Semiconductor News & Analysis Feed

As transistor density scaling slows, chipmakers are leaning on advanced packaging to keep improving accelerator performance. A SemiAnalysis roundup of this year's IEEE Electronic Components and Technology Conference described a shift in which Intel, Marvell, TSMC, and others detailed new packaging approaches as packages themselves begin hitting limits.

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China’s CXMT Is Set to Challenge DRAM Incumbents CXMT IPO, SK Hynix, Micron, Samsung Competition, Process Node Deficit, China HBM, Wafer Adds, Memory LTAs RAY WANG, MYRON XIE, DYLAN PATEL, AND 3 OTHERS JUN 23, 2026 ∙ PAID 115 1 21 Share We were the first to describe the memory shortage coming from AI’s insatiable usage in reasoning and agentic flows in late 2024 on the newsletter. We have since p

SemiAnalysis has published the first teardown from its new in-house lab, focusing on the minimum local metal pitch on SMIC’s third-gen 7nm at 32.5nm.