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Intel announced that Seok-Hee Lee has been appointed Executive Vice President of Intel Foundry. Lee will report directly to Intel CEO Lip-Bu Tan. In this role, he will lead advanced packaging, system integration, back-end technology development, and back-end manufacturing. Intel said the appointment is part of the continued evolution of its foundry strategy and reflects the company’s move to esta

Intel Taps Semiconductor Veteran Seok-Hee Lee To Lead Advanced Packaging Push As Apple Deal Fuels Foundry Ambitions June 20, 2026 | by Samuel Nwite | 0 Intel has elevated semiconductor industry veteran Seok-Hee Lee to lead its advanced packaging operations, marking the company’s determination to rebuild its manufacturing business and position itself as a major beneficiary of the artificial intel

EXECUTIVE MOVES, NEWS, TECHNOLOGY Seok-Hee Lee Named Intel Foundry EVP by Jane Edwards June 19, 2026, 9:36 am Photo: Intel Seok-Hee Lee EVP Intel Foundry Intel has appointed Seok-Hee Lee as EVP of Intel Foundry Lee will oversee advanced packaging and back-end manufacturing CEO Lip-Bu Tan said Lee will help strengthen Intel’s system integration capabilities Intel has appointed Seok-Hee Lee, a s

Intel has appointed Seok-Hee Lee, the former chief executive of memory maker SK hynix and battery maker SK On, as executive vice president of Intel Foundry.

Tech Industry Intel hires former SK hynix chief Seok-Hee Lee to lead Intel Foundry advanced packaging — company establishing section as 'focused business with dedicated leadership' News By Luke James published June 19, 2026 Intel carves back-end packaging into a standalone business. (Image credit: Getty / Future Publishing) Share this article 0 Join the conversation Follow us Add us as a preferr

Intel taps Seok-Hee Lee to lead foundry packaging initiative The former SK hynix CEO returns to Intel after 15 years to run advanced packaging as a dedicated business unit

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Seok-Hee Lee appointed Intel EVP to lead advanced packaging Published on 18 June 2026 at 6:18 pm • Written by Chris Martin • Reading duration : 2 minutes · read 74 times © Seok-Hee Lee appointed Intel EVP to lead advanced packaging Share this post Intel has appointed Seok-Hee Lee as executive vice president of Intel Foundry, tasking him with leading the company’s advanced packaging, system inte

Intel has appointed semiconductor veteran Seok‑Hee Lee as executive vice president of its foundry contract manufacturing division to lead advanced packaging, system integration, and back‑end operations, sharpening its push into advanced packaging amid a resurgence under CEO Lip‑Bu Tan. June 18 (Reuters) - Intel on Thursday named Seok-Hee Lee executive vice president of its contract chip-manufactu