Semiconductor News & Analysis Feed

900 articles
2026-06-11
www.techtimes.com 2026-06-11 Tech Times
By Kyle Belmonte Published: Jun 10 2026, 14:07 PM EDT Share on Facebook Share on Twitter Share on LinkedIn Share on Reddit Share on Flipboard Share on Pocket Vortex VORTEX.CC.GATECH.EDU Georgia Tech released Vortex 3.0 on June 9, 2026, completing what may be the most capable openly synthesizable GPU in existence: a RISC-V-based design that now pairs a full fixed-function 3D graphics pipeline wit
2026-06-11
www.techtimes.com 2026-06-11 Tech Times
By Jerry Owens Published: Jun 10 2026, 13:27 PM EDT Share on Facebook Share on Twitter Share on LinkedIn Share on Reddit Share on Flipboard Share on Pocket The TSMC logo is displayed at the Taiwan Semiconductor Manufacturing Company branch and Innovation Museum, highlighting the company branding and signage inside and outside the site in Hsinchu, Taiwan, January 27, 2026. JIMMY BEUNARDEAU/GETTY I
2026-06-11
eetimes.com 2026-06-11
“We are definitely not an EDA company,” Ricursive co-founders told EE Times.
2026-06-11
news.google.com 2026-06-11 EE Times
2026-06-11
www.tomshardware.com 2026-06-11 Tom's Hardware
PC Components CPUs AMD fires back at Nvidia, claiming 256-core Zen 6 'Venice' CPU beats Vera by 3.3x in rack-level performance — company shares first estimated EPYC Venice benchmarks News By Jake Roach published 4 hours ago Mind the footnotes on this one. (Image credit: AMD) Share this article 2 Join the conversation Follow us Add us as a preferred source on Google Newsletter Subscribe to our n
2026-06-11
www.taipeitimes.com 2026-06-11 Taipei Times
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday reported record revenue of NT$416.975 billion (US$13.17 billion) for last month, putting the world’s largest contract chipmaker on track to set a record for quarterly revenue. Last month’s figure surpassed March’s record NT$415.19 billion and represented increases of 1.5 percent from April and 30.1 percent from a year earlier. For the f
2026-06-10
quantumzeitgeist.com 2026-06-10 Quantum Zeitgeist
HIGH PERFORMANCE COMPUTING, DEEP TECH Multi-Year Cadence Deal Accelerates Intel 14A Time-to-Market June 10, 2026 BY RUSTY FLINT Cadence and Intel Foundry have launched a multi-year collaboration targeting Intel’s 14A process technology, an effort to bolster Intel’s position in advanced chip manufacturing. The expanded cooperation will center on Design Technology Co-Optimization, leveraging Cadenc
2026-06-10
www.phoronix.com 2026-06-10 Phoronix
NVIDIA Engineer Devises Patch To Significantly Reduce GCC Bootstrap Time Written by Michael Larabel in GNU on 10 June 2026 at 09:30 AM EDT. 4 Comments NVIDIA engineer Kyrylo Tkachov posted a patch for testing yesterday to significantly reduce the amount of time it takes the GNU Compiler Collection (GCC) for conducting a native bootstrap. The time spent in the configure process for native GCC build
2026-06-10
www.digitimes.com 2026-06-10 digitimes
Infineon Technologies and Vietnam's VinRobotics have agreed to collaborate on humanoid robots, a move that could shape how future machines are designed, manufactured, and deployed worldwide. The partnership brings together semiconductor expertise and robotics... Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each tim
2026-06-10
www.digitimes.com 2026-06-10 digitimes
Nvidia CEO Jensen Huang's multi-day trip to South Korea put the "triangle relationship" among Samsung Electronics, SK Hynix, and Nvidia over high-bandwidth memory (HBM) in the spotlight, even as he toured AI factories and sealed partnerships in robotics and... Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time
2026-06-10
www.manilatimes.net 2026-06-10 The Manila Times
KYOTO, Japan, June 10, 2026 /PRNewswire/ -- ROHM Co., Ltd. has developed the TSC3PAK (14.00 x 18.58 x 3.50 mm) package for SiC MOSFETs. By adopting a top-side heat dissipation structure that places the heat dissipation surface on the top of the package, the new product enables automated mounting while achieving heat dissipation performance comparable to that of conventional through-hole packages (
2026-06-10
news.google.com 2026-06-10 CNX Software
2026-06-10
news.google.com 2026-06-10 EE Times India
2026-06-10
digitimes.com 2026-06-10
Lens maker Largan Precision held its shareholders' meeting on June 9, where chairman Adam Lin, long known for his terse public remarks, appeared relaxed and offered unusually detailed views on the industry, technology, and Largan's own operations. His comments showed clear optimism toward the company's development of fiber array units (FAUs).
2026-06-10
digitimes.com 2026-06-10
At COMPUTEX 2026, held under the theme "AI Together," a clear shift was visible across the exhibition floor: the focus has moved beyond individual chips and server specifications toward a far more practical challenge — how to rapidly deploy full-scale computing infrastructure under tight constraints of power, time, and construction capacity.
2026-06-10
eetimes.com 2026-06-10
India maps out a bold $150B chip strategy for 2035—see why this time might be different.
2026-06-10
news.google.com 2026-06-10 EE Times
2026-06-10
www.eurasiareview.com 2026-06-10 Eurasia Review
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2026-06-10
www.marketscreener.com 2026-06-10 marketscreener.com
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2026-06-10
finance.yahoo.com 2026-06-10 Yahoo Finance
Elon Musk Says He’s Building a Chip “2 to 3 Times” Better Than NVIDIA at 10% The Cost. Is He Bluffing? David Moadel Tue, June 9, 2026 at 12:30 PM PDT 5 min read NVDA -0.22% INTC -2.13% AAPL -3.64% TSM +0.26% TSLA -3.00% Explore stocks on Coinbase Trading disclosure Quick Read Musk's AI5 chip targets a 50x performance leap over AI4 at 10% of NVIDIA's cost, while NVDA's data center revenue hit $75