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2026-10-14
GlobalFoundries and TSMC Reach Multi-Year $2 Billion Agreement to Establish U.S.-Based Supply of Silicon Interposers for Advanced AI Packaging - Embedded Computing Design
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embeddedcomputing.com 2026-10-14
2026-10-09
GlobalFoundries and TSMC sign $2 billion agreement to provide silicon interposers for CoWoS advanced packaging. - 超能网
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www.expreview.com 2026-10-09
2026-10-09
GlobalFoundries to produce silicon interposers for TSMC's CoWoS in the US — Five-year agreement valued at $2 billion
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tomshardware.com 2026-10-09
2026-10-08
GlobalFoundries reaches agreement to establish U.S.-based supply of silicon interposers for advanced AI packaging - GlobalFoundries
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gf.com 2026-10-08
2026-07-20
Exclusive Interview: Inside VSMC's Singapore fab, where silicon interposers and power chips underpin AI growth
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digitimes.com 2026-07-20