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2026-05-20
China's OSATs chase bigger role as AI chips strain packaging supply - digitimes
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www.digitimes.com 2026-05-20 digitimes
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2026-05-19
Imec CEO calls for stronger AI design push in EU's Chips Act - The Economic Times
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economictimes.indiatimes.com 2026-05-19 The Economic Times
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2026-05-19
Infineon OptiMOS power MOSFETs for efficient power control - AD HOC NEWS
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www.ad-hoc-news.de 2026-05-19 AD HOC NEWS
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2026-05-19
DB HiTek's power-chip push hits delay as stakes rise - digitimes
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www.digitimes.com 2026-05-19 digitimes
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2026-05-19
Nvidia’s Huang predicts China will open AI chip market over time - Latest news from Azerbaijan
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news.az 2026-05-19 Latest news from Azerbaijan
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2026-05-19
China market for Nvidia AI chips to open 'over time': CEO Jensen Huang - ET Telecom
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telecom.economictimes.indiatimes.com 2026-05-19 ET Telecom
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2026-05-19
Commentary: TSMC Arizona profit tops SMIC and UMC combined, fueled by three key drivers - digitimes
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www.digitimes.com 2026-05-19 digitimes
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2026-05-19
China Market For Nvidia AI Chips To Open 'Over Time': Huang - Barron's
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www.barrons.com 2026-05-19 Barron's
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2026-05-19
China market for Nvidia AI chips to open 'over time': Huang - Yahoo Finance
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finance.yahoo.com 2026-05-19 Yahoo Finance
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2026-05-19
Imec’s Patrick Vandenameele: Full-stack Innovation Is the Name of the Game
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eetimes.com 2026-05-19 Pat Brans
As AI pushes semiconductors toward new limits in energy, memory, and interconnects, imec’s CEO says future progress will depend on deep co-optimization across the entire computing stack.
Semiconductor InnovationAI ChipsSilicon PhotonicsChip StackingComputing ArchitectureMemory TechnologyInterconnect TechnologyQuantum Computing
2026-05-19
Samsung, SK Hynix face chipmaking chemical squeeze as China feedstock costs surge - digitimes
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www.digitimes.com 2026-05-19 digitimes
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2026-05-19
Tower Semiconductor: Estimates Likely Still Too Low (NASDAQ:TSEM) - Seeking Alpha
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seekingalpha.com 2026-05-19 Seeking Alpha
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2026-05-19
Nvidia CEO says he believes China market will open over time - Reuters
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www.reuters.com 2026-05-19 Reuters
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2026-05-18
Chronus Unveils Rumi, the First AI Mentor Designed to Scale and Enhance Human Mentorship - The Manila Times
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www.manilatimes.net 2026-05-18 The Manila Times
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2026-05-18
Samsung eyes HBM upgrade for future Exynos mobile chips - Daily Times
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dailytimes.com.pk 2026-05-18 Daily Times
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2026-05-18
SK Hynix speeds Yongin fab buildout as memory crunch fuels capacity race - digitimes
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www.digitimes.com 2026-05-18 digitimes
SK Hynix is accelerating construction at its Yongin Semiconductor Cluster, as a tightening memory market pushes South Korea's top chipmakers to move faster on long-term capacity plans.The article requires paid subscription.Subscribe Now
Semiconductor ManufacturingMemory ChipsChip CapacitySouth Korean SemiconductorsStorage MarketWafer Fab ConstructionSupply Chain TightnessSemiconductor Investment
2026-05-18
ASML, Tata Electronics Partner on India's First 300-mm Fab - EE Times
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news.google.com 2026-05-18 EE Times
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2026-05-18
TSMC's Japan fab signals a turning point for overseas manufacturing - digitimes
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www.digitimes.com 2026-05-18 digitimes
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2026-05-18
Samsung reportedly boosts 1b DRAM yields as Korean memory rivalry heats up - digitimes
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www.digitimes.com 2026-05-18 digitimes
Samsung Electronics has significantly improved yields for its latest DRAM technologies used in high-bandwidth memory (HBM), according toIT Chosun, underscoring the intensifying race among memory makers to secure leadership in AI-related...The article requires paid subscription.Subscribe Now
DRAMMemorySemiconductorSamsungHBMAI ChipsManufacturingYield
2026-05-18
Swancor and RobiChip partner to bring advanced packaging into robots and drones - digitimes
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www.digitimes.com 2026-05-18 digitimes
Swancor Holding and RobiChip Technology announced a strategic partnership to accelerate the adoption of advanced packaging materials and heterogeneous chip system integration in robots, robot dogs, and AI-powered platforms, the firms said at the forum on...The article requires paid subscription.Subscribe Now
Semiconductor PackagingRobotics TechnologyAI ChipsAdvanced Packaging MaterialsSmart ManufacturingChip IntegrationDrone ApplicationsAutomation Equipment