Semiconductor News & Analysis Feed
7439 articles
2026-06-08
futurumgroup.com
2026-06-08
The Futurum Group
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2026-06-08
www.theglobeandmail.com
2026-06-08
The Globe and Mail
Texas Instruments Incorporated’s TXN improving free cash flow generation is strengthening its ability to reward shareholders through dividends and share repurchases. After several years of heavy manufacturing investments, the company is beginning to see stronger cash generation as revenue growth returns and capital spending moderates.
2026-06-08
www.fierce-network.com
2026-06-08
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SK Telecom plans to use Nvidia's DSX platform for its AI Cloud
By Fierce Network Newsroom Jun 8, 2026 9:41am
SK Telecom Nvidia artificial intelligence (AI) data centers
SK Telecom plans to build a gigawatt-scale AI Cloud
2026-06-08
www.phoronix.com
2026-06-08
Phoronix
Linux 7.2 To Add ACPI CPPC v4 Support Authored By NVIDIA
Written by Michael Larabel in NVIDIA on 8 June 2026 at 09:41 AM EDT. 4 Comments
Ahead of NVIDIA Vera ramping up, the upcoming Linux 7.2 kernel is adding the ACPI CPPC v4 support authored by a NVIDIA engineer.
Linux 7.2 is poised to introduce support for ACPI's version 4 standard of the Collaborative Processor Performance Control interface.
2026-06-08
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2026-06-08
Tom's Hardware
2026-06-08
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2026-06-08
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2026-06-08
nasilemaktech.com
2026-06-08
Nasi Lemak Tech
nasilemaktech.com
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2026-06-08
www.tech-critter.com
2026-06-08
Tech Critter
Cadence has recently worked out a new deal with Samsung Foundry that pushes their existing partnership to a new high, as they focus on 2nm chip design for AI-heavy workloads, starting from concept to deliverable products, especially as designs get more complex with AI, HPC, and 3D-IC integration.
For Cadence, they are expanding their Memory and Interface IP portfolio on Samsung’s second-generatio
2026-06-08
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2026-06-08
Syracuse.com
2026-06-08
www.indexbox.io
2026-06-08
IndexBox
Europe's semiconductor strategy is undergoing a quiet but significant reversal. After years of focusing on manufacturing capacity and supply-chain resilience, a new industry blueprint argues that Europe started in the wrong place. The next phase of policy must focus less on fabs and more on the conditions that create them: chip design, startup scale, local demand, and faster execution.
2026-06-08
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2026-06-08
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2026-06-08
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2026-06-08
Electronics360
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2026-06-08
eetimes.com
2026-06-08
Spain is emerging as a more influential player in Europe’s next chip debate—through design startups, photonics, quantum technologies, and a growing talent base.
2026-06-08
finance.yahoo.com
2026-06-08
Yahoo Finance
EXCLUSIVE: HUHUTECH Launches HB-800 Vacuum Furnace for Semiconductor Market
Lekha Gupta
Mon, June 8, 2026 at 5:01 AM PDT 2 min read
HUHU
0.00%
Trade HUHU on Coinbase
Trading disclosure
HUHUTECH International Group Inc. (NASDAQ:HUHU) on Monday disclosed that its subsidiary, Tiger Technology, completed the independent development and commercialization of the HB-800.
It is a high-end vacuum furnace
2026-06-08
seekingalpha.com
2026-06-08
Seeking Alpha
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2026-06-08
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2026-06-08
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Samsung, Nvidia Discuss Next-Generation HBM Cooperation
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June 8, 2026
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Photo: newsimg.koreatimes.co.kr · rights & takedowns
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The head of Samsung Electronics' memory business met Monday with Nvidia CEO Jensen Huang to discuss
2026-06-08
www.koreatimes.co.kr
2026-06-08
The Korea Times
Jun Young-hyun, right, head of Samsung Electronics' device solutions division, poses with Jensen Huang, CEO of Nvidia, at a hotel in Seoul, Monday. Courtesy of Samsung Electronics
The head of Samsung Electronics' memory business said Monday he met with Nvidia CEO Jensen Huang and discussed long-term cooperation in next-generation high-bandwidth memory (HBM) products.
Jun Young-hyun, who leads Sa
2026-06-08
www.koreatimes.co.kr
2026-06-08
The Korea Times
Jun Young-hyun, right, head of Samsung Electronics' device solutions division, poses with Jensen Huang, CEO of Nvidia, at a hotel in Seoul, Monday. Courtesy of Samsung Electronics
The head of Samsung Electronics' memory business said Monday he met with Nvidia CEO Jensen Huang and discussed long-term cooperation in next-generation high-bandwidth memory (HBM) products.
Jun Young-hyun, who leads Sa
2026-06-08
www.cnbc.com
2026-06-08
CNBC
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