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2026-10-19
2026 IMPACT | SHINKO Reveals the Next Evolution of AI Advanced Packaging Substrates: From ABF and Glass Core to Hybrid RDL - semivision
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tspasemiconductor.substack.com
2026-10-19
2026-10-01
Shinko Electric acquires JDI's Mobara Fab to expand AI packaging capacity
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digitimes.com
2026-10-01
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