Semiconductor News & Analysis Feed
314 articles
2026-05-29
digitimes.com
2026-05-29
Cloud service providers' demand for application-specific integrated circuits, or ASICs, is increasingly locked in as advanced process nodes, advanced packaging, and component supply tighten worldwide. For readers across global tech markets, the shift means access to manufacturing capacity, not just chip design, is becoming the main determinant of who can supply the next wave of AI hardware.
2026-05-29
digitimes.com
2026-05-29
Intel is reportedly making a major push into advanced semiconductor packaging as it seeks to strengthen its foundry business and expand capacity for its Embedded Multi-die Interconnect Bridge (EMIB) technology, according to ETNews.
2026-05-29
digitimes.com
2026-05-29
AI demand for high-performance chips is driving up orders for semiconductor silicon capacitors, or Si-Caps, with Samsung Electro-Mechanics and several Taiwanese memory makers emerging as key names to watch. Supply-chain sources say the shift could reshape who captures future demand for advanced packaging.
2026-05-29
digitimes.com
2026-05-29
Generative AI, HPC, and large data centers are raising demand for chips with higher power efficiency, stronger thermal control, and denser packaging, making advanced packaging a more strategic part of the semiconductor supply chain. In China, panel-level packaging (PLP) is gaining traction for its larger format, higher output, and lower-cost potential.
2026-05-29
digitimes.com
2026-05-29
Foxconn chairman Young Liu said the company is preparing to break ground on its advanced packaging plant in France while continuing to explore sovereign-AI opportunities in Africa, as the electronics manufacturer looks beyond AI servers for its next phase of growth.
2026-05-29
www.technetbooks.com
2026-05-29
Technetbook
Home News
Intel Fellow Ravi Mahajan on how EMIB and Advanced Packaging Drive Modern AI Computing
Intel Foundry Advanced Packaging Evolution and EMIB Development for Artificial Intelligence Workloads and Future Semiconductor Architecture Solutions
The semiconductor industry is at a turning point where shrinking transistors is no longer sufficient to support the massive computational power needed
2026-05-28
www.tradingview.com
2026-05-28
TradingView
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2026-05-28
news.google.com
2026-05-28
Business Wire
2026-05-28
finance.yahoo.com
2026-05-28
Yahoo Finance
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2026-05-28
www.indexbox.io
2026-05-28
IndexBox
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2026-05-28
evertiq.com
2026-05-28
Evertiq
© Amkor
Business | May 28, 2026
Amkor acquires additional land in Arizona to expand advanced packaging campus
Evertiq
US semiconductor packaging and test provider Amkor Technology has secured an additional 67-acre parcel of land adjacent to its existing campus in Peoria, Arizona, expanding its footprint for future advanced packaging and test capacity.
The acquisition adds to Amkor's existing 104-
2026-05-28
digitimes.com
2026-05-28
UMC held its shareholders' meeting on May 27, with CEO Jason Wang saying that as AI applications expand rapidly, long-term semiconductor demand still has room for growth. In addition to deepening its strengths in mature and specialty processes, UMC is also advancing next-generation technologies, including a US-based 12nm FinFET platform, advanced packaging, and silicon photonics, to prepare for fu
2026-05-27
en.sedaily.com
2026-05-27
Seoul Economic Daily
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2026-05-27
www.aastocks.com
2026-05-27
AASTOCKS.com
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<Research> Citi: "Tao's Law" Signals Shift Toward Chip/Circuit/System Design Innovation; Advanced Packaging Players Such as ASMPT (00522.HK) Expected to Benefit
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2026/05/27 13:44 CST
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2026-05-27
www.aastocks.com
2026-05-27
AASTOCKS.com
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2026-05-27
www.theworldfolio.com
2026-05-27
The Worldfolio
As global supply chains are reshaped by geopolitical tensions and manufacturing shifts, Sanritsu Corporation is enhancing precision logistics through advanced packaging technologies, ensuring the safe transport of high-value components that underpin critical industries worldwide.
To begin, we would like to discuss the broader global and macroeconomic environment. In recent years, geopolitical ten
2026-05-27
digitimes.com
2026-05-27
Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking, optical interconnects, and system-level architecture design.
2026-05-27
www.digitimes.com
2026-05-27
digitimes
Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking, optical interconnects, and system-level architecture design.
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2026-05-26
www.joplinglobe.com
2026-05-26
The Joplin Globe
TOKYO & NORTH KINGSTOWN, R.I.--(BUSINESS WIRE)--May 26, 2026--
FUJIFILM Corporation announced today that it will present new semiconductor packaging research findings and exhibit its ZEMATES 1 product line of photosensitive insulating materials, including PFAS-free 2 PBO, at the Electronic Components and Technology Conference 2026 (ECTC 2026), May 26–29, 2026, in Orlando, Florida.
As part of the
2026-05-26
sg.finance.yahoo.com
2026-05-26
Yahoo Finance Singapore
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