Semiconductor News & Analysis Feed
164 articles
2026-06-19
digitimes.com
2026-06-19
Samsung Electronics' foundry business has signed a strategic manufacturing collaboration with Claros, a US power-management startup, to produce semiconductors designed to cut energy waste inside AI data centers, according to a Claros announcement and a report by ZDNet Korea.
2026-06-18
digitimes.com
2026-06-18
Samsung Electronics has demonstrated a 3D stacked transistor structure with a 42-nanometer gate pitch, a research milestone that extends vertical integration, long used in memory chips, into logic semiconductors.
2026-06-18
digitimes.com
2026-06-18
Samsung Electronics is developing and operating a data-sharing platform with semiconductor materials, components and equipment suppliers, according to a report by South Korea's ETNews, which cited industry sources.
2026-06-18
digitimes.com
2026-06-18
Samsung Electronics' foundry division plans to open its Multi-Project Wafer, or MPW, service to its 2nm process next year, giving South Korean fabless chip designers access to one of the most advanced foundry nodes being commercialized without having to pay for a full wafer run, according to ZDNet Koreaand iNews24.
2026-06-18
digitimes.com
2026-06-18
Samsung Electronics is reportedly working with multiple partners to develop production equipment for its seventh-generation 10nm-class (1d) DRAM process. The company aims to begin tool installation as early as the second quarter of 2027, with initial volume production expected by the end of that year.
2026-06-18
digitimes.com
2026-06-18
Samsung Electronics and SK Hynix are each reviewing locations in South Korea's Honam region for new semiconductor packaging plants, according to The Elecand Hankyung, citing industry sources, as the two companies look for ways to add back-end capacity beyond their existing manufacturing hubs.
2026-06-18
www.thelec.net
2026-06-18
thelec.net
ISTE's FOUP cleaner for HBM back-end processes. (Photo: ISTE)
ISTE announced on June 17 that it has received an initial order from Samsung Electronics for front-opening unified pod (FOUP) cleaning equipment designed for high-bandwidth memory (HBM) manufacturing. The deal adds Samsung to ISTE's customer base alongside SK hynix.
FOUP cleaners are used to remove contaminants from the sealed carrier
2026-06-17
digitimes.com
2026-06-17
Nvidia is expected to surpass Apple and Samsung Electronics' mobile division to become the world's top buyer of LPDDR, as AI servers and AI PCs pull low-power memory beyond smartphones, MoneyTodayreported, citing electronics industry sources.
2026-06-17
digitimes.com
2026-06-17
Semiconductor materials suppliers are moving to rebuild depleted inventories and recover sharply higher costs from Samsung Electronics, SK Hynix and other memory chip customers after the 106-day US-Iran war strained supply chains for precursors, specialty gases and other key chipmaking inputs.
2026-06-17
digitimes.com
2026-06-17
Global chip buyers, including BYD, Google, AMD, and Tesla, are turning to Samsung Electronics as TSMC's advanced production lines remain fully booked, Nikkei Asiareported. The shift underscores how AI demand and supply-chain risk are reshaping where cutting-edge chips are made.
2026-06-16
digitimes.com
2026-06-16
Samsung Electronics' foundry business is reportedly expanding its strategic relationship with companies led by Elon Musk, with cooperation now spanning electric vehicles and emerging neurotechnology, according to Hankyungreporting.
2026-06-16
digitimes.com
2026-06-16
Apple is stepping up the AI capabilities of its Siri voice assistant, and analysts say memory chip demand will rise along with it, potentially benefiting Apple's suppliers such as Samsung Electronics and SK Hynix. The shift could drive both shipment growth and higher prices for mobile DRAM.
2026-06-16
digitimes.com
2026-06-16
Samsung Electronics has secured key technology for a 5nm-class magnetoresistive random-access memory cell, according to Korean financial daily Sedaily, moving ahead just four months after presenting what it described as the world's first 8nm-class MRAM at an international conference.
2026-06-15
digitimes.com
2026-06-15
Google's push to diversify its Tensor Processing Units (TPUs) supply chain is increasingly reaching into the foundry side, adding pressure on ASIC makers such as MediaTek. Recent reports indicate that Google is not only set to adopt Intel's embedded multi-die interconnect bridge (EMIB) packaging for its next-generation product, but is also planning to bring in Samsung Electronics for front-end waf
2026-06-15
digitimes.com
2026-06-15
Samsung Electronics announced that its Exynos 2600 mobile application processor delivered more than double the on-device AI performance of the Exynos 2500, according to benchmark results released in June 2026. The company said the chip, manufactured on a 2nm foundry process and slated for Galaxy S26 standard and Plus models in early 2026, showed broad gains across natural language processing and i
2026-06-15
digitimes.com
2026-06-15
South Korea's semiconductor equipment supply chain saw a material pickup in orders in the first half of 2026 as Samsung Electronics and SK Hynix accelerated investment in advanced DRAM and high-bandwidth memory (HBM4), generating demand across front-end tools, advanced packaging, and inspection equipment. The shift toward high-end process and packaging capabilities for AI memory has driven new con
2026-06-15
digitimes.com
2026-06-15
Nvidia CEO Jensen Huang's recent trip to South Korea put the spotlight on the rivalry between Samsung Electronics and SK Hynix, while memory giant Micron crossed the US$1 trillion market-cap mark for the first time. That shift has also drawn global attention to Micron CEO Sanjay Mehrotra, whose rise began with a string of dramatic visa rejections 50 years ago.
2026-06-15
digitimes.com
2026-06-15
Samsung Electronics' foundry division chief told employees on June 12 that a return to profitability in the contract chipmaking business looks difficult next year, with 2028 emerging as a more likely timeline, Yonhap, ZDNet Korea,and Chosunreported.
2026-06-15
www.thelec.net
2026-06-15
thelec.net
Samsung Electronics' Onyang NanoCity. (Photo: Samsung Electronics)
Samsung Electronics and SK hynix are in discussions to build their first semiconductor back-end packaging plants in Korea's Honam region, according to industry sources, with multiple candidate locations under consideration.
According to industry sources on June 14, Samsung Electronics is reviewing Gwangju and Saemangeum as potent
2026-06-13
digitimes.com
2026-06-13
Samsung Electronics is set to hold its semiannual global strategy meeting from June 16 to 18, with executives expected to review a split operating environment: strong memory demand is supporting the chip business, while higher component costs are putting pressure on smartphones, PCs, and other consumer devices.