Semiconductor News & Analysis Feed
1014 articles
2026-05-29
wtvbam.com
2026-05-29
WTVB
By Heekyong Yang
SEOUL, May 29 (Reuters) – Samsung Electronics on Friday said it started shipping samples of its latest high-bandwidth memory (HBM) chip to customers, pulling ahead of rivals in distributing a new version of the product critical to AI data centers and sending its shares higher.
The South Korean tech company said the new chip, the 12-layer HBM4E, is more than 20% faster than its
2026-05-29
whtc.com
2026-05-29
WHTC
By Heekyong Yang
SEOUL, May 29 (Reuters) – Samsung Electronics on Friday said it started shipping samples of its latest high-bandwidth memory (HBM) chip to customers, pulling ahead of rivals in distributing a new version of the product critical to AI data centers and sending its shares higher.
The South Korean tech company said the new chip, the 12-layer HBM4E, is more than 20% faster than its
2026-05-29
digitimes.com
2026-05-29
Samsung Electronics has started shipping samples of its latest high-bandwidth memory (HBM) chip, the 12-layer HBM4E, marking the industry's first delivery of the next-generation AI memory product, according to the company. The move underscores intensifying competition among memory suppliers as demand accelerates for higher-performance components used in AI computing systems.
2026-05-29
digitimes.com
2026-05-29
AI demand for high-performance chips is driving up orders for semiconductor silicon capacitors, or Si-Caps, with Samsung Electro-Mechanics and several Taiwanese memory makers emerging as key names to watch. Supply-chain sources say the shift could reshape who captures future demand for advanced packaging.
2026-05-29
www.reuters.com
2026-05-29
Reuters
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2026-05-29
news.samsung.com
2026-05-29
samsung.com
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2026-05-29
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2026-05-29
GuruFocus
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2026-05-29
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2026-05-29
Seeking Alpha
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2026-05-29
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2026-05-29
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2026-05-29
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2026-05-29
TradingView
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2026-05-29
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2026-05-29
The Information
2026-05-29
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2026-05-29
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2026-05-29
news.synopsys.com
2026-05-29
Synopsys
SUNNYVALE, Calif., May 28, 2026 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) today announced at Samsung Advanced Foundry Ecosystem (SAFE) Forum 2026 its latest collaborations with Samsung Foundry on advanced nodes, including an expanded portfolio of production‑ready, AI-powered EDA tools, certified interface IP, and silicon-based test capabilities, enabling customers to bring differentiated AI an
2026-05-29
www.datacenterdynamics.com
2026-05-29
Data Center Dynamics
Synopsys has partnered with Samsung Foundry to expand its portfolio of production-ready, AI-powered EDA tools, certified interface IP, and silicon test capabilities.
According to the companies, these new offerings will allow customers to bring AI and multi-die designs to market faster and with “measurably improved” quality.
– Synopsys
The updates were announced during the Samsung Advanced Found
2026-05-29
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2026-05-29
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2026-05-29
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2026-05-29
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2026-05-29
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2026-05-29
Morningstar
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Synopsys Advances Power and Performance for AI and Multi-Die Designs on Latest Samsung Foundry Processes at SAFE Forum 2026
Synopsys Advances Power and Performance for AI and Multi-Die Designs on Latest Samsung Foundry Processes at SAFE Forum 2026
Provided by PR Newswire May 29, 2026, 1:00:00 AM
Synopsys Advances Power and Performance for AI and Multi-Die Designs on Latest S
2026-05-29
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2026-05-29
Stock Titan
2026-05-29
sg.finance.yahoo.com
2026-05-29
Yahoo Finance Singapore
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2026-05-29
www.fool.com
2026-05-29
The Motley Fool
The artificial intelligence (AI) revolution extends far beyond which chip designer makes the best graphics processing units (GPUs). At the core of AI workloads are memory and storage -- the DRAM and high-bandwidth memory (HBM) chips that keep massive training clusters fed with data at high speeds. As data centers scale to support larger AI models, memory demand is shifting from cyclical commodity