Feed Deep Dive Matrix Subscribe About

Semiconductor News & Analysis Feed

138 articles
Trending Companies
NVIDIA798 TSMC261 Intel171 Micron Technology137 AMD127 Broadcom115 SK Hynix113 Micron99 Samsung85 SpaceX74 Google73 Microsoft72 ASML71 Samsung Electronics70 Amazon65
Trending Technologies
EUV581 3nm522 AI259 AI chips218 GPU193 DRAM99 HBM98 AI infrastructure94 semiconductor90 GaN68 data center63 memory chips60 AI accelerators48 semiconductor manufacturing44 CPU44
2026-05-27
Entegris and JSR Corporation/Inpria Corporation Announce Non-Exclusive Cross-Licensing to EUV Lithography - The AI Journal
0.92
aijourn.com 2026-05-27 The AI Journal
BILLERICA, Mass. & TOKYO–(BUSINESS WIRE)–Entegris, Inc. (Nasdaq: ENTG), a global leader in advanced materials and purity solutions for the semiconductor industry, and JSR Corporation, a materials innovation leader and the parent company of Inpria Corporation, today announced entry into a non-exclusive cross-licensing agreement aimed at helping the semiconductor industry advance extreme ultraviolet
EUV LithographySemiconductor MaterialsPhotoresistCross-Licensing AgreementMetal Oxide ResistAdvanced PackagingChip ManufacturingMaterials Innovation
2026-05-27
Entegris and JSR cross-license EUV resist patents for AI-era chips - Stock Titan
0.92
www.stocktitan.net 2026-05-27 Stock Titan
__fail__
2026-05-27
Entegris and JSR Corporation/Inpria Corporation Announce Non-Exclusive Cross-Licensing to EUV Lithography - Business Wire
0.75
news.google.com 2026-05-27 Business Wire
2026-05-26
From Shrinking Transistors to Compressing Time: Deciphering Huawei’s τ Law
0.92
eetimes.com 2026-05-26
Huawei's answer to Moore's Law without EUV promises 14A performance by 2031.
Semiconductor IndustryMoore's LawTime CompressionHuaweiChip DesignLogic FoldingRC DelaySystem Architecture Optimization
2026-05-26
Huawei Announces LogicFolding: 3D Density Without EUV Machines, Targeting 1.4 nm by 2031 - Actu IA
0.92
www.actuia.com 2026-05-26 Actu IA
Artificial intelligence/Huawei Announces LogicFolding: 3D Density Without EUV Machines, Targeting 1.4 nm by 2031 Table of contents A Temporal Scaling Law to Succeed Moore LogicFolding: 3D Against EUV, and Its Shades A 3D Architecture That Isn't Uniquely Huawei's He Tingbo, the Tutelary Figure of HiSilicon On May 25, 2026, He Tingbo, president of Huawei's semiconductor department and board member
HuaweiSemiconductor3D ChipEUV LithographyLogicFoldingMoore's LawChip DesignProcess Node
2026-05-26
ASML’s Balancing Act: Chip Diplomacy Opens Doors as Huawei Maps an EUV-Free Future - AD HOC NEWS
0.92
www.ad-hoc-news.de 2026-05-26 AD HOC NEWS
__fail__
2026-05-26
ASML’s Productivity Leap Reinforces Analyst Faith as Huawei Plots an EUV-Free Path - AD HOC NEWS
0.92
www.ad-hoc-news.de 2026-05-26 AD HOC NEWS
__fail__
2026-05-26
Samsung's silicon photonics push adds new layer to Korea-Dutch chip ties
0.92
digitimes.com 2026-05-26
South Korea and the Netherlands are looking to broaden their semiconductor partnership beyond ASML's EUV lithography machines, as silicon photonics (SiPh) emerges as a potential next field of cooperation amid rising power and bandwidth demands from AI data centers.
