters. /Yonhap The KOSPI closed above the 8,000-point mark for the first time in history. The KOSPI rose 2.55% from the previous day to 8,047.51 on the 26th, driven by gains of 2.2% and 5.7% in semiconductor "top two" companies Samsung Electronics and SK Hynix, respectively. Earlier, on the 15th

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SK Hynix Unveils iHBM to Cut AI Accelerator Heat - 조선일보

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www.chosun.com 2026-05-26 조선일보

By Seongmin K Published 2026.05.27. 00:34 Concept diagram of SK Hynix's iHBM technology. ICE, a thermal control element, serves as a passage for heat dissipation. /SK Hynix SK Hynix unveiled on the 26th its "iHBM" technology, which significantly reduces heat generation in high-bandwidth memory (HBM) used in AI accelerators. As demand for AI computations rises, the workload of HBM mounted on AI

SK Hynix iHBM High Bandwidth Memory AI Accelerator Thermal Management Chip Heat Dissipation Semiconductor Technology High Performance Computing

SK hynix unveils 'iHBM' thermal architecture that cools AI memory at the source — integrated cooling elements inside HBM interface cut thermal resistance by 30%, target next-gen HBM5 accelerators and dense AI data centers - Tom's Hardware

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www.tomshardware.com 2026-05-26 Tom's Hardware

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SK Hynix integrating cooling into next-gen high-bandwidth memory chips - Blocks & Files

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www.blocksandfiles.com 2026-05-26 Blocks & Files

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SK Hynix Unveils ‘iHBM’ Technology to Cut Heat in HBM Chips - bloomingbit

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en.bloomingbit.io 2026-05-26 bloomingbit