Semiconductor News & Analysis Feed
7719 articles
2026-05-26
www.fool.com
2026-05-26
The Motley Fool
Nvidia (
NVDA
1.86%
) has been one of the biggest beneficiaries of the artificial intelligence (AI) boom. Shares have already soared by more than 1,300% in the past five years. However, the next big AI stock gains may come from less obvious players.
Image source: Getty Images.
As AI infrastructure spending expands, demand is rising not just for AI chips but also for high-speed connectivity techn
2026-05-26
www.digitimes.com
2026-05-26
digitimes
Grace Wang, vice president and general manager of ASML in Taiwan, said that ASML plans to deploy extreme ultraviolet (EUV) and next-generation high numerical aperture (high-NA) EUV technologies to reduce energy consumption per wafer at the process level,...
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2026-05-26
www.digitimes.com
2026-05-26
digitimes
Heat management has become a critical challenge as HBM technology advances, with higher stacking and faster speeds to meet surging global demand for AI data processing. Efficient control of power density in the die-to-die physical layer between HBM and GPUs...
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2026-05-26
www.businesskorea.co.kr
2026-05-26
Businesskorea
The Company Says iHBM Cuts Thermal Resistance By Over 30%
SK Hynix unveiled its ‘iHBM’ technology on May 26, which significantly reduces heat generation by integrating a unified cooling element within the HBM package. (Photo source: SK Hynix)
SK Hynix has made a bold bet on solving the heat problem, which has emerged as the biggest challenge of the artificial intelligence (AI) semiconductor era
2026-05-26
www.cnbc.com
2026-05-26
CNBC
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2026-05-26
www.tradingview.com
2026-05-26
TradingView
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2026-05-26
www.prnewswire.com
2026-05-26
PR Newswire
AIC to Showcase Next-Generation AI Infrastructure and Host Strategic Panel with NVIDIA and VAST Data at COMPUTEX 2026 Deutschland - English
VOM NACHRICHTENDIENST
AIC
26 Mai, 2026, 02:18 GMT
ARTIKEL TEILEN
TAIPEI, May 26, 2026 /PRNewswire/ -- AIC, a leading provider of AI storage and computing solutions, is proud to announce its participation in COMPUTEX 2026. From June 2 to June 5, AIC
2026-05-26
finance.yahoo.com
2026-05-26
Yahoo Finance
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2026-05-26
www.digitimes.com
2026-05-26
digitimes
As Micron Technology's decision to restart large-scale DDR4 production in the US grabs global attention, memory-chip executives and analysts say the move is less a revival of aging technology than a strategic reshuffling of supply aimed at safeguarding...
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2026-05-26
www.asiae.co.kr
2026-05-26
아시아경제
Equipped with Cooling Component (ICE) Inside HBM Package
Over 30% Reduction in Thermal Resistance
Proven MR-MUF Process Applied
Amid the artificial intelligence (AI) boom, a game-changer has emerged to tackle the biggest challenge in semiconductor high-density integration: the 'heat generation' issue.
On May 26, SK hynix unveiled its next-generation memory technology, 'iHBM,' which maximize
2026-05-26
www.asiae.co.kr
2026-05-26
아시아경제
Equipped with Cooling Component (ICE) Inside HBM Package
Over 30% Reduction in Thermal Resistance
Proven MR-MUF Process Applied
Amid the artificial intelligence (AI) boom, a game-changer has emerged to tackle the biggest challenge in semiconductor high-density integration: the 'heat generation' issue.
On May 26, SK hynix unveiled its next-generation memory technology, 'iHBM,' which maximize
2026-05-26
simplywall.st
2026-05-26
simplywall.st
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2026-05-26
www.thefastmode.com
2026-05-26
The Fast Mode
Stellantis and Qualcomm Technologies announced an expansion of their multi-year technology collaboration to power next-generation Stellantis vehicles with Qualcomm Technologies’ Snapdragon® Digital Chassis™ system-on-chips (SoCs).
The expanded collaboration integrates Snapdragon Digital Chassis solutions with STLA Brain, Stellantis’ electronic and software platform, enhancing cockpit, connectivit
2026-05-26
www.thefastmode.com
2026-05-26
The Fast Mode
Dell Technologies introduces Dell Deskside Agentic AI, a new addition to the Dell AI Factory with NVIDIA that gives workgroups the ability to deploy and scale agentic AI workflows locally without the cost, latency and data sovereignty constraints of cloud-only approaches.
With the NVIDIA OpenShell runtime now supported across the entire Dell AI Factory with NVIDIA, enterprises benefit from a sin
2026-05-26
www.ad-hoc-news.de
2026-05-26
AD HOC NEWS
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2026-05-26
technode.global
2026-05-26
TNGlobal
SK hynix unveils ‘iHBM’ thermal solution to boost AI performance
MAY 26, 2026|BY LIUTENG
Enhances heat dissipation by integrating ICEs into the HBM package
Reduces thermal resistance by 30%, ensuring stable chip operation in demanding high-temperature and high-pressure environments
Lowers barriers to adoption by leveraging market-proven MR–MUF technology, featuring high design compatibility
SEOUL
2026-05-26
www.techpowerup.com
2026-05-26
TechPowerUp
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2026-05-26
biz.chosun.com
2026-05-26
Chosunbiz
By
Hwang Min-gyu
Published 2026.05.26. 09:13
A concept diagram of iHBM technology released by SK hynix. /Courtesy of SK hynix
SK hynix unveiled next-generation technology that reduces heat by inserting a cooling element inside a high bandwidth memory (HBM) package.
On the 26th, SK hynix said it introduced "iHBM," a technology that embeds an integrated cooling element, ICE, in an HBM package. IC
2026-05-26
digitimes.com
2026-05-26
South Korea and the Netherlands are looking to broaden their semiconductor partnership beyond ASML's EUV lithography machines, as silicon photonics (SiPh) emerges as a potential next field of cooperation amid rising power and bandwidth demands from AI data centers.
2026-05-26
digitimes.com
2026-05-26
Kioxia is targeting 2027 production of its 10th-generation BiCS 10 NAND, a move that could help the Japanese memory maker narrow its technology gap with Samsung Electronics and SK Hynix as the South Korean rivals delay investment in their own next-generation NAND technologies, according to ZDNet Korea.