Semiconductor News & Analysis Feed
1611 articles
2026-05-26
www.asiae.co.kr
2026-05-26
아시아경제
Equipped with Cooling Component (ICE) Inside HBM Package
Over 30% Reduction in Thermal Resistance
Proven MR-MUF Process Applied
Amid the artificial intelligence (AI) boom, a game-changer has emerged to tackle the biggest challenge in semiconductor high-density integration: the 'heat generation' issue.
On May 26, SK hynix unveiled its next-generation memory technology, 'iHBM,' which maximize
2026-05-26
www.asiae.co.kr
2026-05-26
아시아경제
Equipped with Cooling Component (ICE) Inside HBM Package
Over 30% Reduction in Thermal Resistance
Proven MR-MUF Process Applied
Amid the artificial intelligence (AI) boom, a game-changer has emerged to tackle the biggest challenge in semiconductor high-density integration: the 'heat generation' issue.
On May 26, SK hynix unveiled its next-generation memory technology, 'iHBM,' which maximize
2026-05-26
simplywall.st
2026-05-26
simplywall.st
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2026-05-26
technode.global
2026-05-26
TNGlobal
SK hynix unveils ‘iHBM’ thermal solution to boost AI performance
MAY 26, 2026|BY LIUTENG
Enhances heat dissipation by integrating ICEs into the HBM package
Reduces thermal resistance by 30%, ensuring stable chip operation in demanding high-temperature and high-pressure environments
Lowers barriers to adoption by leveraging market-proven MR–MUF technology, featuring high design compatibility
SEOUL
2026-05-26
www.techpowerup.com
2026-05-26
TechPowerUp
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2026-05-26
biz.chosun.com
2026-05-26
Chosunbiz
By
Hwang Min-gyu
Published 2026.05.26. 09:13
A concept diagram of iHBM technology released by SK hynix. /Courtesy of SK hynix
SK hynix unveiled next-generation technology that reduces heat by inserting a cooling element inside a high bandwidth memory (HBM) package.
On the 26th, SK hynix said it introduced "iHBM," a technology that embeds an integrated cooling element, ICE, in an HBM package. IC
2026-05-26
digitimes.com
2026-05-26
Kioxia is targeting 2027 production of its 10th-generation BiCS 10 NAND, a move that could help the Japanese memory maker narrow its technology gap with Samsung Electronics and SK Hynix as the South Korean rivals delay investment in their own next-generation NAND technologies, according to ZDNet Korea.
2026-05-26
digitimes.com
2026-05-26
Heat management has become a critical challenge as HBM technology advances, with higher stacking and faster speeds to meet surging global demand for AI data processing. Efficient control of power density in the die-to-die physical layer between HBM and GPUs is now central to next-generation HBM competitiveness and data center reliability.
2026-05-26
www.prnewswire.com
2026-05-26
PR Newswire
SK hynix unveils 'iHBM' thermal solution to boost AI performance
NEWS PROVIDED BY
SK hynix Inc.
May 25, 2026, 19:39 ET
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Enhances heat dissipation by integrating ICEs into the HBM package
Reduces thermal resistance by 30%, ensuring stable chip operation in demanding high-temperature and high-pressure environments
Lowers barriers to adoption by leveraging market-proven MR–
2026-05-26
markets.ft.com
2026-05-26
Financial Times
SEOUL, South Korea , May 25, 2026 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today the launch of the iHBM solution that embeds integrated cooling elements(ICEs)[1] within the high-bandwidth memory(HBM) package for next-generation HBM products.
[1] ICE(Integrated Cooling Elements): A cooling element made of electrically non-conductive, thermally conductive silicon-
2026-05-26
sg.finance.yahoo.com
2026-05-26
Yahoo Finance Singapore
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2026-05-26
koreajoongangdaily.joins.com
2026-05-26
Korea JoongAng Daily
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2026-05-25
news.az
2026-05-25
Latest news from Azerbaijan
Foreign investors sold more than 10 trillion won (US$6.6 billion) worth of shares in Samsung Electronics and SK hynix last week, extending their net-selling streak in the South Korean stock market to 12 consecutive trading sessions, data showed Monday, News.Az reports, citing Yonhap.
Foreign investors offloaded a net 5.33 trillion won worth of SK hynix shares and 5.26 trillion won worth of Samsun
2026-05-25
www.benzinga.com
2026-05-25
Benzinga
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2026-05-25
finance.yahoo.com
2026-05-25
Yahoo Finance
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2026-05-25
en.bloomingbit.io
2026-05-25
bloomingbit
Samsung, SK Hynix Single-Stock 2x Leverage Products to Debut May 27; Regulators Warn of Short-Term Crowding Risk
Published 1:44 AM May 25, 2026
Source
Korea Economic Daily
Summary
About STAT AI
Single-stock leveraged products tied to Samsung Electronics and SK Hynix are set to list on May 27, and financial regulators said they carry a high-risk structure.
Regulators warned that the products trac
2026-05-25
www.chosun.com
2026-05-25
조선일보
By Yoo Jane
Published 2026.05.25. 13:22
Updated 2026.05.25. 16:00
A single-stock leveraged product betting 2x on Samsung Electronics and SK Hynix launches on the 27th. /Gemini
On the 27th, South Korea’s first single-stock leveraged and inverse exchange-traded product (ETP) will be launched. Investor interest is growing as products tracking major domestic semiconductor stocks like Samsung Electro
2026-05-25
www.koreaherald.com
2026-05-25
The Korea Herald
Asia strategist Mixo Das keeps Korea as Asia top pick, backs Kospi 10,000 call on AI, earnings momentum
Mixo Das, JPMorgan Chase & Co. Asia equity and quant strategist. (JPMorgan Chase & Co.)
JPMorgan Chase & Co. Asia equity and quant strategist Mixo Das says South Korea's stock rally still has room to run, as the artificial intelligence-driven memory cycle, earnings upgrades and governance refo
2026-05-25
koreajoongangdaily.joins.com
2026-05-25
Korea JoongAng Daily
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2026-05-25
www.koreatimes.co.kr
2026-05-25
The Korea Times
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