35 articles
2026-05-22
www.indexbox.io 2026-05-22 IndexBox
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2026-05-22
digitimes.com 2026-05-22
Alliance Material Co. (AMC), a Taiwan-based advanced semiconductor materials supplier, said its balance film anti-warpage material has entered customer validation and is expected to begin mass production in the second half of 2026, as AI chip demand drives a new wave of advanced packaging expansion.
2026-05-21
247wallst.com 2026-05-21 24/7 Wall St.
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2026-05-21
www.digitimes.com 2026-05-21 digitimes
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2026-05-21
digitimes.com 2026-05-21
SK Hynix is reportedly moving to reshape part of its Cheongju campus around wafer testing, a shift that underscores how high-bandwidth memory, or HBM, is putting new pressure on the back end of the chipmaking process.
2026-05-21
en.bloomingbit.io 2026-05-21 bloomingbit
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2026-05-20
sherwood.news 2026-05-20 Sherwood News
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2026-05-20
www.kitco.com 2026-05-20 KITCO
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2026-05-20
www.barchart.com 2026-05-20 Barchart.com
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2026-05-20
www.reuters.com 2026-05-20 Reuters
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2026-05-20
www.investors.com 2026-05-20 Investor's Business Daily
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2026-05-20
app.hedgeye.com 2026-05-20 Hedgeye
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2026-05-19
digitimes.com 2026-05-19
Flexible copper clad laminate (FCCL) manufacturer Asia Electric Material (AEM) said that its long-term investment in new product development has begun to yield results, with the company's operational focus shifting toward product promotion and customer sample certification in 2026. Its two major new products will target the semiconductor and artificial intelligence (AI) application markets.
2026-05-18
winbuzzer.com 2026-05-18 WinBuzzer
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2026-05-18
www.indexbox.io 2026-05-18 IndexBox
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2026-05-18
seekingalpha.com 2026-05-18 Seeking Alpha
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2026-05-18
www.digitimes.com 2026-05-18 digitimes
Samsung Electronics has significantly improved yields for its latest DRAM technologies used in high-bandwidth memory (HBM), according toIT Chosun, underscoring the intensifying race among memory makers to secure leadership in AI-related...The article requires paid subscription.Subscribe Now
2026-05-18
www.investing.com 2026-05-18 Investing.com
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2026-05-18
digitimes.com 2026-05-18
China's semiconductor equipment localization campaign is entering a more demanding phase, shifting from proving that domestic alternatives can work to showing they can meet the reliability, throughput, and yield requirements of production-scale manufacturing.
2026-05-18
digitimes.com 2026-05-18
Samsung Electronics has significantly improved yields for its latest DRAM technologies used in high-bandwidth memory (HBM), according to IT Chosun, underscoring the intensifying race among memory makers to secure leadership in AI-related semiconductors.