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RTX Spark17 AI13 Automated Driving6 DLSS 54 Nemotron 3.5 Super VL4 HBM3 AI Agents3 SiC3 3nm2 AI models2 memory chips2 Advanced Packaging2
2026-10-16
ASE unveils 18 advanced packaging projects with three universities
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digitimes.com 2026-10-16
2026-10-15
SK Hynix reportedly ties US NAND fab plan to approval for chip equipment exports to China
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digitimes.com 2026-10-15
2026-10-15
Onsemi and Sungrow deepen battery storage tie-up as demand rises for grid power
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digitimes.com 2026-10-15
2026-10-15
AI chip complexity is widening opportunities for semiconductor equipment makers
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digitimes.com 2026-10-15
2026-10-09
More Than 20 Local Manufacturers Explore Opportunities With NY SMART I-Corridor - WRFA-LP 107.9 FM
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www.wrfalp.com 2026-10-09
2026-10-08
NVIDIA's DSX Ready Brings Power and Cooling Into the AI Factory Blueprint - Data Center Frontier
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www.datacenterfrontier.com 2026-10-08
2026-10-08
SK Hynix may encounter difficulties in hybrid bonding technology. - expreview.com
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www.expreview.com 2026-10-08
2026-10-08
Samsung and SK invest trillions in AI infrastructure and semiconductor facilities - Global Sources
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www.globalsources.com 2026-10-08
2026-10-08
Infineon completes acquisition of C2i to expand AI data center power capabilities
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digitimes.com 2026-10-08
2026-10-08
AUO subsidiary Darwin shifts toward high-end manufacturing, explores CPO and semiconductor opportunities
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digitimes.com 2026-10-08
2026-10-08
Lisa Su takes AMD's Korea ties beyond memory to AI
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digitimes.com 2026-10-08
2026-10-08
Planned U.S. chip tariffs to tie exemptions to local production, pressure Korea to invest more - Korea JoongAng Daily
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www.koreajoongangdaily.com 2026-10-08
2026-10-07
Cirrus Logic Acquires INVENTVM Semiconductor To Expand Mixed-Signal Power And Audio Capabilities - Pulse 2.0
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pulse2.com 2026-10-07
2026-10-07
SK hynix Reportedly Faces Difficulties in HBM Hybrid Bonding, Trailing Samsung - TechPowerUp
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www.techpowerup.com 2026-10-07
2026-10-06
MIPS deepens RISC-V ties with China despite US-China tech tensions
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digitimes.com 2026-10-06
2026-10-03
How US-China tech ties are deepening as RISC-V chips go mainstream - South China Morning Post
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www.scmp.com 2026-10-03
2026-10-02
Amazon and Synopsys ink multi-year billion-dollar deal in multi-year IP agreement to accelerate AI chip design efforts — Synopsys to adopt Amazon Bedrock to deploy AI agents, harnessing AWS compute and storage capabilities - Tom's Hardware
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www.tomshardware.com 2026-10-02
2026-10-02
From identifying promising technologies to creating new business opportunities: How SK hynix Ventures finds the path forward - SK hynix
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news.skhynix.com 2026-10-02
2026-10-02
JCET Group partners with Wuxi to advance 2.5D advanced packaging facilities - digitimes
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www.digitimes.com 2026-10-02
2026-10-02
TSMC, NTU deepen R&D ties through nearly 50 projects a year
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digitimes.com 2026-10-02