Semiconductor News & Analysis Feed

1012 articles
2026-06-18
digitimes.com 2026-06-18
Samsung Electronics and SK Hynix are each reviewing locations in South Korea's Honam region for new semiconductor packaging plants, according to The Elecand Hankyung, citing industry sources, as the two companies look for ways to add back-end capacity beyond their existing manufacturing hubs.
2026-06-18
digitimes.com 2026-06-18
Samsung Electronics has demonstrated a 3D stacked transistor structure with a 42-nanometer gate pitch, a research milestone that extends vertical integration, long used in memory chips, into logic semiconductors.
2026-06-18
digitimes.com 2026-06-18
Samsung Electronics is developing and operating a data-sharing platform with semiconductor materials, components and equipment suppliers, according to a report by South Korea's ETNews, which cited industry sources.
2026-06-18
www.thelec.net 2026-06-18 thelec.net
ISTE's FOUP cleaner for HBM back-end processes. (Photo: ISTE) ISTE announced on June 17 that it has received an initial order from Samsung Electronics for front-opening unified pod (FOUP) cleaning equipment designed for high-bandwidth memory (HBM) manufacturing. The deal adds Samsung to ISTE's customer base alongside SK hynix. FOUP cleaners are used to remove contaminants from the sealed carrier
2026-06-17
tomshardware.com 2026-06-17 Zhiye Liu
Chinese memory brands Gloway and KingBank have begun using homemade chips to produce DDR5 memory kits in lieu of Samsung, Micron, or SK hynix DRAM.
2026-06-17
www.tomshardware.com 2026-06-17 Tom's Hardware
PC Components RAM Chinese memory brands ditch Samsung and Micron for homegrown CXMT and YMTC silicon — Corsair, HP, and Dell are already adopting the China-produced DDR5 chips News By Zhiye Liu published 5 hours ago Some Chinese module makers are turning their backs on the big three RAM suppliers. (Image credit: Getty Images) Share this article 1 Join the conversation Follow us Add us as a pref
2026-06-17
www.investing.com 2026-06-17 Investing.com
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2026-06-17
asia.nikkei.com 2026-06-17 Nikkei Asia
Demand for AI infrastructure strains advanced capacity of market leader TSMC Samsung's advanced chipmaking services are gaining more attention as the AI boom strains rivals' production capacity. (Nikkei montage/Source photos by Ken Kobayashi and Reuters) TAIPEI/HONG KONG/SEOUL -- BYD, Google, AMD, Tesla and others are looking increasingly to Samsung Electronics for contract chipmaking services a
2026-06-17
digitimes.com 2026-06-17
Samsung Electro-Mechanics (Semco) is rapidly gaining ground in the silicon capacitor market as AI infrastructure investment and technology upgrades accelerate demand. After landing its first major silicon capacitor order, the company is in talks with additional potential customers, while its multilayer ceramic capacitor (MLCC) business is also expanding and operating profit is expected to hit a re
2026-06-17
digitimes.com 2026-06-17
Nvidia is expected to surpass Apple and Samsung Electronics' mobile division to become the world's top buyer of LPDDR, as AI servers and AI PCs pull low-power memory beyond smartphones, MoneyTodayreported, citing electronics industry sources.
2026-06-17
digitimes.com 2026-06-17
Semiconductor materials suppliers are moving to rebuild depleted inventories and recover sharply higher costs from Samsung Electronics, SK Hynix and other memory chip customers after the 106-day US-Iran war strained supply chains for precursors, specialty gases and other key chipmaking inputs.
2026-06-17
digitimes.com 2026-06-17
Global chip buyers, including BYD, Google, AMD, and Tesla, are turning to Samsung Electronics as TSMC's advanced production lines remain fully booked, Nikkei Asiareported. The shift underscores how AI demand and supply-chain risk are reshaping where cutting-edge chips are made.
2026-06-17
semiconductor.samsung.com 2026-06-17 Samsung Semiconductor
Click here to learn more about Samsung Foundry Forum & SAFE™. Click here to learn more about Samsung Foundry Forum & SAFE™. Click here to learn more about Samsung Foundry Forum. Samsung Foundry Forum 더 알아보려면 여기를 클릭하세요 Samsung Foundry Forum についての詳細はここをクリックして下さい 点击这里了解更多关于 Samsung Foundry Forum & SAFE™ Samsung Electronics' Semiconductor Research Center pre
2026-06-16
memeburn.com 2026-06-16 Memeburn
TL;DR Google is reportedly in talks with Samsung to help manufacture its future AI chip, codenamed Icefish. TSMC will likely remain the primary producer, but capacity constraints are pushing Google to diversify suppliers. The move highlights how the AI boom is reshaping the global semiconductor industry and supply chains. Google could soon give Samsung a major role in building one of its most ad
2026-06-16
wccftech.com 2026-06-16 Wccftech
Memory makers are now adopting domestically produced larger size DDR5 memory chips for their DDR5 modules. Instead of depending on the three memory giants, such as Samsung, Micron, and SK Hynix, some memory vendors in China are now adopting domestically produced DDR5 chips. As per IT Home, two vendors known as Gloway and KingBank have introduced their latest DDR5 memory modules, using the 24 Gb m
2026-06-16
news.google.com 2026-06-16 Business Wire
2026-06-16
news.google.com 2026-06-16 Business Wire
2026-06-16
wccftech.com 2026-06-16 Wccftech
The memory requirements of experiencing the entire Siri AI features suite will eventually force Apple to introduce a minimum of 12GB LPDDR5X RAM for its iPhone 18 lineup, but more importantly, is how increased demand for these devices will contribute to the existing memory crisis while making a handful of suppliers wealthy in the process.
2026-06-16
semiconductor.samsung.com 2026-06-16 Samsung Semiconductor
Click here to learn more about Samsung Foundry Forum & SAFE™. Click here to learn more about Samsung Foundry Forum & SAFE™. Click here to learn more about Samsung Foundry Forum. Samsung Foundry Forum 더 알아보려면 여기를 클릭하세요 Samsung Foundry Forum についての詳細はここをクリックして下さい 点击这里了解更多关于 Samsung Foundry Forum & SAFE™ AI technology is accelerating innovation across all in
2026-06-16
digitimes.com 2026-06-16
SK Hynix moved closer to shipping seventh-generation high-bandwidth memory, HBM4E, to key customers as timing emerged as a critical competitive factor in the global memory market. According to Newsis, industry sources reported that SK Hynix had recently made positive progress in HBM4E development and was preparing to send samples soon, with shipments possibly beginning in June 2026 and no later th