2026-05-26
ASML expands Taiwan hiring and operations to meet advanced chip demand
0.95
digitimes.com 2026-05-26
Grace Wang, vice president and general manager of ASML in Taiwan, said that ASML plans to deploy extreme ultraviolet (EUV) and next-generation high numerical aperture (high-NA) EUV technologies to reduce energy consumption per wafer at the process level, while continuing to deepen its presence in Taiwan. The company also plans to hire around 1,000 new employees in Taiwan in 2026 to support custome
2026-05-26
Prohibited by the United States from purchasing EUV lithography machines that make modern chips, Huawei revealed the Tau Law and promises a Kirin 53% denser this fall using a technique that completely dispenses with the technology that China cannot i - CPG Click Petróleo e Gás
0.92
en.clickpetroleoegas.com.br 2026-05-26 CPG Click Petróleo e Gás
4 min of reading 0 comments Prohibited by the United States from purchasing EUV lithography machines that make modern chips, Huawei revealed the Tau Law and promises a Kirin 53% denser this fall using a technique that completely dispenses with the technology that China cannot import. Written by Douglas Avila Published on 25/05/2026 at 17:13 Science and Technology Follow us on Google News Be the
HuaweiSemiconductorChip DesignEUV LithographyTau LawLogic Folding3D StackingChip Density
2026-05-26
ASML's Taiwan Hiring Spree and High-NA EUV Push Give Analyst Targets a Tangible Backing - AD HOC NEWS
0.92
www.ad-hoc-news.de 2026-05-26 AD HOC NEWS
ASMLs, Taiwan ASML's Taiwan Hiring Spree and High-NA EUV Push Give Analyst Targets a Tangible Backing 25.05.2026 - 19:11:47 | boerse-global.de ASML accelerates Taiwan hiring to 1,000 as AI chip demand drives record revenue, stock up 44% YTD, and High-NA EUV lithography moves to volume production. ASML's Taiwan Hiring Spree and High-NA EUV Push Give Analyst Targets a Tangible Backing - Foto: über
ASMLEUV lithographySemiconductor equipmentAI chipsTaiwan hiringHigh-NA EUVChip manufacturingSupply chain
2026-05-25
Huawei claims sanctions-busting breakthrough with 1.4nm-class chips by 2031, claims 55% higher transistor density — firm claims new LogicFolding chip architecture can bypass EUV restrictions, introduces 'Tau Scaling Law' to replace Moore's Law - Tom's Hardware
0.92
www.tomshardware.com 2026-05-25 Tom's Hardware
Tech Industry Manufacturing Semiconductors Huawei claims sanctions-busting breakthrough with 1.4nm-class chips by 2031, claims 55% higher transistor density — firm claims new LogicFolding chip architecture can bypass EUV restrictions, introduces 'Tau Scaling Law' to replace Moore's Law News By Etiido Uko published 11 hours ago Flagship Huawei Mate 90 series will be the first commercial processo
HuaweiSemiconductorChip DesignEUV RestrictionsLogicFolding ArchitectureMoore's LawTau Scaling LawTransistor Density
2026-05-25
EUV: Capturing Critical Points In The Semiconductor Supply Chain (BATS:EUV) - Seeking Alpha
0.85
seekingalpha.com 2026-05-25 Seeking Alpha
__fail__
2026-05-25
imec Unveils Quantum Dot Qubit Device Using High NA EUV Lithography - EE Times India
0.9
news.google.com 2026-05-25 EE Times India
__fail__
2026-05-25
Micron maps out HBM roadmap with 2027 HBM4E debut and custom AI memory designs
0.92
digitimes.com 2026-05-25
Micron Technology said persistent supply constraints and accelerating AI demand are shaping its long-term technology roadmap, with 1-gamma DRAM, G9 NAND, and next-generation HBM products driving growth through 2027. The company is expanding EUV adoption, deepening collaboration with customers and foundry partners, and using multi-year supply agreements to support future capacity investments.
2026-05-25
ASML high-NA EUV lithography machines enter real-world fabs - AD HOC NEWS
0.95
www.ad-hoc-news.de 2026-05-25 AD HOC NEWS
__fail__
2026-05-23
ASML Holding (ENXTAM:ASML) Is Up 7.8% After EUV Demand Surge And High‑NA Momentum - Has The Bull Case Changed? - simplywall.st
0.95
simplywall.st 2026-05-23 simplywall.st
__fail__
2026-05-23
EUV ETF: The Chip-Making Technology Fueling AI - Yahoo Finance
0.95
finance.yahoo.com 2026-05-23 Yahoo Finance
__fail__
2026-05-23
EUV ETF: The Chip-Making Technology Fueling AI - ETF.com
0.92
www.etf.com 2026-05-23 ETF.com
__fail__
2026-05-21
How ASML EUV lithography machines power the AI chip era - AD HOC NEWS
0.95
www.ad-hoc-news.de 2026-05-21 AD HOC NEWS
__fail__