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The U.S. Defense Advanced Research Projects Agency (DARPA) has advanced its THREADS program to Phase II, aiming to significantly improve RF device power density and thermal management. Led by BAE Systems' FAST Labs, the initiative targets a fivefold increase in power density and an eightfold reducti

GaN RF Power Density DARPA Program Thermal Management Semiconductor Materials Military Radar Power Amplifier Chip Manufacturing Heat Dissipation

Applied Materials Raises Advanced Packaging Growth Outlook to Over 70% - xenospectrum.com

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news.google.com 2026-08-14

TSMC's 5.5x CoWoS Hits 98%+ Yield, Shifting Constraints to Memory and ABF - XenoSpectrum

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xenospectrum.com 2026-08-12

The Interconnect Wall That 2nm Alone Can't Clear: MediaTek Develops 448G SerDes - XenoSpectrum

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xenospectrum.com 2026-08-03

TSMC Reportedly Developing Advanced Packaging Technology Similar to Intel's EMIB — How Does It Differ from CoWoS-L? - XenoSpectrum

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xenospectrum.com 2026-07-31

Taiwan Semiconductor Manufacturing Company (TSMC) is reportedly developing an advanced packaging technology similar to Intel's Embedded Multi-die Interconnect Bridge (EMIB), according to The Information, which cited two sources familiar with the project. The collaboration involves substrate maker Ki

TSMC Intel EMIB CoWoS-L Advanced Packaging Silicon Bridge Chip Manufacturing Semiconductor Process

Eliyan Raises $145 Million, Extends Chiplet Connectivity Toward Rack-to-Rack Optical Links - xenospectrum.com

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xenospectrum.com 2026-07-30

SK hynix Posts Record Profit Yet Misses Forecasts by 5%, as HBM and Commodity DRAM Profitability Reverses - XenoSpectrum

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xenospectrum.com 2026-07-29

SK Hynix posted record profits in Q3 2024 but slightly missed forecasts, highlighting the complex market dynamics in the semiconductor industry. While the company achieved historical peak net income, demonstrating strong profitability in memory products, the profitability of HBM and commodity DRAM h

Semiconductor DRAM Memory SK Hynix HBM Profit Financial Results Storage Chips

TSMC's 2nm: Fab 20 Reportedly Reaches 20,000 Wafers per Month—Sharp Ramp-Up from 3% Revenue Share - XenoSpectrum

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news.google.com 2026-07-28

Navitas and Magnachip: Beyond-3.3kV SiC Bound for Korean Fab, With Plans for In-House Technology Transfer - XenoSpectrum

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news.google.com 2026-07-28

Etched Raises $300M and Begins Initial Production, With SK hynix Joining as an Investor - XenoSpectrum

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xenospectrum.com 2026-07-25

Etched's $300M funding round and initial production launch represent a significant milestone in the semiconductor manufacturing sector. The company's ability to secure substantial investment from prominent players like SK hynix demonstrates strong market confidence in its technological capabilities

Semiconductor Manufacturing Chip Production Funding Round Memory Chips Semiconductor Equipment Technology Breakthrough Investment Financing Wafer Fabrication

Cadence's Two 2026 Bets on Leading-Edge Node Challengers: The Design Networks of Rapidus and Intel Foundry - XenoSpectrum

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xenospectrum.com 2026-07-23

Intel's EUV Production Process Goes External, Fortinet's "SP6" Becomes First Publicly Disclosed Case - XenoSpectrum

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xenospectrum.com 2026-07-22

Intel's shift toward external EUV production marks a significant strategic realignment in the semiconductor industry. The disclosure of Fortinet's SP6 security chip as the first publicly announced EUV product demonstrates how advanced manufacturing is being outsourced, fundamentally altering the sem

Semiconductor Manufacturing EUV Lithography Intel Cybersecurity Chip Process External Foundry Fortinet Photolithography

ZEISS Points to China's EUV Gap: Why Mass Production Grows More Complex Beyond 7nm - XenoSpectrum

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xenospectrum.com 2026-07-22

Zeiss has highlighted China's significant gap in advanced EUV lithography technology, which becomes increasingly pronounced beyond the 7nm process node. As semiconductor manufacturing advances to smaller process nodes, production complexity intensifies across multiple dimensions including technical

EUV Lithography Semiconductor Manufacturing Chip Process Chinese Semiconductor Zeiss 7nm Process Photolithography Semiconductor Equipment

Kioxia Hit With $229 Million Verdict as Samsung's HBM Faces Second US ITC Investigation - XenoSpectrum

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xenospectrum.com 2026-07-17

Kioxia Hit With $229 Million Verdict as Samsung's HBM Faces Second US ITC Investigation - XenoSpectrum

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xenospectrum.com 2026-07-17

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